Semiconductor device and electric power control apparatus

US9621151B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9621151-B2
Application numberUS-201615157040-A
CountryUS
Kind codeB2
Filing dateMay 17, 2016
Priority dateJul 15, 2015
Publication dateApr 11, 2017
Grant dateApr 11, 2017

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A driver IC includes a ring-shaped termination area, and a first area and a second area that are respectively arranged outside and inside the termination area on a layout. A sense MOS that is arranged between floating terminal and a first sense node and is driven at a power supply voltage is formed in the termination area. A fault detection circuit that detects presence of a fault when a voltage of the first sense node is higher than a decision voltage that has been deteLutined in advance in a period of time that a low side driver is driving a low side transistor into an ON state is formed in the first area.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor device that includes a floating terminal to be coupled to a floating voltage source, a termination area having a ring-like shape, a first area that is provided outside the termination area and that a circuit configured to operate at a first power supply voltage on the basis of a reference voltage is formed, a second area that is provided inside the termination area and that a circuit configured to operate at a second power supply voltage on the basis of the floating voltage is formed and that is configured by one semiconductor chip, comprising: a low side driver that is formed in the first area and drives a low side transistor that is provided outside the semiconductor device; a high side driver that is formed in the second area and drives a high side transistor that is provided outside the semiconductor device; a level shift circuit that converts a signal that has been generated in the first area and is based on the reference voltage into a signal that is based on the floating voltage and outputs the signal so converted to the second area; s first transistor that is formed in the termination area, is arranged between the floating terminal and a first sense node, and is driven at the first power supply voltage; and a fault detection circuit that is formed in the first area and detects presence of a fault when a voltage of the first sense node is higher than a first decision voltage that has been determined in advance in a period of time that the low side driver is driving the low side transistor into an ON state. 2. The semiconductor device according to claim 1 , wherein the first transistor is a depletion type transistor. 3. The semiconductor device according to claim 1 , wherein the fault detection circuit includes a filter circuit that smooths out the voltage of the first sense node by using a resistor and a capacitor, and a first comparator circuit that compares an output voltage of the filter circuit with the first decision voltage. 4. The semiconductor device according to claim 1 , wherein the fault detection circuit further detects the presence of the fault when the voltage of the first sense node is lower than a second decision voltage that has been determined in advance in a period of time that the low side driver is driving the low side transistor into an OFF state and the high side driver is driving the high side transistor into the ON state respectively. 5. The semiconductor device according to claim 1 , further comprising: a first power supply terminal to be coupled to the first power supply voltage source; a second power supply terminal to be coupled to the second power supply voltage source; a second transistor that is formed in the termination area and is arranged between the first power supply terminal and the second power supply terminal; a third transistor that is formed in the termination area, is arranged between the second power supply teLminal and a second sense node, and is driven at the first power supply voltage; and a second comparator circuit that is formed in the first area, drives the second transistor into the ON state when a voltage of the second sense node is lower than the first power supply voltage, and drives the second transistor into an OFF state when the voltage of the second sense node is higher than the first power supply voltage, wherein the second transistor charges a capacitor that is arranged between the second power supply terminal and the floating terminal outside the semiconductor device, and wherein the third transistor is a depletion type transistor. 6. The semiconductor device according to claim 5 , wherein the level shift circuit includes a fourth transistor and a fifth transistor fol,hed in the teruination area, wherein the termination area includes three sections obtained by almost equally dividing the ring into three parts in all orbiting direction of the ring with a gate width of each transistor being set in the orbiting direction of the ring, and wherein the first transistor, the fourth transistor and the fifth transistor are respectively formed in partial sections in the mutually different sections in the three sections. 7. The semiconductor device according to claim 6 , wherein the fourth transistor and the fifth transistor are arranged at a first interval in the orbiting direction of the ring, wherein the first transistor and the fourth transistor are arranged at a second interval that is larger than the first interval in the orbiting direction of the ring, wherein the first transistor and the fifth transistor are arranged at a third interval that is equivalent to the second interval in the orbiting direction of the ring, wherein the second transistor is arranged in each of an area corresponding to the second interval and an area corresponding to the third interval, and wherein the third transistor is arranged in an area corresponding to the first interval. 8. An electric power control apparatus, comprising: a reference tel.Lainal to be coupled to a reference voltage source; a first power supply terminal to be coupled to a first power supply voltage source; a second power supply terminal to be coupled to a second power supply voltage source; a third power supply terminal to be coupled to a third power supply voltage source having a voltage value that is higher than that of the first power supply voltage; a load drive terminal; a high side transistor that is arranged between the third power supply terminal and the load drive terminal; a low side transistor that is arranged between the load drive terminal and the reference terminal; and a semiconductor chip that drives the high side transistor and the low side transistor, and configured by one package wherein the semiconductor chip includes a termination area having a ring-like shape, a first area that is provided outside the termination area and that a circuit configured to operate at the first power supply voltage on the basis of the reference voltage is formed, second area that is provided inside the termination area and that a circuit configured to operate at the second power supply voltage on the basis of a voltage of the load drive terminal is formed, and wherein the semiconductor chip further includes a low side driver that is formed in the first area and drives the low side transistor, a high side driver that is foimed in the second area and drives the high side transistor, a level shift circuit that converts a signal that has been generated in the first area and is based on the reference voltage into a signal that is based on the voltage of the load drive teLminal and outputs the signal so converted to the second area, a first transistor that is formed in the termination area, is arranged between the load drive terminal and a first sense node, and is driven at the first power supply voltage, and a fault detection circuit that is formed in the first area and detects presence of a fault when a voltage of the first sense node is higher than a first decision voltage that has been dete mined in advance in a period of time that the low side driver is driving the low side transistor into an ON state. 9. The electric power control apparatus according to claim 8 , wherein the first transistor is a depletion type transistor. 10. The electric power control apparatus according to claim 8 , wherein the fault detection circuit includes a filter circuit that smooths out the voltage of the first sense node by using a resistor and a capacitor, and a first comparator circuit that compares an output voltage of the filter circuit with the first decision voltage. 11. The electric pow

Assignees

Inventors

Classifications

  • between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

  • between laterally-adjacent chips · CPC title

  • changes in structures or sizes · CPC title

  • Plan-view shape, i.e. in top view · CPC title

  • Multiple bond pads having different sizes · CPC title

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Frequently asked questions

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What does patent US9621151B2 cover?
A driver IC includes a ring-shaped termination area, and a first area and a second area that are respectively arranged outside and inside the termination area on a layout. A sense MOS that is arranged between floating terminal and a first sense node and is driven at a power supply voltage is formed in the termination area. A fault detection circuit that detects presence of a fault when a voltag…
Who is the assignee on this patent?
Renesas Electronics Corp
What technology area does this patent fall under?
Primary CPC classification H03K17/0822. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 11 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).