Power amplifier bias signal multiplexing

US9621119B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9621119-B2
Application numberUS-201615018145-A
CountryUS
Kind codeB2
Filing dateFeb 8, 2016
Priority dateFeb 13, 2015
Publication dateApr 11, 2017
Grant dateApr 11, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A power amplifier (PA) system includes an amplifying transistor having a base, a collector, and an emitter. The PA system further includes a radio-frequency (RF) input configured to receive an RF input signal having an RF component and a DC bias component, a bias circuit coupled to the base of the amplifying transistor, and a bias tee circuit configured to receive the RF input signal and pass at least a portion of the DC component to the bias circuit and at least a portion of the RF component to the base of the amplifying transistor.

First claim

Opening claim text (preview).

What is claimed is: 1. A power amplifier system comprising: an amplifying transistor having a base, a collector, and an emitter; a radio-frequency input configured to receive a radio-frequency input signal having a radio-frequency component and a DC bias component; a bias circuit coupled to the base of the amplifying transistor; and a bias tee circuit configured to receive the radio-frequency input signal and pass at least a portion of the DC component to the bias circuit and at least a portion of the radio-frequency component to the base of the amplifying transistor. 2. The power amplifier system of claim 1 wherein the bias tee circuit operates to at least partially decouple the radio-frequency component from the DC bias component. 3. The power amplifier system of claim 1 wherein the bias tee includes an inductor and a resistor. 4. The power amplifier system of claim 1 further comprising a voltage supply input configured to receive a supply voltage for amplifying an output of the amplifying transistor. 5. The power amplifier system of claim 1 wherein the DC bias component of the radio-frequency input signal includes a bias current. 6. The power amplifier system of claim 1 wherein the DC bias component of the radio-frequency input signal includes a bias voltage. 7. The power amplifier system of claim 1 wherein the bias circuit includes current mirror circuitry. 8. A method for biasing a power amplifier, the method comprising: providing a radio-frequency input signal to a power amplifier module, the radio-frequency input signal having a radio-frequency component and a DC bias component; decoupling the DC bias component of the radio-frequency input signal from the radio-frequency component; providing the decoupled DC bias component to a bias circuit coupled to a base of an amplifying transistor of the power amplifier module; providing the decoupled radio-frequency component to the base of the amplifying transistor; and generating a radio-frequency output signal using the amplifying transistor. 9. The method of claim 8 wherein said decoupling the DC bias component from the radio-frequency component is performed using a bias tee including an inductor and a resistor. 10. The method of claim 8 further comprising providing a supply voltage to the amplifying transistor. 11. The method of claim 8 wherein the DC bias component of the radio-frequency input signal includes a bias current. 12. The method of claim 8 wherein the DC bias component of the radio-frequency input signal includes a bias voltage. 13. The method of claim 8 wherein the bias circuit includes current mirror circuitry. 14. A radio-frequency module comprising: a packaging substrate configured to receive a plurality of components; a power amplifier die mounted on the packaging substrate, the power amplifier die including a first semiconductor substrate having formed thereon an amplifying transistor having a base, a collector, and an emitter; a radio-frequency input to the power amplifier die configured to receive a radio-frequency input signal having a radio-frequency component and a DC bias component; a bias circuit implemented on the first semiconductor substrate, the bias circuit coupled to the base of the amplifying transistor; a first bias tee circuit implemented on the first semiconductor substrate, the first bias tee circuit configured to receive the radio-frequency input signal and at least partially pass the DC bias component to the bias circuit and the radio-frequency component to the base of the amplifying transistor; and a plurality of connectors configured to provide electrical connections between the power amplifier die and the packaging substrate. 15. The radio-frequency module of claim 14 further comprising: a controller die mounted on the packaging substrate, the controller die including a second semiconductor substrate and a bias signal generator configured to transmit a bias signal on a bias channel of the radio-frequency module; and a radio-frequency transmission channel configured to transmit a radio-frequency signal within the radio-frequency module. 16. The RF module of claim 15 further comprising: a second bias tee circuit coupled to the bias channel and the radio-frequency transmission channel, the second bias tee circuit configured to couple the bias signal with the radio-frequency signal to form the radio-frequency input signal at least in part. 17. The radio-frequency module of claim 15 wherein the bias signal generator is a current generator. 18. The radio-frequency module of claim 15 wherein the bias signal generator is a voltage generator. 19. The radio-frequency module of claim 15 wherein the controller die includes an input switching module implemented on the second semiconductor substrate. 20. The radio-frequency module of claim 15 wherein the first semiconductor substrate is a GaAs substrate and the second semiconductor substrate is a silicon-on-insulator die.

Assignees

Inventors

Classifications

  • in integrated circuits · CPC title

  • H03F3/211Primary

    using a combination of several amplifiers (H03F3/60 takes precedence) · CPC title

  • with semiconductor devices only · CPC title

  • Gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal · CPC title

  • the amplifier being a dual or triple band amplifier, e.g. 900 and 1800 MHz, e.g. switched or not switched, simultaneously or not · CPC title

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What does patent US9621119B2 cover?
A power amplifier (PA) system includes an amplifying transistor having a base, a collector, and an emitter. The PA system further includes a radio-frequency (RF) input configured to receive an RF input signal having an RF component and a DC bias component, a bias circuit coupled to the base of the amplifying transistor, and a bias tee circuit configured to receive the RF input signal and pass a…
Who is the assignee on this patent?
Skyworks Solutions Inc
What technology area does this patent fall under?
Primary CPC classification H03F3/211. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 11 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).