Manufacturing method for thermoelectric conversion device

Patent metadata

Field	Value
Publication number	US-9620699-B2
Application number	US-201414763147-A
Country	US
Kind code	B2
Filing date	Jan 23, 2014
Priority date	Jan 24, 2013
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate, and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.

First claim

What is claimed is:

1. A manufacturing method for a thermoelectric conversion device comprising:
a step of preparing an insulating substrate that is configured to contain a thermoplastic resin, in which a plurality of via holes that penetrate in a thickness direction are formed, and the via holes are filled with a conductive paste that is produced by adding an organic solvent to a powder of an alloy in which a plurality of metal atoms retain a predetermined crystalline structure, and by processing the powder of the alloy into a paste;
a step of solid-phase sintering the conductive paste and forming interlayer connecting members by pressing the insulating substrate from a front surface of the insulating substrate and a back surface on a side opposite to that of the front surface, while heating;
a step of forming a laminate by disposing a front surface protective member having front surface patterns that come into contact with predetermined interlayer connecting members on the front surface of the insulating substrate and disposing a back surface protective member having back surface patterns that come into contact with predetermined interlayer connecting members on the back surface of the insulating substrate; and
a step of integrating the laminate while electrically connecting the interlayer connecting members to the front surface patterns and the back surface patterns, by pressing the laminate from the lamination direction while heating, wherein
in the step of integrating the laminate, a lower pressurizing force is applied while heating at a lower temperature, compared to the temperature and pressurizing force in the step of forming the interlayer connecting members.

2. The manufacturing method for a thermoelectric conversion device according to claim 1 , wherein:
portions of the interlayer connecting members are exposed from the insulating substrate; and
a plating film is formed in the portions of the interlayer connecting members that are exposed from the insulating substrate, after the step of forming the interlayer connecting members and before the step of forming the laminate.

3. The manufacturing method for a thermoelectric conversion device according to claim 1 , wherein:
pores are formed within the insulating substrate before the step of forming the interlayer connecting members; and
in the step of forming the interlayer connecting members, the interlayer connecting members are formed by solid-phase sintering the conductive paste, while making the thermoplastic resin flow into the pores.

4. The manufacturing method for a thermoelectric conversion device according to claim 3 , wherein:
through holes are formed in the insulating substrate before the step of forming the interlayer connecting members.

5. The manufacturing method for a thermoelectric conversion device according to claim 4 , wherein:
in the step of forming the through holes, a plurality of through holes are formed around each via hole so as to be concentric and separated from each other at an even interval in a circumferential direction.

6. The manufacturing method for a thermoelectric conversion device according to claim 3 , wherein:
frame-shaped groove portions are formed so that the via holes are positioned one in each frame of the groove portions, before the step of forming the interlayer connecting members.

7. The manufacturing method for a thermoelectric conversion device according to claim 1 , wherein:
the insulating substrate further contains a porous member.

8. The manufacturing method for a thermoelectric conversion device according to claim 1 , wherein:
in the step of forming the interlayer connecting members, a pair of press plates in which recessing portions are formed in portions differing from the portions that come into contact with the conductive paste is prepared, and the interlayer connecting members are formed by solid-phase sintering the conductive paste while making the thermoplastic resin flow into the recessing portions.

9. The manufacturing method for a thermoelectric conversion device according to claim 2 , wherein:
pores are formed within the insulating substrate before the step of forming the interlayer connecting members; and
in the step of forming the interlayer connecting members, the interlayer connecting members are formed by solid-phase sintering the conductive paste, while making the thermoplastic resin flow into the pores.

10. The manufacturing method for a thermoelectric conversion device according to claim 9 , wherein:
through holes are formed in the insulating substrate before the step of forming the interlayer connecting members.

11. The manufacturing method for a thermoelectric conversion device according to claim 10 , wherein:
in the step of forming the through holes, a plurality of through holes are formed around each via hole so as to be concentric and separated from each other at an even interval in a circumferential direction.

12. The manufacturing method for a thermoelectric conversion device according to claim 9 , wherein:
frame-shaped groove portions are formed so that the via holes are positioned one in each frame of the groove portions, before the step of forming the interlayer connecting members.

13. The manufacturing method for a thermoelectric conversion device according to claim 2 , wherein:
the insulating substrate further contains a porous member.

14. The manufacturing method for a thermoelectric conversion device according to claim 2 , wherein:
in the step of forming the interlayer connecting members, a pair of press plates in which recessing portions are formed in portions differing from the portions that come into contact with the conductive paste is prepared, and the interlayer connecting members are formed by solid-phase sintering the conductive paste while making the thermoplastic resin flow into the recessing portions.

Assignees

• Denso Corp

Inventors

• Miyagawa Eijirou
• Saitou Keita
• Shiraishi Yoshihiko
• Yazaki Yoshitaro
• Taniguchi Toshihisa
• Sakaida Atusi

Classifications

• H01L35/08

  Electricity · mapped topic

• H01L35/32 Primary

  Electricity · mapped topic

• H01L35/34

  Electricity · mapped topic

• H10N10/817 Primary

  the junction being non-separable, e.g. being cemented, sintered or soldered · CPC title

• H10N10/17 Primary

  characterised by the structure or configuration of the cell or thermocouple forming the device · CPC title