Apparatus and electronic devices including transistors comprising two-dimensional materials
US-2024339543-A1 · Oct 10, 2024 · US
US9620665B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9620665-B1 |
| Application number | US-201615184008-A |
| Country | US |
| Kind code | B1 |
| Filing date | Jun 16, 2016 |
| Priority date | Jun 17, 2015 |
| Publication date | Apr 11, 2017 |
| Grant date | Apr 11, 2017 |
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Processes for controlling the growth and thickness of two-dimensional transition metal dichalcogenides are provided. The process modifies an insulator substrate surface with an electron or ion beam to create charged areas on the substrate surface. The treated surface allows for hydroxylation of the charged species which serves as nucleation sites for the seed particles during chemical vapor deposition that promotes growth of thin layers of transition metal dichalcogenides.
Opening claim text (preview).
What is claimed is: 1. A method for controlled growth of transition metal dichalcogenides (TMD) comprising applying an electron or focused ion beam to an insulator surface to produce a charged area; exposing the insulator surface to water molecules wherein the charged area comprises hydroxyl groups; and depositing the TMD at a thickness of about 0.7 nm to 2.1 nm on said insulator surface using a chemical vapor deposition process. 2. The method of claim 1 , wherein the charged area has a defined pattern, shape or line. 3. The method of claim 1 , wherein the focused ion beam comprises gallium ions. 4. The method of claim 1 , wherein the insulator surface is comprised of a material selected from the group consisting of silicon oxides, Al 2 O 3 , h-BN and phylosilicates. 5. The method of claim 1 , wherein the insulator surface consist essentially of SiO 2 . 6. The method of claim 1 , wherein the TMD is MX 2 wherein M is a metal selected from the group consisting of Mo and W and wherein X is a nonmetal selected from the group consisting of S, Se and Te. 7. The method of claim 1 , wherein the TMD is MoS 2 . 8. The method of claim 1 , wherein the charged area further comprises seed particles. 9. The method of claim 8 , wherein the seed particles are at least one compound selected from the group consisting of MoO 3 , MoOS 2 , MoO 2 S, MoO 2 , MoOS or mixtures thereof. 10. The method of claim 1 , wherein the chemical vapor deposition process occurs inside a tube furnace. 11. A method for controlled growth of transition metal dichalcogenides (TMD) comprising treating a substrate surface comprising SiO 2 with a focused ion beam to produce a charged area have a defined pattern, line or shape; exposing the charged area to water molecules wherein the charged area comprises hydroxyl groups; and depositing MoS 2 at a thickness of about 0.7 nm to 2.1 nm on the substrate surface by exposing said substrate surface to molybdenum trioxide and sulfur under an inert atmosphere.
being chalcogenide semiconductor materials not being oxides, e.g. ternary compounds · CPC title
being crystalline insulating materials · CPC title
characterised by treatments done before the formation of the materials · CPC title
using chemical vapour deposition [CVD] · CPC title
Electricity · mapped topic
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