Near-infrared-absorbing composition, near-infrared cut-off filter using same, manufacturing method therefor, camera module, and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-9618666-B2
Application number	US-201514753189-A
Country	US
Kind code	B2
Filing date	Jun 29, 2015
Priority date	Feb 19, 2013
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

An object of the present invention is to provide a near-infrared-absorbing composition capable of forming a cured film having excellent heat resistance while maintaining strong near-infrared shielding properties when a cured film is produced. The near-infrared-absorbing composition of the present invention includes a copper complex obtained by reacting two or more kinds of sulfonic acids represented by General Formula (I) described below or salts thereof with a copper component and a solvent.

First claim

What is claimed is:

1. A near-infrared-absorbing composition, comprising:
a copper complex obtained by reacting two or more sulfonic acids represented by General Formula (I) described below or salts thereof with a copper component,

in Formula (I), R 1 represents an organic group.

2. A near-infrared-absorbing composition, comprising:
a copper complex which includes copper as a central metal and includes sulfonic acids represented by General Formula (I) described below having mutually different structures as ligands or a copper complex having structures represented by General Formula (II) described below that are different from each other; and
a solvent,

in Formula (I), R 1 represents an organic group, in Formula (II), R 2 represents an organic group, and “*” indicates a portion at which a coordination bond with copper is formed.

3. The near-infrared-absorbing composition according to claim 1 ,
wherein the R 1 is an alkyl group, an aryl group, or an organic group having an unsaturated double bond.

4. The near-infrared-absorbing composition according to claim 2 ,
wherein each of the R 1 and R 2 is independently an alkyl group, an aryl group, or an organic group having an unsaturated double bond.

5. The near-infrared-absorbing composition according to claim 1 ,
wherein the R 1 is an organic group having a molecular weight of 300 or less.

6. The near-infrared-absorbing composition according to claim 2 ,
wherein the R 1 and/or R 2 are organic groups having a molecular weight of 300 or less.

7. The near-infrared-absorbing composition according to claim 1 ,
wherein the sulfonic acid represented by General Formula (I) is selected from unsubstituted alkyl sulfonic acids, substituted or unsubstituted aryl sulfonic acids, alkyl sulfonic acids substituted with a fluorine atom, and substituted or unsubstituted alkenyl sulfonic acids.

8. The near-infrared-absorbing composition according to claim 2 ,
wherein the sulfonic acid represented by General Formula (I) is selected from unsubstituted alkyl sulfonic acids, substituted or unsubstituted aryl sulfonic acids, alkyl sulfonic acids substituted with a fluorine atom, and substituted or unsubstituted alkenyl sulfonic acids.

9. The near-infrared-absorbing composition according to claim 1 ,
wherein the copper complex is obtained by reacting three or more kinds of the sulfonic acids represented by General Formula (I) or salts thereof with the copper component.

10. The near-infrared-absorbing composition according to claim 2 , further comprising:
three or more copper complexes which include the sulfonic acids represented by General Formula (I) having mutually different structures as ligands or three or more copper complexes having the structures represented by General Formula (II) that are different from each other.

11. The near-infrared-absorbing composition according to claim 2 , further comprising:
a copper complex which includes the sulfonic acids represented by General Formula (I) all having the same structure as ligands or a copper complex having the structures represented by General Formula (II) that are identical to each other.

12. A near-infrared-absorbing composition, comprising:
a copper complex obtained by reacting sulfonic acids represented by General Formula (III) described below or salts thereof with a copper component;
a solvent; and
a curable compound,

in Formula (III), R 3 represents an organic group having no (meth)acrylic ester group.

13. A near-infrared-absorbing composition, comprising:
a copper complex which includes copper as a central metal and includes sulfonic acids represented by General Formula (III) described below as ligands or a copper complex which has a structure represented by General Formula (IV) described below;
a solvent; and
a curable compound,

in General Formula (III), R 3 represents an organic group having no (meth)acrylic ester group, in General Formula (IV), R 4 represents an organic group having no (meth)acrylic ester group, and “*” indicates a portion at which a coordination bond with copper is formed.

14. The near-infrared-absorbing composition according to claim 12 ,
wherein the R 3 is an alkyl group or an organic group having an aryl group.

15. The near-infrared-absorbing composition according to claim 13 ,
wherein each of the R 3 and R 4 is independently an alkyl group or an organic group having an aryl group.

16. The near-infrared-absorbing composition according to claim 12 ,
wherein the R 3 is an organic group having a molecular weight of 300 or less.

17. The near-infrared-absorbing composition according to claim 13 ,
wherein the R 3 and/or R 4 are organic groups having a molecular weight of 300 or less.

18. The near-infrared-absorbing composition according to claim 12 ,
wherein the sulfonic acid represented by General Formula (III) is selected from unsubstituted alkyl sulfonic acids, substituted or unsubstituted aryl sulfonic acids, alkyl sulfonic acids substituted with a fluorine atom, and substituted or unsubstituted alkenyl sulfonic acids.

19. The near-infrared-absorbing composition according to claim 13 , further comprising:
two or more copper complexes which include sulfonic acids represented by General Formula (III) all having the same structure as ligands or two or more copper complexes having the structures represented by General Formula (IV) that are all identical to each other.

20. The near-infrared-absorbing composition according to claim 1 , further comprising:
a curable compound.

21. The near-infrared-absorbing composition according to claim 20 ,
wherein the curable compound is a tri- or more-functional (meth)acrylate and/or an epoxy resin.

22. The near-infrared-absorbing composition according to claim 1 ,
wherein a solid content of the near-infrared-absorbing composition is in a range of 35 mass % to 90 mass %.

23. The near-infrared-absorbing composition according to claim 1 which is used in a form of a coated film formed on an image sensor for a solid-state imaging element.

24. A near-infrared-absorbing composition, comprising:
a copper complex obtained by reacting a compound having two or more acid groups or salts thereof with a copper component; and
a curable compound.

25. The near-infrared-absorbing composition according to claim 24 ,
wherein the acid group included in the compound having two or more acid groups is selected from a sulfonic acid group, a carboxylic acid group, and acid groups including a phosphorous atom.

26. The near-infrared-absorbing composition according to claim 24 ,
wherein the compound having two or more acid groups includes at least a sulfonic acid group and a carboxylic acid group.

27. A near-infrared cut-off filter produced using the near-infrared-absorbing composition according to claim 1 .

28. A camera module, comprising:
a solid-state imaging element substrate; and
the near-infrared cut-off filter accordi

Assignees

• Fujifilm Corp

Inventors

• Kawashima Takashi
• Hitomi Seiichi
• Takahashi Hidenori
• Nara Yuki
• Bak Seongmu

Classifications

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• C08F2/44 Primary

  Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers · CPC title

• C08K5/42

  Sulfonic acids; Derivatives thereof · CPC title

• C08K5/0091

  Complexes with metal-heteroatom-bonds · CPC title