Gas sensor package

Patent metadata

Field	Value
Publication number	US-9618490-B2
Application number	US-201414503480-A
Country	US
Kind code	B2
Filing date	Oct 1, 2014
Priority date	Oct 1, 2013
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

Provided is a gas sensor package, including: a first substrate including a gas inflow hole; and a gas sensing element mounted to the first substrate and including a gas sensing portion disposed to correspond to the gas inflow hole.

First claim

What is claimed is:

1. A gas sensor package, comprising:
a first substrate including a gas inflow hole and metal patterns;
a gas sensing element mounted to the first substrate and including a gas sensing portion provided to correspond to the gas inflow hole and bonded to the metal patterns;
metal filling portions connected to respective metal patterns of the first substrate, each of the metal filling portions protruding from a surface of the first substrate and passing through the first substrate;
a second substrate, wherein each of the metal filling portions contacts the second substrate to connect the second substrate to the first substrate; and
an output change portion mounted on the first substrate to change an output mode of the gas sensing element.

2. The gas sensor package of claim 1 , wherein the gas inflow hole passes through the first substrate,
wherein the output change portion is a fixed resistance element or an NTC (Negative Temperature Coefficient) thermistor.

3. The gas sensor package of claim 1 , further comprising a gas inflow portion formed between the first substrate and the second substrate to communicate with the gas inflow hole.

4. The gas sensor package of claim 1 , further comprising a molding portion formed on the gas sensing element, wherein the molding portion is applied to a side of the gas sensing element and the first substrate so as to enable the gas sensing element to he fixed to the first substrate.

5. The gas sensor package of claim 1 , wherein the gas sensing element includes: a body in which a cavity portion is formed such that an upper part of the body is open; and a protective portion bonded to the gas sensing element to cover the upper part of the body of the gas sensing element.

6. The gas sensor package of claim 5 , wherein at least a part of the side of the protective portion is open so that gas can move.

7. A gas sensor package, comprising:
a first substrate including a gas inflow hole;
a gas sensing element mounted to the first substrate and including a gas sensing portion provided to correspond to the gas inflow hole; and
an output change portion mounted on the first substrate to change an output mode of the gas sensing element.

8. The gas sensor package of claim 7 , wherein the output change portion is a fixed resistance element or an NTC (Negative Temperature Coefficient) thermistor.

9. A gas sensor package, comprising:
a first substrate including a gas inflow hole;
a gas sensing element mounted to the first substrate and including a gas sensing portion provided to correspond to the gas inflow hole; and
a molding portion formed on the gas sensing element,
wherein the molding portion is formed to bury the gas sensing element and an upper surface of the first substrate.

Assignees

• Lg Innotek Co Ltd

Inventors

• Paik Jee Heum
• Bae Yun Mi
• Hwang Go Eun

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/90

  Bond pads, in general · CPC title

• H10W72/072

  of bump connectors · CPC title

• B81B2201/0214

  Biosensors; Chemical sensors · CPC title