Ultrasonic transducer assembly and system for monitoring structural integrity

Patent metadata

Field	Value
Publication number	US-9618481-B2
Application number	US-201113883473-A
Country	US
Kind code	B2
Filing date	Nov 7, 2011
Priority date	Nov 5, 2010
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

In an ultrasonic transducer assembly, a conformable ultrasonic transducer has a piezoelectric layer and electrodes able to conform to curved surfaces, and a clamp for pressing the transducer into ultrasonic contact with a curved surface. Conformability is ensured with a thin, porous piezoelectric layer and suitable electrical conductors and insulators. The ultrasonic transducer may operate without further thermal shielding under harsh environments and/or at high temperatures.

First claim

What is claimed is:

1. An ultrasonic transducer assembly useful for monitoring a component having a curved outer surface, the transducer comprising:
a piezoelectric film having top and bottom surfaces, the film having a flexibility to conform to said curved outer surface and being oriented to excite and detect ultrasonic pulses in a direction orthogonal to the film bottom surface;
top electrode adjacent to the top surface of the piezoelectric film to make the piezoelectric film able to act as an ultrasonic transducer in said direction orthogonal to the film bottom surface when a voltage is applied to said top electrode;
a first electrical connector extending from the top electrode;
a flexible insulating layer covering the top electrode and at least part of the first electrical connector, the insulating layer having a shape and size to substantially surround a section of a component to be monitored; and
a clamp configured to apply at least a 0.2 MPa compressive stress on a region of the component, the clamp being aligned with the top electrode.

2. The transducer assembly of claim 1 wherein:
the transducer assembly is flexible, and the clamp comprises a band that, when tensioned, causes the assembly to conform to a convex surface of the section of the component.

3. The transducer assembly of claim 1 further comprising the component, which has the form of a pipe or a pipe fitting;
wherein the transducer assembly is positioned on the component curved outer surface with the clamp holding the transducer assembly to said component curved outer surface.

4. The transducer assembly of claim 1 wherein all materials used to fabricate the assembly retain structural, electrical, and chemical integrity to operate at high temperatures.

5. The transducer assembly of claim 4 wherein the piezoelectric film has a composition consistent with fabrication using one or more layers of a mixture of a piezoelectric powder and organic precursors of dielectric and/or piezoelectric material, wherein after heat treatment the piezoelectric film has a level of porosity that provides flexibility, resistance to thermal shock and ultrasonic bandwidth.

6. The transducer assembly of claim 1 further comprising an ultrasonic coupling layer composed of an ultrasonic transmitting material making intimate physical contact with the transducer assembly at a top surface, and for making intimate physical contact with the component at a bottom surface.

7. The transducer assembly of claim 6 wherein the ultrasonic transmitting material comprises: a high temperature paste or liquid, or a soft metal.

8. The transducer assembly of claim 6 wherein the coupling layer comprises a metal foil, and wherein:
the clamp is adapted to apply at least 1 MPa compressive stress.

9. The transducer assembly of claim 1 further comprising a bottom electrode electrically coupled to the component, which is conductive to serve as a ground for the flexible ultrasonic transducer.

10. The transducer assembly of claim 1 wherein the insulating layer comprises:
a conductive path between top and bottom insulations, with a via through the bottom insulation for providing electrical contact between the conductive path and the top electrode.

11. The transducer assembly of claim 1 :
wherein a plurality of similar separate piezoelectric films are spaced along the insulating layer to provide a transducer array.

12. The transducer assembly of claim 1 wherein:
the transducer assembly is flexible, and the clamp comprises a tube clamp, comprising a deformable band for surrounding the section, formed of metal or a fibreglass textile.

13. The transducer assembly of claim 1 wherein:
the transducer assembly is flexible, and the clamp comprises a tensioning mechanism, having a spring or spring washer to maintain a constant tension under different thermal conditions.

14. The transducer assembly of claim 1 further comprising a bottom electrode electrically coupled to the electronic control by a second electrical connector that is insulated from the first electrical connector.

15. The transducer assembly of claim 1 wherein a surface of the component serves as a bottom electrode of the flexible ultrasonic transducer, and has an electrical connection to the electrical control.

16. The transducer assembly of claim 1 wherein a surface of the component serves as a bottom electrode of the flexible ultrasonic transducer, and has an electrical connection to the electrical control, and the piezoelectric layer is bonded to the component to be monitored by a ceramic binder made from organic precursors of a piezoelectric and/or dielectric ceramic.

17. The transducer assembly of claim 1 wherein the insulating layer comprises a layer of mica or polyimide.

Assignees

• Kruger Silvio E
• Nat Res Council Canada

Inventors

• Kruger Silvio E

Classifications

• B23P11/00

  Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for  (connecting sheet metal or metal tubes, rods or profiles B21D39/00; riveting B21J; soldering, unsoldering, welding B23K; hand tools for connecting wire or strip B25B25/00; connecting metal parts by adhesives F16B11/00) · CPC title

• G01N29/245

  Ceramic probes, e.g. lead zirconate titanate [PZT] probes · CPC title

• G01N2291/265

  Spherical objects · CPC title

• Y10T29/49966

  with supplemental joining · CPC title

• B01B1/06

  Preventing bumping · CPC title