Heat exchange devices, liquid adhesive systems, and related methods

Patent metadata

Field	Value
Publication number	US-9615405-B2
Application number	US-201414481182-A
Country	US
Kind code	B2
Filing date	Sep 9, 2014
Priority date	Sep 16, 2013
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange device further includes a heating element for heating the liquid adhesive material flowing through the thin slit section to the application temperature.

First claim

What is claimed is:

1. A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application, the heat exchange device comprising:
a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application,
a fluid passageway defined in the body connecting the inlet and the outlet and configured to receive the flow of liquid adhesive material, the fluid passageway including a thin slit section to provide a large contact surface area of the body with a relatively small volume of liquid adhesive material,
the thin slit section having at least a first portion and a second portion generally parallel to the first portion, the first portion having a first flow direction and a first length along the first flow direction, the second portion having a second flow direction opposite the first flow direction and a second length along the second flow direction, the first and second portions each further having first and second dimensions transverse to the respective first and second fluid flow directions, the respective first dimensions and the respective first and second lengths being substantially greater than the respective second dimensions, and
a heating element thermally coupled with the body and configured to heat the liquid adhesive material flowing through the thin slit section to the application temperature.

2. The heat exchange device of claim 1 , wherein the first and second portions of the thin slit section each have a concentrically shaped profile transverse to the first and second flow directions, and the first portion is generally radially inside the second portion.

3. The heat exchange device of claim 1 , wherein the fluid passageway comprises an inlet section between the inlet and the thin slit section and an outlet section between the thin slit section and the outlet, the inlet section and the outlet section having lengths along the fluid flow direction and profiles transverse to the fluid flow direction having third dimensions and fourth dimensions, the third dimensions being substantially equal to the fourth dimensions.

4. The heat exchange device of claim 1 , further comprising:
a temperature sensor coupled with the body for measuring the temperature of the liquid adhesive material flowing through the fluid passageway.

5. The heat exchange device of claim 4 , wherein the temperature sensor is closer to the fluid passageway than to the heating element.

6. The heat exchange device of claim 4 , wherein the shortest distance from the temperature sensor to the fluid passageway is less than 1/10 of the total length of the fluid passageway.

7. The heat exchange device of claim 4 , wherein the temperature sensor is positioned at a location where the amount of time it takes the liquid adhesive material to flow from that location to the outlet is approximately equal to the amount of time it takes the heat exchange device to change the temperature of the liquid adhesive material flowing in the fluid passageway to the desired temperature.

8. The heat exchange device of claim 1 , wherein the profile of the thin slit section is a ring, the first dimension is a circumference of the ring, and the second dimension is a radial thickness of the ring,
wherein the body is comprised of generally concentrically arranged first, second, and third body segments, the second body segment being generally radially inside the first body segment and the third body segment being generally radially inside the second body segment, and
wherein the thin slit section of the fluid passageway is defined between the first and second body segments.

9. The heat exchange device of claim 8 , wherein the inlet is in the third body segment and the outlet is in the second body segment.

10. The heat exchange device of claim 8 , wherein the thin slit section is further defined between the second and third body segments.

11. The heat exchange device of claim 8 , wherein the heating element is positioned in a socket in the first body segment.

12. The heat exchange device of claim 1 , wherein the profile of the thin slit section is a quadrilateral, the first dimension is a width of the quadrilateral, and the second dimension is a thickness of the quadrilateral.

13. The heat exchange device of claim 12 , wherein the body is comprised of first and second generally opposed outer walls and a block positioned between and spaced from the first and second outer walls, and
wherein the thin slit section of the fluid passageway is defined between the block and at least one of the first and second outer walls.

14. The heat exchange device of claim 13 , wherein the body is further comprised of a head opposed from a base with the block positioned generally there between, and
wherein the inlet is in the head and the outlet is in the base.

15. The heat exchange device of claim 13 , wherein the thin slit section of the fluid passageway is defined between the block and both of the first and second outer walls.

16. The heat exchange device of claim 13 , wherein the heating element is positioned in a socket in the block.

17. The heat exchange device of claim 13 , further comprising:
a filter coupled with the fluid passageway for filtering the liquid adhesive material before it exits the outlet.

18. A method of dispensing liquid adhesive material for an adhesive bonding application, the method comprising:
directing liquid adhesive material from an adhesive supply to a heat exchange device and through a fluid passageway in the heat exchange device, wherein the fluid passageway includes a thin slit section to provide a large contact surface area of a body of the device with a relatively small volume of liquid adhesive material, the thin slit section having at least a first portion and a second portion generally parallel to the first portion, the first portion having a first flow direction and a first length along the first flow direction, the second portion having a second flow direction opposite the first flow direction and a second length along the second flow direction, the first and second portions each further having first and second dimensions transverse to the respective first and second fluid flow directions, the respective first dimensions and the respective first and second lengths being substantially greater than the respective second dimensions,
heating the liquid adhesive material in the fluid passageway of the heat exchange device to an application temperature suitable for the adhesive bonding application, the liquid adhesive material being maintained at temperatures below the application temperature before it is heated in the heat exchange device such that the liquid adhesive material is not suitable for the adhesive bonding application before it is heated to the application temperature in the heat exchange device,
directing the liquid adhesive material from the heat exchange device to a dispensing device, and
dispensing the liquid adhesive material using the dispensing device.

19. The method of claim 18 , wherein the application temperature is greater than 350° F.

20. The method of claim 18 , further comprising melting a supply of solid or semi-solid unmelted hot melt adhesive material to form the liquid adhesive material before directing liquid adhesive material from an adhesive supply to a heat exchange device.

21. The method of claim 20 , where

Assignees

• Nordson Corp

Inventors

• Clark Steven
• Fort Wesley C
• Gould Mark A
• Lanier Leonard J
• Saidman Laurence B

Classifications

• B05C5/0237

  Fluid actuated valves · CPC title

• F24H1/142 Primary

  using electric energy supply · CPC title

• H05B1/023 Primary

  Industrial applications · CPC title

• B05C11/1042 Primary

  provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus · CPC title

• H05B3/02

  Details · CPC title