Wire suspension mounting approach for reduced optical image stabilization package size

Patent metadata

Field	Value
Publication number	US-9615025-B2
Application number	US-201414478930-A
Country	US
Kind code	B2
Filing date	Sep 5, 2014
Priority date	Sep 5, 2014
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

Some embodiments include an optics assembly. In some embodiments, the optics assembly includes an optics component. In some embodiments, the optics assembly is configured to move within the apparatus on one or more axes orthogonal to an optical axis of the optics component. In some embodiments, the optics assembly is suspended by a plurality of wires on a base component of the apparatus, each wire of the plurality of wires being substantially parallel to the optical axis of the optics component. Some embodiments include a base assembly component or substrate having an upper surface plane and a lower surface plane. In some embodiments, one or more terminations are disposed around the plurality of wires. In some embodiments, the terminations are located beyond the upper surface plane of the base assembly component.

First claim

What is claimed is:

1. An apparatus, comprising:
an optics assembly comprising an optics component, wherein
the optics assembly is configured to move within the apparatus on one or more axes orthogonal to an optical axis of the optics component,
the optics assembly is suspended by a plurality of wires on a base component of the apparatus, each wire of the plurality of wires being substantially parallel to the optical axis of the optics component;

a base assembly component having an upper surface plane and a lower surface plane, wherein the base assembly component is a substrate supporting an image sensor for capturing an image data structure representing light received through the optics component; and
one or more terminations disposed around the plurality of wires, wherein
the terminations are configured to terminate respective ones of the plurality of wires, and
the terminations are located beyond the upper surface plane of the base assembly component, when measured from the optics assembly.

2. The apparatus as recited in claim 1 , wherein the base assembly component includes a pocket, step, cavity, or indentation below the upper surface plane at each location that is configured to receive one of the terminations.

3. The apparatus as recited in claim 1 , wherein the terminations are located beyond lateral edges of the base assembly component along an axis perpendicular to the optical axis of the optics component.

4. The apparatus as recited in claim 1 , wherein the termination comprises solder applied to a wire of the plurality of wires.

5. The apparatus as recited in claim 1 , wherein the termination comprises a resin applied to a wire of the plurality of wires.

6. The apparatus as recited in claim 1 , wherein the optics assembly includes a coil holder having a pocket, step, cavity, or indentation at each wire location that is configured to contain the wire.

7. The apparatus as recited in claim 1 , further comprising a cover coupled to the base component.

8. The apparatus as recited in claim 1 , wherein the base assembly component includes a through-pipe from the upper surface plane to the lower surface plane at each location that is configured to receive one of the terminations.

9. A method, comprising:
assembling an optics assembly for an optical image stabilization (OIS) voice coil motor (VCM) actuator module, wherein
the optics assembly is configured to move within the actuator module;

assembling a base assembly for the OIS VCM actuator module, wherein the base assembly is configured to support an image sensor for capturing light received through the optics assembly and projected onto the image sensor;
suspending the optics assembly by a plurality of wires connecting to the base assembly of the actuator module, each wire being substantially parallel to an optical axis of the optics assembly; and
terminating the plurality of wires with one or more terminations disposed around the plurality of wires, wherein
the terminations are located beyond an upper surface plane of the base assembly.

10. The method as recited in claim 9 , wherein the terminating the plurality of wires with one or more terminations disposed around the plurality of wires further comprises applying solder to one or more of the plurality of wires at locations beyond the upper surface plane of the base assembly, when measured from the optics assembly when measured along the optical axis of the optics assembly.

11. The method as recited in claim 9 , wherein the terminating the plurality of wires with one or more terminations disposed around the plurality of wires further comprises applying resin to one or more of the plurality of wires at locations beyond the upper surface plane of the base assembly, when measured from the optics assembly when measured along the optical axis of the optics assembly.

12. The method as recited in claim 9 , wherein the terminating the plurality of wires with one or more terminations disposed around the plurality of wires further comprises applying mechanical force to one or more of the plurality of wires at locations beyond the upper surface plane of the base assembly, when measured from the optics assembly when measured along the optical axis of the optics assembly.

13. The method as recited in claim 9 , wherein the terminations are located beyond the upper surface plane of the base assembly, when measured from the optics assembly along the optical axis of the optics assembly.

14. The method as recited in claim 9 , wherein the optics assembly is configured to move within the actuator module on one or more axes orthogonal to the optical axis of the optics assembly.

15. The method as recited in claim 9 , wherein:
the terminating the plurality of wires with one or more terminations disposed around the plurality of wires further comprises applying a termination material to locations disposed around the plurality of wires; and
the locations disposed around the plurality of wires are located beyond lateral edges of the base component relative to an axis perpendicular to the optical axis of the optics assembly.

16. A camera, comprising:
a photosensor configured to capture light projected onto a surface of the photosensor;
an optics assembly configured to refract light from an object field located in front of the camera onto the photosensor;
an actuator module comprising:
an optical image stabilization (OIS) mechanism configured to move the optics assembly within the actuator module on one or more axes orthogonal to an optical axis of the camera to stabilize an image plane formed by the optics assembly at the photosensor, wherein
the optics assembly is suspended by a plurality of wires on a base component of the OIS mechanism, the base component including a substrate configured to support the photosensor, and each wire being substantially parallel to the optical axis, and

one or more terminations disposed around the plurality of wires, wherein
the terminations are configured to terminate respective ones of the plurality of wires, and
the terminations are located beyond an upper surface plane of the substrate, when measured from the optics assembly.

17. The camera as recited in claim 16 , wherein the OIS mechanism is a voice coil motor (VCM) technology actuator.

18. The camera as recited in claim 16 , wherein each termination comprises a solder termination of the wire.

19. The camera as recited in claim 16 , wherein the terminations are located beyond lateral edges of the base component relative to an axis perpendicular to the optical axis of the optics component.

20. The camera as recited in claim 16 , wherein each termination comprises a mechanical crimping of the wire.

Assignees

• Apple Inc

Inventors

• Gleason Jeffrey N
• Dunn Ryan J
• Miller Scott W

Classifications

• H04N23/687 Primary

  by shifting the lens or sensor position · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• G02B7/08 Primary

  adapted to co-operate with a remote control mechanism · CPC title

• H04N5/2254

  Electricity · mapped topic

• H04N5/23287 Primary

  Electricity · mapped topic