Composite module and electronic apparatus including the same

US9614271B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9614271-B2
Application numberUS-201314010790-A
CountryUS
Kind codeB2
Filing dateAug 27, 2013
Priority dateSep 28, 2012
Publication dateApr 4, 2017
Grant dateApr 4, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A wireless communication module includes a circuit board, and an antenna and a connection member mounted on a mounting surface of the circuit board. The antenna is mounted in a region along a first end edge of the circuit board, and the connection member is mounted in a region along a second end edge of the circuit board.

First claim

Opening claim text (preview).

What is claimed is: 1. A composite module comprising: a circuit board; an antenna and a connection member mounted on a mounting surface of the circuit board; an electronic component mounted on the circuit board; and a metal case mounted on the circuit board so as to cover the electronic component; wherein the antenna is mounted in a region along a first end edge of the circuit board; the connection member is mounted in a region along a second end edge of the circuit board; the metal case and the electronic component are positioned between the antenna and the connection member; the first end edge and the second end edge are opposed to each other when the circuit board is seen in a planar view; wherein the connection member includes at least a fixing member; the metal case is mounted in a region on the second end edge side of the circuit board; the metal case includes a top plate and a side plate arranged at a predetermined position; the fixing member is arranged near a portion where the side plate is not arranged; and the fixing member is arranged such that the fixing member is covered with the metal case. 2. The composite module according to claim 1 , wherein a heat dissipation member is arranged between the metal case and the electronic component. 3. The composite module according to claim 1 , wherein the electronic component is one of a wireless communication IC, a balun filter, and a band-pass filter. 4. The composite module according to claim 1 , wherein the circuit board includes a through hole to enable insertion of the fixing member. 5. The composite module according to claim 1 , wherein the electronic component is mounted adjacent to the fixing member. 6. The composite module according to claim 1 , wherein the antenna is a chip antenna including a dielectric material or a pattern antenna including a wiring pattern on the circuit board. 7. The composite module according to claim 1 , wherein the side plate includes a plurality of side plates arranged at the predetermined position; in side portions of the metal case, gaps are located at portions where no side plates are provided; and the fixing member is arranged to block at least one of the gaps. 8. The composite module according to claim 1 , wherein the side plate includes a plurality of side plates arranged at the predetermined position; and the metal case is L-shaped or substantially L-shaped. 9. An electronic apparatus comprising: a mother board; and the composite module according to claim 1 , on the mother board. 10. The electronic apparatus according to claim 9 , wherein the metal case or the mounting surface is mounted so as to face a principal surface side of the mother board. 11. The electronic apparatus according to claim 10 , wherein a heat dissipation member is arranged between the top plate of the metal case and a principal surface of the mother board. 12. An electronic apparatus comprising: a mother board; and the composite module according to claim 1 , the composite module being mounted on the mother board via the fixing member. 13. The electronic apparatus according to claim 12 , wherein the metal case or the mounting surface is mounted so as to face a principal surface side of the mother board. 14. The electronic apparatus according to claim 13 , wherein a heat dissipation member is arranged between the top plate of the metal case and a principal surface of the mother board. 15. The electronic apparatus according to claim 1 , wherein the fixing member is electrically connected to ground.

Assignees

Inventors

Classifications

  • with built-in antennas · CPC title

  • H01Q1/24Primary

    with receiving set · CPC title

  • H01Q1/52Primary

    Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure (absorbing means H01Q17/00) · CPC title

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Frequently asked questions

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What does patent US9614271B2 cover?
A wireless communication module includes a circuit board, and an antenna and a connection member mounted on a mounting surface of the circuit board. The antenna is mounted in a region along a first end edge of the circuit board, and the connection member is mounted in a region along a second end edge of the circuit board.
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification H01Q1/24. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 04 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).