Anti-lightning combined-stripline-circuit system

Patent metadata

Field	Value
Publication number	US-9614268-B2
Application number	US-201414155906-A
Country	US
Kind code	B2
Filing date	Jan 15, 2014
Priority date	Jan 15, 2014
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

An anti-lightning-combined-stripline-circuit system is provided. The anti-lightning-combined-stripline-circuit system includes a stripline board including circuitry, and a metal ground bar attached to the stripline board. The metal ground bar has a geometry configured to function as a ground for the circuitry and simultaneously function as a lightning ground for a linear array of elements driven by the circuitry.

First claim

What is claimed is:

1. An anti-lightning-combined-stripline-circuit system, comprising:
a stripline board including circuitry; and
a metal ground bar attached to the stripline board, the metal ground bar having a thickness and a width corresponding to a cross section, wherein the cross section is sufficient for the metal ground bar to function as a ground for the circuitry and simultaneously function as a lightning ground for a linear array of elements driven by the circuitry.

2. The anti-lightning-combined-stripline-circuit system of claim 1 , wherein the stripline board comprises:
a first-layered-stripline board comprising a first substrate having a first length and a second substrate having a second length, the second length being less than the first length, wherein a first-circuit-portion of the circuitry on the first substrate is exposed; and
a second-layered-stripline board comprising a third substrate having a third length and a fourth substrate having a fourth length, the fourth length being less than the third length, wherein a second-circuit-portion of the circuitry on the third substrate is exposed, the anti-lightning-combined-stripline-circuit system further comprising:
a soldering region formed by a metal-coated edge-surface of an edge of the third substrate.

3. The anti-lightning-combined-stripline-circuit system of claim 2 , further comprising:
a first prepreg layer having a length equal to the second length, the first prepreg layer attaching the first substrate to the second substrate of the first-layered-stripline board; and
a second prepreg layer having a length equal to the fourth length, the second prepreg layer attaching the third substrate to the fourth substrate of the second-layered-stripline board.

4. The anti-lightning-combined-stripline-circuit system of claim 2 , wherein the first-circuit-portion is electrically connected to the second-circuit-portion by soldering the first-circuit-portion to the second-circuit-portion at the soldering region, wherein at least of a portion of the first-circuit-portion is covered by the third substrate and at least a portion of the second-circuit-portion is covered by the first substrate wherein the length of the stripline board on which the circuitry is positioned is greater than the first length and is greater than the third length.

5. The anti-lightning-combined-stripline-circuit system of claim 2 , wherein the soldering region is a metal-coated U-shaped edge surface.

6. The anti-lightning-combined-stripline-circuit system of claim 1 , wherein the circuitry comprises:
a driving circuit for the linear array of elements; and
a power distribution circuit for the linear array of elements, wherein the stripline board comprises:
a first-layered-stripline board including a first substrate having a first length and a second substrate having a second length, the second length being less than the first length, wherein at least a portion of a first-driving-circuit portion and a first-distribution-circuit portion on the first substrate is exposed; and
a second-layered-stripline board including a third substrate having a third length and a fourth substrate having a fourth length, the fourth length being less than the third length, wherein at least a portion of a second-driving-circuit portion and a second-distribution-circuit portion on the third substrate is exposed.

7. The anti-lightning-combined-stripline-circuit system of claim 6 , further comprising:
a soldering region formed from a metal-coated edge-surface of an edge of the third substrate, wherein the soldering region electrically connects the first-driving-circuit portion to the second-driving-circuit portion and the first-distribution-circuit portion to the second-distribution-circuit portion, wherein a length of the linear array of elements driven by the driving circuit is increased.

8. The anti-lightning-combined-stripline-circuit system of claim 1 , wherein the circuitry comprises:
a driving circuit for a linear antenna array; and
a power distribution circuit for the linear antenna array, wherein the metal ground bar has a geometry configured to function as:
the lightning ground for the linear antenna array; and
one of a microwave frequency ground, a millimeter wave frequency ground, or a radio frequency ground for the driving circuit and the power distribution circuit.

9. A method of forming an anti-lightning-combined-stripline-circuit system, the method comprising:
forming a stripline board having a thickness, a width, and a length, the stripline board including circuitry having a circuitry-length;
forming a metal ground bar; and
attaching the stripline board to the metal ground bar having a thickness and a width corresponding to a cross section, wherein the cross section is sufficient for the metal ground bar to function as a ground for the circuitry and simultaneously function as a lightning ground for a linear array of elements driven by the circuitry.

10. The method of claim 9 , wherein forming a stripline board including circuitry comprises:
forming a first-circuit-portion of the circuitry at least one of in or on a first substrate having a first length;
forming a second substrate having a second length, the second length being less than the first length;
forming a second-circuit-portion of the circuitry at least one of in or on a third substrate having a third length; and
forming a fourth substrate having a fourth length, the fourth length being less than the third length.

11. The method of claim 10 , further comprising:
forming a soldering region on an edge of the third substrate.

12. The method of claim 11 , further comprising:
attaching the first substrate to the second substrate by a first prepreg layer having a length equal to the second length to form a first-layered-stripline board; and
attaching the third substrate to the fourth substrate by a second prepreg layer having a length equal to the fourth length to form a second-layered-stripline board.

13. The method of claim 12 , further comprising soldering the first-layered-stripline board to the second-layered-stripline board at the soldering region, wherein the circuitry-length of the circuitry is greater than the first length and is greater than the third length.

14. The method of claim 9 , wherein forming a stripline board including circuitry comprises:
forming a first-driving-circuit portion and a first-distribution-circuit portion of the circuitry at least one of in or on a first substrate having a first length;
forming a second substrate having a second length, the second length being less than the first length;
forming a second-driving-circuit portion and a second-distribution-circuit portion at least one of in or on a third substrate having a third length; and
forming a fourth substrate having a fourth length, the fourth length being less than the third length.

15. The method of claim 14 , further comprising:
forming a soldering region on an edge of the third substrate.

16. The method of claim 15 , further comprising:
attaching the first substrate to the second substrate by a first prepreg layer having a length equal to the second length to form a first-layered-stripline board; and
attaching the third substrate to the fourth substrate by a second prepreg layer having a length equal to the fourth length to form a second-layered-stripline board.

17. The method of claim 16 , further comprising;
soldering the first-layered-stripline board to the second-layered-stripline board at the soldering region, wherein a length of a driving circuit and a l

Assignees

• Honeywell Int Inc

Inventors

• Wang Nan
• Wang Chao
• Nyhus Orville

Classifications

• H01P3/085

  Triplate lines · CPC title

• H05K1/142

  Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit · CPC title

• H01Q1/50 Primary

  Structural association of antennas with earthing switches, lead-in devices or lightning protectors · CPC title

• H05K2201/09845

  Stepped hole, via, edge, bump or conductor · CPC title

• H01Q21/0075

  Stripline fed arrays (H01Q21/065 takes precedence) · CPC title