Light emitting device having surface-modified luminophores

Patent metadata

Field	Value
Publication number	US-9614129-B2
Application number	US-201514858641-A
Country	US
Kind code	B2
Filing date	Sep 18, 2015
Priority date	Aug 14, 2010
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

A light-emitting device including a light-emitting diode and a surface-modified luminophore. The surface-modified luminophore includes a luminophore including a manganese activator and a fluorine compound fixed to the luminophore.

First claim

What is claimed is:

1. A light-emitting device, comprising:
a light-emitting diode; and
a surface-modified luminophore configured to absorb light emitted from the light-emitting diode and configured to emit light having a different wavelength from the absorbed light,
wherein the surface-modified luminophore comprises a fluoride luminophore comprising a manganese activator and a fluorine compound fixed to the luminophore, the fluoride luminophore selected from the group consisting of K 2 SiF 6 , Na 2 SiF 6 , Rb 2 SiF 6 , K 2 GeF 6 , Na 2 GeF 6 , and Rb 2 GeF 6 .

2. The light-emitting device of claim 1 , further comprising:
a package body;
a chip mounting part disposed on the package body; and
a lead terminal disposed on the package body and spaced apart from the chip mounting part;
wherein the chip mounting part comprises a lower portion having a lower surface exposed outside of the package body.

3. The light-emitting device of claim 2 , wherein the lead terminal comprises:
a first end disposed outside of the package body; and
a surface parallel to the lower surface of the chip mounting part.

4. The light-emitting device of claim 2 , wherein the lead terminal comprises:
a second end disposed inside the package body; and
a surface parallel to the lower surface of the chip mounting part.

5. The light-emitting device of claim 2 , wherein the chip mounting part comprises a recessed portion comprising a flat surface.

6. The light-emitting device of claim 1 , wherein the surface-modified luminophore further comprises a coating comprising non-fluorinated layer-forming materials.

7. The light-emitting device of claim 1 , further comprising a quantum dot (QD) luminophore configured to emit green light,
wherein the fluoride luminophore is configured to emit red light.

8. A light-emitting device, comprising:
a first light-emitting diode; and
a surface-modified luminophore configured to absorb light emitted from the first light-emitting diode and configured to emit light having a different wavelength from the absorbed light,
wherein:
the surface-modified luminophore has the general formula
(Me 1+ ,Me 2+ ,Me 3+ ) x .(Si,Al,B,P,V,N,C,Ge) y .(O,N,F) z :(A,F 1 ,S);

A is a manganese activator;
F 1 is a surface fixed fluorine or fluorine compound;
S is a coating comprising non-fluorinated layer-forming materials;
Me 1+ is a monovalent metal;
Me 2+ is a divalent metal;
Me 3+ is a Group III or lanthanoid trivalent metal;
0<x<5, 0<y<12, and 0<z<24;
the surface-modified luminophore comprises a fluoride luminophore; and
the fluoride luminophore is selected from the group consisting of K 2 SiF 6 , Na 2 SiF 6 , Rb 2 SiF 6 , K 2 GeF 6 , Na 2 GeF 6 , and Rb 2 GeF 6 .

9. The light-emitting device of claim 8 , further comprising a quantum dot (QD) luminophore configured to emit green light,
wherein the fluoride luminophore is configured to emit red light.

10. The light-emitting device of claim 9 , wherein the surface-modified luminophore comprises a coating comprising non-fluorinated layer-forming materials.

Assignees

• Seoul Semiconductor Co Ltd
• Litec-Lp Gmbh

Inventors

• Lee Chung Hoon
• Tews Walter
• Roth Gundula
• Starick Detlef

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07352

  changes in structures or sizes · CPC title

• H10W72/01515

  Forming coatings · CPC title