Edge protected barrier assemblies
US-2015027533-A1 · Jan 29, 2015 · US
Edge protected barrier assemblies
US9614113B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9614113-B2 |
| Application number | US-201214236700-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 30, 2012 |
| Priority date | Aug 4, 2011 |
| Publication date | Apr 4, 2017 |
| Grant date | Apr 4, 2017 |
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- Title
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Abstract
Official abstract text for this publication.
The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.
First claim
Opening claim text (preview).
What is claimed is: 1. An assembly comprising an electronic device; and a multilayer film, the multilayer film comprising a barrier stack adjacent the electronic device; and a polymer weatherable sheet adjacent the barrier stack opposite the electronic device, and a protective layer in contact with the electronic device and the weatherable sheet. 2. The assembly of claim 1 wherein the barrier stack comprises a polymer layer and an inorganic barrier layer. 3. The assembly of claim 2 wherein the inorganic barrier layer is an oxide layer. 4. The assembly of claim 1 wherein the multilayer film comprises a substrate between the electronic device and the barrier stack. 5. The assembly of claim 1 wherein the electronic device comprises an edge seal material. 6. The assembly of claim 5 wherein the protective layer is in contact with the edge seal. 7. The assembly of claim 1 wherein the protective layer is in contact with the barrier stack. 8. The assembly of claim 1 wherein the protective layer is a weatherable tape. 9. The assembly of claim 1 wherein the protective layer is a mechanical junction. 10. The assembly of claim 1 wherein the protective layer is a curable resin. 11. The assembly of claim 1 wherein the protective layer is bonded to the weatherable sheet. 12. The assembly of claim 4 wherein the substrate comprises at least one of polyethylene terephthalate, polyethylene naphthalate, polyetheretherketone, polyaryletherketone, polyacrylate, polyetherimide, polyarylsulfone, polyethersulfone, polyamideimide, or polyimide. 13. The assembly of claim 1 wherein the weatherable sheet comprises a fluoropolymer. 14. The assembly of claim 13 wherein the fluoropolymer comprises at least one of an ethylene tetrafluoro-ethylene copolymer, a tetrafluoroethylene-hexafluoropropylene copolymer, a tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer, or a polyvinylidene fluoride. 15. The assembly of claim 1 comprising a pressure sensitive adhesive layer between the weatherable sheet and the barrier stack. 16. The assembly of claim 1 wherein the barrier stack oxide layer shares a siloxane bond with the barrier stack polymer layer. 17. The assembly of claim 1 wherein the electronic device is a photovoltaic cell. 18. The assembly of claim 4 wherein the substrate is heat stabilized. 19. The assembly of claim 1 wherein the barrier stack has a water vapor transmission rate of less than 0.005 cc/m 2 /day at 50° C. and 100% relative humidity. 20. The assembly of claim 1 wherein the barrier stack has an oxygen transmission rate of less than 0.005 cc/m 2 /day at 23° C. and 90% relative humidity.
Assignees
Inventors
Classifications
Cross-Sectional Technologies · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Photovoltaic [PV] energy · CPC title
- H01L31/0481Primary
Electricity · mapped topic
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9614113B2 cover?
- The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The prese…
- Who is the assignee on this patent?
- Weigel Mark D, Roehrig Mark A, Kidane Samuel, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H01L31/0481. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 04 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).