Opto-electronic modules including features to help reduce stray light and/or optical cross-talk

Patent metadata

Field	Value
Publication number	US-9613939-B2
Application number	US-201414760059-A
Country	US
Kind code	B2
Filing date	Jan 2, 2014
Priority date	Jan 10, 2013
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

Opto-electronic modules, which can be fabricated in a wafer-scale process, include light emitting and/or light sensing devices mounted on or in a substrate. The modules, which can include various features to help reduce the occurrence of optical cross-talk and help prevent interference from stray light, can be used in a wide range of applications, including medical and health-related applications. For example, performing a measurement on a human body can include bringing a portion of the human body into direct contact with an exterior surface of the opto-electronic module and using a differential optical absorption spectroscopy technique to obtain an indication of a physical condition of the human body.

First claim

What is claimed is:

1. An opto-electronic module comprising:
a substrate in which or on which are mounted a plurality of opto-electronic devices; and
a cover over the substrate, wherein the cover includes first regions respectively aligned with the plurality of opto-electronic devices, and wherein the first regions are substantially transparent to a particular one or more wavelengths of light emitted by or sensed by the respective opto-electronic devices, wherein optical axis of adjacent ones of the first regions are separated from one another by a respective second light blocking region embedded in the cover, the second light blocking region being substantially non-transparent to the particular one or more wavelengths and being composed of epoxy containing carbon black.

2. The opto-electronic module of claim 1 wherein the epoxy contains at least 7% carbon black.

3. An opto-electronic module comprising:
a substrate in which or on which are mounted a plurality of opto-electronic devices; and
a cover over the substrate, wherein the cover includes first regions respectively aligned with the plurality of opto-electronic devices, and wherein the first regions are substantially transparent to a particular one or more wavelengths of light emitted by or sensed by the respective opto-electronic devices, wherein optical axis of adjacent ones of the first regions are separated from one another by a respective second light blocking region embedded in the cover, the second region being substantially non-transparent to the particular one or more wavelengths,
wherein the second light blocking region extends through a majority of a thickness of the cover, the second light blocking region extending from a bottom surface of the cover toward a top surface of the cover, but does not reach the top surface.

4. The opto-electronic module of claim 3 wherein the first regions are composed of glass.

5. The opto-electronic module of claim 3 wherein the second light blocking region is composed of a UV- or thermally-curing material.

6. The opto-electronic module of claim 5 wherein the second region has an absorbance at the particular one or more wavelengths of at least three.

7. The opto-electronic module of claim 3 wherein the plurality of opto-electronic devices mounted in or on the substrate include a light emitting element and a light sensing element whose optical axes are separated from one another by a wall of a separation member, the separation member being disposed between the substrate and the cover, and wherein the second light blocking region embedded in the cover is aligned substantially with the wall of the separation member.

8. The opto-electronic module of claim 7 further including an optics member disposed between the cover and the separation member, the optics member including optical elements each of which is aligned with a respective one of the plurality of opto-electronic devices.

9. The opto-electronic module of claim 3 wherein the plurality of opto-electronic devices mounted in or on the substrate include a first light emitting element, a second light emitting element and a light sensing element, wherein optical axes of adjacent ones of the opto-electronic devices are separated from one another by respective partitions that are substantially non-transparent to light at wavelengths emitted by the first and second light emitting elements, and wherein the cover includes a plurality of second light blocking regions, each of which is aligned substantially with one of the partitions.

10. The opto-electronic module of claim 9 wherein the second light blocking regions are composed of an epoxy.

11. The opto-electronic module of claim 9 wherein the second light blocking regions are composed of a UV- or thermally-curing material.

12. The opto-electronic module of claim 9 wherein each of the second light blocking regions and the partitions has an absorbance of at least three for wavelengths emitted by the first and second light emitting elements.

13. The opto-electronic module of claim 12 wherein each of the second light blocking regions extends through a majority of a thickness of the cover from its lower surface to its upper surface.

14. An opto-electronic module comprising:
a substrate in which or on which are mounted a plurality of opto-electronic devices;
an optics member including at least one optical element, each optical element being aligned with a respective one of the plurality of opto-electronic devices; and
a separation member disposed between the substrate and the optics member, the separation member having a partition that separates adjacent ones of the opto-electronic devices from one another,
wherein the optics member includes a light blocking portion that is substantially non-transparent to wavelengths of light emitted by or sensed by the respective opto-electronic devices, wherein the light blocking portion is disposed over the partition of the separation member, and
wherein a convex-shaped light blocking element is disposed on the light blocking portion of the optics member at an exterior surface of the opto-electronic module and projects slightly beyond the exterior surface of the optics member.

15. The opto-electronic module of claim 14 wherein the light blocking element is substantially non-transparent to wavelengths of light emitted by or sensed by the respective opto-electronic devices.

16. The opto-electronic module of claim 14 ,
wherein the plurality of opto-electronic devices mounted in or on the substrate include a first light emitting element, a second light emitting element and a light sensing element, wherein optical axes of adjacent ones of the opto-electronic devices are separated from one another by respective partitions formed by the separation member, wherein the partitions are substantially non-transparent to light at wavelengths emitted by the first and second light emitting elements,
wherein the optics member includes a plurality of light blocking portions that are substantially non-transparent to wavelengths of light emitted by or sensed by the respective opto-electronic devices, wherein each light blocking portion is disposed over a respective one of the partitions of the separation member, and
wherein a light blocking element is disposed on each of the light blocking portions of the optics member at an exterior surface of the opto-electronic module.

17. The opto-electronic module of claim 14 wherein the light blocking element is embossed on an outer surface of the optics member.

Assignees

• Heptagon Micro Optics Pte Ltd

Inventors

• Rossi Markus
• Geiger Jens

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H01L2924/00

  Electricity · mapped topic

• H01L33/58

  Electricity · mapped topic

• H01L31/02325

  Electricity · mapped topic

• H01L25/165

  Electricity · mapped topic