High-speed optical module with flexible printed circuit board
US-9323014-B2 · Apr 26, 2016 · US
Optical coupling module
US9613886B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9613886-B2 |
| Application number | US-201414472390-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 29, 2014 |
| Priority date | Aug 29, 2013 |
| Publication date | Apr 4, 2017 |
| Grant date | Apr 4, 2017 |
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Abstract
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An optical coupling module includes a silicon photonic substrate, and an optical waveguide module. The silicon photonic substrate has a first surface and a first grating on the first surface for diffracting the light which passes through the grating. The optical waveguide module is disposed on the silicon photonic substrate, wherein the optical waveguide module includes an optical waveguide having an end disposed in corresponding to the first grating of the silicon photonic substrate. Otherwise, the optical waveguide module has a reflective surface coupled to the end of the optical waveguide and adapted to reflect the light emerging from or incident into the grating to form an optical path between the silicon photonic substrate and the optical waveguide for transmitting the light.
First claim
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What is claimed is: 1. An optical coupling module, comprising: a silicon photonic substrate adapted to transmit a light, wherein the silicon photonic substrate has a first surface and a second surface opposite to the first surface, a first grating disposed in the first surface for diffracting the light which passes through the first grating; an optical waveguide module disposed on the second surface of the silicon photonic substrate, wherein the optical waveguide module comprises an optical waveguide having an end disposed in corresponding to the first grating of the silicon photonic substrate; and an interposer, wherein the silicon photonic substrate is bonded to the interposer by facing the second surface to the interposer and a light guiding portion is disposed between the first grating and the second surface and penetrates through the silicon photonic substrate for transmitting the light between the first grating and the end of the optical waveguide. 2. The optical coupling module as claimed in claim 1 , wherein the optical waveguide module is fixed to the interposer. 3. The optical coupling module as claimed in claim 1 , wherein the reflective surface is formed on the interposer and faces the end of the optical waveguide. 4. The optical coupling module as claimed in claim 1 , wherein the reflective surface is set at an angle relative to a longitudinal axis of the optical waveguide, and the angle is ranged from 30 degrees to 70 degrees. 5. The optical coupling module as claimed in claim 1 , wherein the optical waveguide is a fiber. 6. An optical coupling module, comprising: a silicon photonic substrate adapted to transmit a light, wherein the silicon photonic substrate has a first surface and a second surface opposite to the first surface, a first grating disposed on the first surface for diffracting the light which passes through the first grating; an optical waveguide module disposed on the silicon photonic substrate, wherein the optical waveguide module comprises an optical waveguide having an end disposed in corresponding to the first grating of the silicon photonic substrate, and the optical waveguide module has a reflective surface coupled to the end of the optical waveguide and adapted to reflect the light emerging from or incident into the first grating, to form an optical path between the silicon photonic substrate and the optical waveguide for transmitting the light; and an interposer, wherein the silicon photonic substrate is bonded to the interposer by facing the second surface to the interposer and a light guiding portion is disposed between the first grating and the second surface for transmitting the light between the first grating and the end of the optical waveguide, the light guiding portion is composed of at least one light guiding hole, and at least one metal reflective layer is on the wall of the light guiding hole.
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Top-view shapes · CPC title
Die-attach connectors and bond wires · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between stacked chips · CPC title
changes in dispositions · CPC title
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- What does patent US9613886B2 cover?
- An optical coupling module includes a silicon photonic substrate, and an optical waveguide module. The silicon photonic substrate has a first surface and a first grating on the first surface for diffracting the light which passes through the grating. The optical waveguide module is disposed on the silicon photonic substrate, wherein the optical waveguide module includes an optical waveguide hav…
- Who is the assignee on this patent?
- Ind Tech Res Inst
- What technology area does this patent fall under?
- Primary CPC classification H10W20/20. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 04 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).