Replaceable upper chamber section of plasma processing apparatus

US9613834B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9613834-B2
Application numberUS-74814110-A
CountryUS
Kind codeB2
Filing dateMar 26, 2010
Priority dateMar 27, 2009
Publication dateApr 4, 2017
Grant dateApr 4, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A replaceable upper chamber section of a plasma reaction chamber in which semiconductor substrates can be processed comprises a monolithic metal cylinder having a conical inner surface which is widest at a lower end thereof, an upper flange extending horizontally outward away from the conical inner surface and a lower flange extending horizontally away from the conical inner surface. The cylinder includes an upper annular vacuum sealing surface adapted to seal against a dielectric window of the plasma chamber and a lower annular vacuum sealing surface adapted to seal against a bottom section of the plasma chamber. A thermal mass at an upper portion of the cylinder is effective to provide azimuthal temperature uniformity of the conical inner surface. A thermal choke is located at a lower portion of the cylinder and is effective to minimize transfer of heat across the lower vacuum sealing surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A replaceable upper chamber section of a plasma reaction chamber in which semiconductor substrates can be processed, comprising: a monolithic metal cylinder having a conical inner surface which has a largest diameter at a lower end thereof, an upper flange extending horizontally outward away from the conical inner surface and a lower flange extending horizontally away from the conical inner surface; an upper annular vacuum sealing surface adapted to seal against a dielectric window of the plasma chamber; a lower annular vacuum sealing surface adapted to seal against a bottom section of the plasma chamber; a thermal choke at a lower portion of the cylinder effective to minimize transfer of heat across the lower vacuum sealing surface, the thermal choke defined by a thin metal section having a thickness of less than 0.25 inch and extending at least 25% of the length of the conical inner surface; and a thermal mass section at an upper portion of the cylinder, the thermal mass section defined by a portion of the cylinder between the conical inner surface, an outer surface extending vertically from the upper flange, a horizontal surface extending from an upper end of the thermal choke, and the upper flange. 2. The replaceable upper chamber section of claim 1 , wherein the upper and lower vacuum sealing surfaces include at least one annular groove therein adapted to receive an O-ring. 3. The replaceable upper chamber section of claim 1 , wherein the upper flange includes a recessed surface extending horizontally at least 1inch from the outer surface and the upper vacuum sealing surface extends horizontally at least 1 inch, the outer surface is spaced from the conical inner surface by at least 1 inch at a lower end of the outer surface and the outer surface is spaced from the conical inner surface by at least 2 inches at an upper end of the outer surface. 4. The replaceable upper chamber section of claim 1 , wherein the outer surface is recessed and includes an alignment pin hole adapted to receive an alignment pin used to position a heating and cooling arrangement on the outer surface. 5. The replaceable upper chamber section of claim 1 , including at least one temperature probe mounting hole extending into the upper flange. 6. The replaceable upper chamber section of claim 1 , wherein the conical inner surface includes a plurality of mounting holes adapted to mount gas injectors therein. 7. The replaceable upper chamber section of claim 1 , wherein the upper flange includes mounting holes adapted to receive an RF coil mounting assembly which positions an RF coil above the dielectric window. 8. The replaceable upper chamber section of claim 1 , wherein the conical inner surface includes a thermally sprayed yttria coating thereon. 9. The replaceable upper chamber section of claim 1 , wherein the cylinder is anodized aluminum. 10. The replaceable upper chamber section of claim 1 , comprising: a heating and cooling arrangement, which mounts around the outer surface. 11. The replaceable upper chamber section of claim 1 , wherein the upper annular vacuum sealing surface has a greater surface area than the lower annular vacuum sealing surface. 12. The replaceable upper chamber section of claim 1 , wherein the horizontal surface is spaced from the upper recessed surface by at least two inches. 13. The replaceable upper chamber section of claim 1 , wherein the thermal choke extends from the vacuum sealing surface to the thermal mass section of the cylinder. 14. A replaceable upper chamber section of a plasma reaction chamber in which semiconductor substrates can be processed, comprising: a monolithic metal cylinder having a conical inner surface which has a largest diameter at a lower end thereof, an upper flange extending horizontally outward away from the conical inner surface and a lower flange extending horizontally away from the conical inner surface; an upper annular vacuum sealing surface adapted to seal against a dielectric window of the plasma chamber, and a lower annular vacuum sealing surface adapted to seal against a bottom section of the plasma chamber, the upper annular vacuum sealing surface having a greater surface area than the lower annular vacuum sealing surface; a thermal choke at a lower portion of the cylinder effective to minimize transfer of heat across the lower vacuum sealing surface, the thermal choke defined by a thin metal section having a thickness of less than 0.25 inch and extending at least 25% of the length of the conical inner surface; and a thermal mass section at an upper portion of the cylinder, the thermal mass section defined by a portion of the cylinder between the conical inner surface, an outer surface extending vertically from the upper flange, a horizontal surface extending from an upper end of the thermal choke, and the upper flange, and wherein the thermal choke extends from the vacuum sealing surface to the thermal mass section of the cylinder. 15. The replaceable upper chamber section of claim 14 , wherein the upper and lower vacuum sealing surfaces include at least one annular groove therein adapted to receive an O-ring. 16. The replaceable upper chamber section of claim 14 , comprising: a heating and cooling arrangement, which mounts around the outer surface. 17. The replaceable upper chamber section of claim 14 , wherein the conical inner surface includes a thermally sprayed yttria coating thereon. 18. The replaceable upper chamber section of claim 14 , wherein the cylinder is anodized aluminum.

Assignees

Inventors

Classifications

  • characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

  • Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

  • for drying etching · CPC title

  • Vessel · CPC title

  • Electricity · mapped topic

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What does patent US9613834B2 cover?
A replaceable upper chamber section of a plasma reaction chamber in which semiconductor substrates can be processed comprises a monolithic metal cylinder having a conical inner surface which is widest at a lower end thereof, an upper flange extending horizontally outward away from the conical inner surface and a lower flange extending horizontally away from the conical inner surface. The cylind…
Who is the assignee on this patent?
Sharpless Leonard J, Singh Harmeet, Kang Michael S, and 1 more
What technology area does this patent fall under?
Primary CPC classification H10P72/0421. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 04 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).