Electrical component and method for establishing contact with an electrical component

US9613773B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9613773-B2
Application numberUS-201314431726-A
CountryUS
Kind codeB2
Filing dateSep 9, 2013
Priority dateSep 28, 2012
Publication dateApr 4, 2017
Grant dateApr 4, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electrical component includes at least one external contact having a first metallization and a second metallization. The metallizations are fired and the second metallization only partly covers the first metallization. Furthermore, an electrical component includes at least one frame-shaped metallization. Furthermore, an electrical component includes a first and second metallization that have a different wettability with solder material.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electrical component, comprising an external contact overlying a component body, the external contact having a first metallization and a second metallization, arranged on the first metallization, wherein the first and second metallizations are fired, wherein the second metallization only partly covers the first metallization, wherein the second metallization is U-shaped, wherein the U-shape has two legs and a connecting portion connecting the two legs, and wherein the legs and the connecting portion lie directly on the first metallization. 2. The electrical component according to claim 1 , wherein the first and second metallizations have a different wettability with solder material. 3. The electrical component according to claim 1 , wherein the first metallization has a glass portion and wherein the second metallization has no glass portion. 4. The electrical component according to claim 1 , wherein the first metallization has a glass portion and wherein the second metallization has a smaller glass portion than the first metallization. 5. The electrical component according to claim 1 , wherein the second metallization has at least one cutout. 6. The electrical component according to claim 1 , wherein the first metallization is embodied as a continuous area without any cutouts. 7. The electrical component according to claim 1 , wherein the second metallization has at least one cutout. 8. The electrical component according to claim 1 , further comprising a contact element soldered on the second metallization. 9. The electrical component according to claim 8 , wherein the contact element has a fabric structure. 10. The electrical component according to claim 8 , further comprising a contact-connection fixed to the contact element, wherein the contact-connection is not arranged above the second metallization. 11. The electrical component according to claim 10 , wherein the contact-connection is embodied as a contact pin. 12. An electrical component, comprising an external contact having a first metallization and a second metallization arranged on the first metallization, wherein the first and second metallizations are fired, wherein the second metallization has a cut-out, wherein the first metallization is present beneath the cut-out, and wherein the first metallization has a smaller wettability with solder material than the second metallization. 13. A method for establishing electrical contact with an electrical component, the method comprising: providing a main body of an electrical component; applying a first metallic paste on an outer side of the main body; firing the first metallic paste to form a first metallization; applying a second metallic paste to the first metallization; and firing the second metallic paste to form a second metallization. 14. The method according to claim 13 , wherein the second metallization is formed so as to only partly cover the first metallization. 15. The method according to claim 13 , wherein the second metallization is formed in a U-shaped fashion. 16. The method according to claim 13 , wherein the first metallization has a glass portion and wherein the second metallization has no glass portion or a smaller glass portion than the first metallization.

Assignees

Inventors

Classifications

  • Apparatus or processes specially adapted to the manufacture of relays or parts thereof · CPC title

  • Terminal arrangements · CPC title

  • H01H57/00Primary

    Electrostrictive relays; Piezoelectric relays · CPC title

  • Electricity · mapped topic

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US9613773B2 cover?
An electrical component includes at least one external contact having a first metallization and a second metallization. The metallizations are fired and the second metallization only partly covers the first metallization. Furthermore, an electrical component includes at least one frame-shaped metallization. Furthermore, an electrical component includes a first and second metallization that have…
Who is the assignee on this patent?
Epcos Ag
What technology area does this patent fall under?
Primary CPC classification H01H57/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 04 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).