Ultra-broadband photonic integrated circuit platform and ultra-broadband photonic integrated circuit

Patent metadata

Field	Value
Publication number	US-9612398-B2
Application number	US-201514884917-A
Country	US
Kind code	B2
Filing date	Oct 16, 2015
Priority date	Oct 17, 2014
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

An ultra-broadband photonic integrated circuit platform that combines at least two types of waveguides that each transmit in different, but overlapping, spectral bands on a single chip. By combining the multiple waveguides, the bandwidth of the platform can be extended beyond the bandwidth of either waveguide alone. In an exemplary embodiment, an ultra-broadband photonic integrated circuit includes a nitride-on-insulator (NOI) waveguide configured to transmit optical beams in a first spectral band and a silicon-on-nitride-on-insulator (SONOI) waveguide configured to transmit optical beams in a second band, where the same material serves as the core material in the NOI waveguide and as the cladding material in the SONOI waveguide. In some embodiments, light-emitting devices are bonded to an upper surface of the waveguides. In some embodiments, the circuit includes beam-combining elements so that a single beam combining all of the input wavelengths is output from the circuit.

First claim

What is claimed is:

1. An ultra-broadband photonic integrated circuit platform, comprising:
a first waveguide and a second waveguide situated on a single chip, the first waveguide being configured to transmit optical signals having wavelengths in a first spectral band (“Band 1”) and the second waveguide being configured to transmit optical signals having wavelengths in a second spectral band (“Band 2”), the wavelengths in Band 1 overlapping the wavelengths in Band 2;
wherein the first and second waveguide each comprise a heterostructure comprising a core layer, a bottom cladding layer and a top cladding layer;
wherein the same layer of material forms both a core of the first waveguide and the bottom cladding layer of the second waveguide; and
wherein an overall bandwidth of the platform is greater than either Band 1 or Band 2.

2. The ultra-broadband photonic integrated circuit platform according to claim 1 , wherein the first waveguide is a nitride-on-insulator (NOI) waveguide and the second waveguide is a silicon-on-nitride-on-insulator (SONOI) waveguide; and
further wherein a single layer of Si 3 N 4 forms the core of the NOI and the bottom cladding layer of the SONOI.

3. The ultra-broadband photonic integrated circuit platform according to claim 2 , wherein the NOI waveguide further comprises an SiO 2 cladding layer disposed on the Si 3 N 4 core.

4. The ultra-broadband photonic integrated circuit platform according to claim 1 , wherein the bottom cladding layer in at least one of the first and second waveguides is silicon, silicon oxide, silicon nitride, aluminum oxide, titanium oxide, or tantalum pentoxide.

5. The ultra-broadband photonic integrated circuit platform according to claim 1 , wherein the core in the one of the first and second waveguides is germanium.

6. The ultra-broadband photonic integrated circuit platform according to claim 1 , wherein the top cladding layer in at least one of the first and second waveguides is silicon, silicon oxide, silicon nitride, aluminum oxide, titanium oxide, tantalum pentoxide, or air.

7. The ultra-broadband photonic integrated circuit platform according to claim 1 , wherein the second waveguide is a SONOI waveguide and further includes an additional cladding layer comprising a layer of silicon nitride, titanium oxide, aluminum oxide, tantalum pentoxide, III/V semiconductor material, or germanium tin alloy.

8. The ultra-broadband photonic integrated circuit platform according to claim 1 , further comprising a third waveguide on the single chip, the third waveguide being configured to transmit optical signals in a third wavelength band, the third waveguide comprising a corresponding bottom cladding layer and core layer, wherein the material forming the core of the second waveguide forms a bottom cladding layer of the third waveguide.

9. The ultra-broadband photonic integrated circuit platform according to claim 8 , wherein the second waveguide comprises a silicon core and the third waveguide comprises a germanium core and a silicon bottom cladding layer, the silicon bottom cladding layer comprising the same material layer as the silicon core of the second waveguide.

10. The ultra-broadband photonic integrated circuit platform according to claim 1 , wherein Band 1 comprises wavelengths in the ultraviolet (UV) to near-infrared (NIR) and Band 2 comprises wavelengths in the NIR to midwave infrared (MWIR).

11. The ultra-broadband photonic integrated circuit platform according to claim 1 , further comprising a beam-combining element configured to receive optical signals from the first and second waveguides and to output a single optical beam combining all of the wavelengths in Band 1 and Band 2.

12. The ultra-broadband photonic integrated circuit platform according to claim 11 , wherein the beam-combining element includes a membrane waveguide.

13. The ultra-broadband photonic integrated circuit platform according to claim 11 , wherein the beam-combining element includes a suspended waveguide.

14. An ultra-broadband photonic integrated circuit, comprising:
a single chip,
a first region of the chip containing at least one active and/or passive first optoelectronic device element operating at wavelengths in a first spectral band (“Band 1”), the first optoelectronic device elements being coupled to corresponding first waveguides configured to transmit in Band 1, and a second region of the chip containing at least one active and/or passive second optoelectronic device element operating at wavelengths in a second spectral band (“Band 2”), the second optoelectronic device elements being coupled to corresponding second waveguides configured to transmit in Band 2, the wavelengths in Band 1 overlapping the wavelengths in Band 2;
wherein the first and second waveguides each comprise a corresponding heterostructure comprising a core layer and a cladding layer;
wherein the same layer of material forms both a core of at least one of the first waveguides and a cladding layer of at least one of the second waveguides; and
wherein the circuit can operate at wavelengths in a spectral band broader than either Band 1 or Band 2.

15. The ultra-broadband photonic integrated circuit according to claim 14 , wherein the first waveguides are nitride-on-insulator (NOI) waveguides and the second waveguides are silicon-on-nitride-on-insulator (SONOI) waveguides; and
further wherein a single layer of Si 3 N 4 forms the core of the NOI and the cladding of the SONOI waveguides.

16. The ultra-broadband photonic integrated circuit according to claim 14 , wherein the NOI waveguide further comprises an SiO 2 cladding layer deposited on the Si 3 N 4 core.

17. The ultra-broadband photonic integrated circuit according to claim 14 , wherein Band 1 comprises wavelengths in the ultraviolet (UV) to near-infrared (NIR) and Band 2 comprises wavelengths in the NIR to midwave infrared (MWIR).

18. The ultra-broadband photonic integrated circuit according to claim 14 , further comprising a beam-combining element configured to receive optical signals in Band 1 from one of the first waveguides and in Band 2 from one of the second waveguides and to output a single optical beam combining all of the wavelengths in Band 1 and Band 2.

19. The ultra-broadband photonic integrated circuit according to claim 18 , wherein the beam-combining element is an ultra-broadband combiner.

20. The ultra-broadband photonic integrated circuit according to claim 18 , wherein the beam-combining element includes a membrane waveguide.

21. The ultra-broadband photonic integrated circuit according to claim 18 , wherein the beam-combining element comprises a suspended waveguide.

22. An ultra-broadband photonic integrated circuit, comprising:
a first light-emitting device bonded to an upper surface of a first waveguide circuit, the first light-emitting device being configured to emit light having wavelengths in a first spectral band (“Band 1”) and the waveguides in the first waveguide circuit being configured to transmit light having wavelengths in Band 1; and
a second light-emitting device bonded to an upper surface of a second waveguide circuit, the second light-emitting device being configured to emit light having wavelengths in a second spectral band (“Band 2”) and the waveguides in the second waveguide circuit being configured to transmit light having wavelengths in Band 2, the wavelengths in Band 1 overlapping the wavelengths in Band 2;
wherein the first and second waveguide circuits are situated on a si

Assignees

• Us Navy

Inventors

• Vurgaftman Igor
• Meyer Jerry R
• Heck Martijn
• Bovington Jock
• Spott Alexander
• Stanton Eric
• Bowers John

Classifications

• G02B6/122

  Basic optical elements, e.g. light-guiding paths · CPC title

• G02B6/13 Primary

  Integrated optical circuits characterised by the manufacturing method · CPC title

• G02B6/12011

  characterised by the arrayed waveguides, e.g. comprising a filled groove in the array section · CPC title

• G02B6/12019

  characterised by the optical interconnection to or from the AWG devices, e.g. integration or coupling with lasers or photodiodes (coupling integrated waveguide to fibre G02B6/30, to optoelectronic element G02B6/42; monolithic integration of integrated waveguides with other optical elements G02B6/12004) · CPC title

• G02B6/12004

  Combinations of two or more optical elements · CPC title