Composite heat-dissipation substrate and manufacturing method of the same

Patent metadata

Field	Value
Publication number	US-9611415-B2
Application number	US-201414553161-A
Country	US
Kind code	B2
Filing date	Nov 25, 2014
Priority date	Feb 20, 2012
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

The present disclosure provides a composite heat-dissipation substrate and a method of manufacturing the same. The composite heat-dissipation substrate includes a first ceramic layer having insulating properties, a second porous ceramic layer and a metal layer, wherein the first ceramic layer and the second ceramic layer are continuously connected to each other so as not to form an interface therebetween, and the metal layer is infiltrated into plural pores of the second ceramic layer to be coupled to the ceramic layers, whereby interfacial coupling force between the ceramic layers and the metal layer is very high, thereby providing significantly improved heat dissipation characteristics.

First claim

What is claimed is:

1. A composite heat-dissipation substrate comprising:
a first ceramic layer having insulating properties;
a second porous ceramic layer; and
a metal layer,
wherein the first ceramic layer and the second ceramic layer are continuously connected to each other so as not to form an interface therebetween, and the metal layer is infiltrated into plural pores of the second ceramic layer to be coupled to the ceramic layers,
wherein the first ceramic layer has a higher density than the second ceramic layer and a density difference between the first ceramic layer and the second ceramic layer ranges from 0.1 g/cm 3 to 3 g/cm 3 .

2. The composite heat-dissipation substrate according to claim 1 , wherein the first ceramic layer and the second ceramic layer have a thermal conductivity of 1 W/m·K or more at room temperature.

3. The composite heat-dissipation substrate according to claim 2 , wherein the first ceramic layer and the second ceramic layer independently comprise at least one selected from carbides group of SiC and B 4 C, oxides group of Al 2 O 3 , MgO and SiO 2 , and nitrides group of AlN, Si 3 N 4 and BN.

4. The composite heat-dissipation substrate according to claim 1 , wherein the first ceramic layer and the second ceramic layer comprise a ceramic material having a coefficient of thermal expansion of 12×10 −6 or less and an insulation resistance of 10 5 Ωcm or more.

5. The composite heat-dissipation substrate according to claim 1 , wherein the metal layer comprises a metal having a thermal conductivity of 50 W/m·K or more at room temperature.

6. The composite heat-dissipation substrate according to claim 5 , wherein the metal comprises at least one selected from Al, Al alloys, Mg, Mg alloys, Cu and Cu alloys.

7. A composite heat-dissipation substrate comprising:
a first ceramic layer having insulating properties;
a second porous ceramic layer; and
a metal layer,
wherein the first ceramic layer and the second ceramic layer are continuously connected to each other so as not to form an interface therebetween, and the metal layer is infiltrated into plural pores of the second ceramic layer to be coupled to the ceramic layers,
wherein the first ceramic layer has a higher density than the second ceramic layer.

8. The composite heat-dissipation substrate according to claim 7 , wherein a density difference between the first ceramic layer and the second ceramic layer ranges from 0.1 g/cm 3 to 3 g/cm 3 .

9. The composite heat-dissipation substrate according to claim 7 , wherein the first ceramic layer and the second ceramic layer have a thermal conductivity of 1 W/m·K or more at room temperature.

10. The composite heat-dissipation substrate according to claim 1 , wherein the first ceramic layer and the second ceramic layer comprise a ceramic material having a coefficient of thermal expansion of 12×10 −6 or less and an insulation resistance of 10 5 Ωcm or more.

11. The composite heat-dissipation substrate according to claim 9 , wherein the first ceramic layer and the second ceramic layer independently comprise at least one selected from carbides group of SiC and B 4 C, oxides group of Al 2 O 3 , MgO and SiO 2 , and nitrides group of AlN, Si 3 N 4 and BN.

12. The composite heat-dissipation substrate according to claim 7 , wherein the metal layer comprises a metal having a thermal conductivity of 50 W/m·K or more at room temperature.

13. The composite heat-dissipation substrate according to claim 12 , wherein the metal comprises at least one selected from Al, Al alloys, Mg, Mg alloys, Cu and Cu alloys.

Assignees

• Korea Mach & Materials Inst

Inventors

• Lee Sang-Kwan
• Lee Sang-Bok
• Yun Jung-Yeul

Classifications

• H10W40/259

  Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/257

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• C04B38/00

  Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof (treating slag with gases or gas generating material C04B5/06 {; expanded graphite C04B35/536}) · CPC title

• H01L23/3733

  Electricity · mapped topic

• B32B15/04

  comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)} · CPC title