Composite structure and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-9610750-B2
Application number	US-201214131730-A
Country	US
Kind code	B2
Filing date	Jun 15, 2012
Priority date	Jul 20, 2011
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

There is provided a composite structure including: at least two substrates which are made of thermoplastic resin and which are bonded by thermocompression; and at least one member which is made of a material whose heat distortion temperature is higher than a heat distortion temperature of the thermoplastic resin and which is inserted into a space formed in at least one of the substrates. The member inserted in the space is fixed and held by wall surfaces which form the space of the substrates and which are thermally deformed by thermocompression.

First claim

The invention claimed is:

1. A microchip comprising:
at least two substrates each comprising a thermoplastic resin and which are bonded by thermocompression;
a first flow path formed in at least one of the substrates;
a space provided in at least one of the substrates and which separates a first portion of the first flow path from a second portion of the first flow path;
at least one member comprising a material whose heat distortion temperature is higher than a heat distortion temperature of the thermoplastic resin and which is provided in the space, the at least one member including at least one engagement end including a protrusion extending into a recess formed between the at least two substrates;
a second flow path formed in the member; and
a light irradiated portion where light is irradiated onto the microchip,
wherein the member provided in the space is fixed and the protrusion is held within the recess by wall surfaces which form the recess and which are thermally deformed by thermocompression,
wherein the member is in contact with at least a part of a surface of at least one of the substrates,
wherein the light irradiated portion of the microchip corresponds to the member, and
wherein the member is positioned in the space such that the first portion of the first flow path is linked to the second flow path at a first end of the member and the second portion of the first flow path is linked to the second flow path at a second end of the member.

2. The microchip according to claim 1 , wherein
a position of the member in the space is determined by the wall surfaces.

3. The microchip according to claim 1 , wherein the light irradiated portion is a portion where light is irradiated onto one of a liquid that flows through the second flow path and a sample contained in the liquid, and wherein the member comprises a material having a higher optical transparency than that of the thermoplastic resin that forms the substrates.

4. The microchip according to claim 1 , wherein the member is bonded to at least one of the substrates.

5. The microchip according to claim 1 , wherein each of the first end and the second end of the member comprises an engagement end including a protrusion, and for each engagement end, at least a portion of each of the wall surfaces is not in contact with the engagement end when the wall surfaces are thermally contracted.

6. The microchip according to claim 1 , wherein the member comprises a material having a higher optical transparency than that of the thermoplastic resin that forms the substrates.

7. The microchip according to claim 1 , wherein the member comprises a glass material.

8. The microchip according to claim 1 , wherein at a connection point where the first flow path is linked to the second flow path, a diameter of the first flow path is approximately a same diameter as that of the second flow path.

9. The microchip according to claim 1 , wherein the protrusion is bonded within the recess by thermocompression.

10. The microchip according to claim 1 , wherein the at least two substrates overlap the protrusion at the recess.

11. A microchip comprising:
at least two substrates each comprising a thermoplastic resin and which are bonded by thermocompression;
a space provided in at least one of the substrates; and
at least one member comprising a material whose heat distortion temperature is higher than a heat distortion temperature of the thermoplastic resin and which is provided in the space, the at least one member including at least one engagement end including a protrusion extending into a recess formed between the at least two substrates;
wherein the member provided in the space is fixed and the protrusion is held within the recess by wall surfaces which form the recess and which are thermally deformed by thermocompression,
wherein the member is in contact with at least a part of a surface of at least one of the substrates, and
wherein the member comprises a material having a higher optical transparency than that of the thermoplastic resin that forms the substrates.

12. The microchip according to claim 11 , wherein:
a first flow path is formed in at least one of the substrates,
the space separates a first portion of the first flow path from a second portion of the first flow path,
a second flow path is formed in the member, and
the member is positioned in the space such that the first portion of the first flow path is linked to the second flow path at a first end of the member and the second portion of the first flow path is linked to the second flow path at a second end of the member.

13. The microchip according to claim 11 , wherein at a connection point where the first flow path is linked to the second flow path, a diameter of the first flow path is approximately a same diameter as that of the second flow path.

14. A microchip comprising:
at least two substrates each comprising a thermoplastic resin and which are bonded by thermocompression;
a space provided in at least one of the substrates; and
at least one member comprising a material whose heat distortion temperature is higher than a heat distortion temperature of the thermoplastic resin and which is provided in the space, the at least one member including at least one engagement end including a protrusion extending into a recess formed between the at least two substrates;
wherein the member provided in the space is fixed and the protrusion is held within the recess by wall surfaces which form the recess and which are thermally deformed by thermocompression,
wherein the member is in contact with at least a part of a surface of at least one of the substrates, and
wherein the member comprises a glass material.

15. The microchip according to claim 14 , wherein:
a first flow path is formed in at least one of the substrates,
the space separates a first portion of the first flow path from a second portion of the first flow path,
a second flow path is formed in the member, and
the member is positioned in the space such that the first portion of the first flow path is linked to the second flow path at a first end of the member and the second portion of the first flow path is linked to the second flow path at a second end of the member.

16. The microchip according to claim 14 , wherein at a connection point where the first flow path is linked to the second flow path, a diameter of the first flow path is approximately a same diameter as that of the second flow path.

Assignees

• Yukumoto Tomomi
• Yamasaki Takeshi
• Akiyama Shoji
• Akiyama Yuji
• Sony Corp

Inventors

• Yukumoto Tomomi
• Yamasaki Takeshi
• Akiyama Shoji
• Akiyama Yuji

Classifications

• B32B3/30 Primary

  characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

• B01L2300/0645

  Electrodes · CPC title

• B32B27/08

  of synthetic resin · CPC title

• B01L2300/0654

  Lenses; Optical fibres · CPC title

• G01N2021/513

  Cuvettes for scattering measurements · CPC title