Composite of resin and other materials and method for manufacturing the same

US9610717B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9610717-B2
Application numberUS-201414513591-A
CountryUS
Kind codeB2
Filing dateOct 14, 2014
Priority dateOct 18, 2013
Publication dateApr 4, 2017
Grant dateApr 4, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for manufacturing composite of resin and other materials includes the following steps. A shaped piece made by materials different with resin is provided, and is degreased and cleaned. A resist layer with a lot of location holes is formed on the surface of the heterogeneous member by nano-imprint lithography, and a lot of small holes are formed on the surface of the heterogeneous member while the resist layer is removed. Then the heterogeneous member is inserted in an injection mold, and molten crystalline thermoplastic resin is injected into the mold, thus the resin embedded into the holes and bonding with the shaped piece. The method is environmentally friendly and suitable for mass production.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a composite of resin and other materials, comprising: providing a shaped piece made of at least one material different than resin; cleaning the shaped piece with a degreasing agent solution; forming a photoresist layer with a plurality of locating holes on a surface of the shaped piece by nano-imprint lithography, wherein the locating holes are blind holes and remains of the photoresist layer is positioned below the locating holes; forming a plurality of small holes on the surface of the shaped piece by plasma etching, simultaneously removing the remains of the photoresist layer below the locating holes by plasma etching, and removing the whole photoresist layer; inserting the shaped piece in an injection mold; and injecting a molten resin material on the shaped piece, the resin material combining with the shaped piece as the resin material cools. 2. The method as claimed in claim 1 , wherein the at least one material of the shaped piece is selected from the group consisting of metal, alloy, ceramic, glass, and mixtures thereof. 3. The method as claimed in claim 1 , wherein the resin material is a crystallized-type thermoplastic resin. 4. The method as claimed in claim 3 , wherein the resin material is selected from the group consisting of a composite of polyphenylene sulfide and glass fiber, polyamide, polyethylene terephthalate, or polybutylene terephthalate. 5. The method as claimed in claim 1 , wherein a diameter of the small hole is in a range of about 50 nm to about 500 nm, and a breadth depth ratio of the small hole is in a range of about 1:1 to about 1:10. 6. The method as claimed in claim 1 , wherein the small holes are arranged in an array on the surface of the shaped piece. 7. The method as claimed in claim 1 , wherein the small holes are formed by isotropic plasma etching under normal pressure. 8. The method as claimed in claim 1 , wherein the nano-imprint lithography process comprises the steps of forming a photoresist layer on a surface of the shaped piece and forming a plurality of locating holes on the photoresist layer by nano-imprint lithography. 9. The method as claimed in claim 7 , wherein the locating holes are arranged in an array in the photoresist layer.

Assignees

Inventors

Classifications

  • 2 layers · CPC title

  • Thermoplastic materials · CPC title

  • Glass fibres · CPC title

  • Thermoplastics · CPC title

  • Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

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Frequently asked questions

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What does patent US9610717B2 cover?
A method for manufacturing composite of resin and other materials includes the following steps. A shaped piece made by materials different with resin is provided, and is degreased and cleaned. A resist layer with a lot of location holes is formed on the surface of the heterogeneous member by nano-imprint lithography, and a lot of small holes are formed on the surface of the heterogeneous member…
Who is the assignee on this patent?
Fu Tai Hua Ind (Shenzhen) Co Ltd, Hon Hai Prec Ind Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C45/14311. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 04 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).