Method of supplying solder to printed circuit board

Patent metadata

Field	Value
Publication number	US-9609795-B2
Application number	US-201313962773-A
Country	US
Kind code	B2
Filing date	Aug 8, 2013
Priority date	Oct 31, 2012
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

Provided is a solder supply method of supplying, onto a mask sheet, solder to be printed on a printed circuit board. The method includes calculating an amount of solder supplied for a plurality of points in an X direction that is a lengthwise direction of a squeegee, and changing the amount of solder supplied at each point in the X direction based on a result of the calculation.

First claim

What is claimed is:

1. A solder supply method for a printing apparatus which includes a solder supply nozzle, a mask sheet, and a squeegee extending in an X-direction that is a lengthwise direction thereof such that, under control of a controller, solder is supplied onto the mask sheet via the solder supply nozzle and the squeegee is moved on the mask sheet along a Y-direction perpendicular to the X-direction so that solder is to be printed on a printed circuit board placed underneath the mask sheet, the method comprising:
(A) causing a detection sensor to detect an amount of a remaining solder remaining on the mask sheet for a plurality of points in the X direction of the squeegee after a first process of printing the solder and before a second process of printing the solder,
(B) causing the controller to calculate an amount of solder to be supplied on the mask sheet for a plurality of points in the X direction based on a detecting result of the detection sensor;
(C) causing the controller to change the amount of solder supplied at each point on the mask sheet in the X direction from the solder supply nozzle based on a result of the calculation, and
(D) causing the solder supply nozzle to supply solder with an amount corresponding to a result of the change on the mask sheet for preparation of the second process of printing the solder.

2. The solder supply method according to claim 1 , wherein:
causing the detection sensor to measure a solder width, in a Y direction, of the solder remaining on the mask sheet, at each point in the X direction, the Y direction being defined as a moving direction of the squeegee, and
causing the controller to calculate the amount of solder supplied at each point in the X direction by comparing the measured solder width at each point in the X direction with a predetermined target value for a remaining solder width, the point in the X direction being a point with a measured solder width that is smaller than the target value.

3. The solder supply method according to claim 2 , wherein measurement positions in the X direction which conform to a predetermined measurement condition are determined based on inspection data on the mask sheet, and
the solder width is measured for the determined measurement positions.

4. The solder supply method according to claim 1 , wherein:
causing the detection sensor to measure a height, at each point in a Y direction, of the solder remaining on the mask sheet, at each point in the X direction, the Y direction being defined as a moving direction of the squeegee;
causing the controller, at each point in the X direction, to calculate a cross-sectional area of the remaining solder based on the measured height at each point in the Y direction, and
causing the controller to calculate the amount of solder supplied at each point in the X direction by comparing the calculated cross-sectional area at each point in the X direction with a predetermined target value for a cross-sectional area of the remaining solder, the point in the X direction being a point with a calculated cross-sectional area that is smaller than the target value.

5. The solder supply method according to claim 4 , wherein measurement positions in the X direction which conform to a predetermined measurement condition are determined based on inspection data on the mask sheet, and
the height at each point in the Y direction is measured for the determined measurement positions.

6. A solder supply method for a printing apparatus which includes a solder supply nozzle, a mask sheet, and a squeegee extending in an X-direction that is a lengthwise direction thereof such that, under control of a controller, solder is supplied onto the mask sheet via the solder supply nozzle and the squeegee is moved on the mask sheet along a Y-direction perpendicular to the X-direction so that solder is to be printed on a printed circuit board placed underneath the mask sheet, the method comprising:
(E) causing the controller to calculate an amount of decrease in solder amount at each point in the X direction, which is associated with a first process of printing the solder, based on a cross-sectional area of an opening formed in the mask sheet after the first process of printing the solder and before a second process of printing the solder,
(F) causing the controller to calculate an amount of solder to be supplied on the mask sheet for a plurality of points in the X direction based on a result of the calculation;
(G) causing the controller to change the amount of solder supplied at each point on the mask sheet in the X direction from the solder supply nozzle based on a result of the calculation, and
(H) causing the solder supply nozzle to supply solder with an amount corresponding to a result of the change on the mask sheet for preparation of the second process of printing the solder.

7. The solder supply method according to claim 1 , wherein a discharge pressure for the solder is adjusted to change the amount of solder supplied at each point in the X direction.

8. The solder supply method according to claim 1 , wherein a speed at which a solder supply head configured to supply solder moves in the X direction is adjusted to change the amount of solder supplied at each point in the X direction.

9. The solder supply method according to claim 1 , further comprising:
when a moving range of a nozzle which is provided in a solder supply head configured to supply solder and through which the solder is discharged is shorter than a length of the squeegee,
causing the controller to calculate an amount of solder insufficiency at opposite ends of the moving range based on an insufficiency of the moving range of the nozzle relative to the length of the squeegee and a moving speed of the solder supply head; and
supplying solder in such a manner that the amount of solder supplied at the opposite ends of the moving range of the nozzle is larger than the amount of solder supplied in other places, by the amount of solder insufficiency.

10. The solder supply method according to claim 9 , wherein an amount of solder corresponding to the amount of solder insufficiency is supplied at the opposite ends of the moving range by keeping the nozzle stopped while discharging the solder through the nozzle for a time corresponding to the amount of solder insufficiency.

Assignees

• Yamaha Motor Co Ltd

Inventors

• Narita Yoshitaka
• Fujimoto Takeshi
• Sato Hidetoshi

Classifications

• B41F15/423

  Driving means for reciprocating squeegees · CPC title

• B41F15/0881 Primary

  for printing on polyhedral articles · CPC title

• H05K3/3484

  Electricity · mapped topic

• B41P2215/50

  Screen printing machines for particular purposes · CPC title

• Y10T29/49004

  including measuring or testing of device or component part · CPC title