Molded casing, mold assembly and forming method

US9609772B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9609772-B2
Application numberUS-201615086070-A
CountryUS
Kind codeB2
Filing dateMar 31, 2016
Priority dateApr 16, 2013
Publication dateMar 28, 2017
Grant dateMar 28, 2017

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A molded casing suitable for a handheld electronic device is provided. The handheld electronic device includes a body and the molded casing, and at least one part of the body is covered with the molded casing. The molded casing is in a uniform thickness and has a continuous mosaic surface. The mosaic surface is composed of a plurality of non-coplanar polygons, wherein an intersection line is formed between any two adjacent polygons. An end of any one of the intersection lines is connected to an end of another intersection line or an edge of the mosaic surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A molded casing, suitable for a handheld electronic device, wherein the handheld electronic device comprises a body and the molded casing, at least one part of the body is covered with the molded casing, wherein the molded casing is in a uniform thickness, and has a continuous mosaic surface, the mosaic surface is composed of a plurality of non-coplanar polygons, an intersection line is formed between any two adjacent polygons, and an end of any one of the intersection lines is connected to an end of another intersection line or an edge of the mosaic surface. 2. The molded casing as claimed in claim 1 , wherein each of the polygons comprises triangle or quadrangle. 3. The molded casing as claimed in claim 1 , wherein the molded casing is a back cover of the handheld electronic device. 4. The molded casing as claimed in claim 1 , wherein an equivalence radius of a vertex angle at each intersection line is less than or equal to 0.1 millimeter. 5. The molded casing as claimed in claim 1 , wherein any two adjacent polygons of the mosaic surface are plane and oriented in different directions from each other.

Assignees

Inventors

Classifications

  • Housings or casings incorporating or embedding electric or electronic elements · CPC title

  • Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

  • having locally depressed lines, e.g. hinges · CPC title

  • with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs] · CPC title

  • of articles of definite length, i.e. discrete articles {(B29C35/0227 takes precedence)} · CPC title

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Frequently asked questions

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What does patent US9609772B2 cover?
A molded casing suitable for a handheld electronic device is provided. The handheld electronic device includes a body and the molded casing, and at least one part of the body is covered with the molded casing. The molded casing is in a uniform thickness and has a continuous mosaic surface. The mosaic surface is composed of a plurality of non-coplanar polygons, wherein an intersection line is fo…
Who is the assignee on this patent?
Htc Corp
What technology area does this patent fall under?
Primary CPC classification H05K5/0243. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 28 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).