On-chip waveguide feeder for millimeter wave ICS and feeding methods, and multiple input and output millimeter wave transceiver system using same

Patent metadata

Field	Value
Publication number	US-9608313-B2
Application number	US-201615096743-A
Country	US
Kind code	B2
Filing date	Apr 12, 2016
Priority date	Apr 13, 2015
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

Provided is a waveguide feeder. The waveguide feeder includes: a probe aligned at a center of a waveguide aperture at a metal wiring layer of a semiconductor substrate to input and output an electric signal; and an open stub located at a contact surface of a waveguide flange on a ground surface of a semiconductor chip in order to form a ground path of the probe on a surface of the waveguide flange.

First claim

What is claimed is:

1. A waveguide feeder comprising:
a semiconductor substrate;
a probe located at a semiconductor metal wiring layer to output an electric signal as an electromagnetic wave or to convert the electromagnetic wave into the electric signal; and
an open stub located at a contact surface of an aperture flange in order to form a ground path of the probe on a metallic aperture or a surface of the waveguide flange,
wherein the probe and the open stub are configured on the semiconductor substrate.

2. The waveguide feeder of claim 1 , wherein the open stub is configured at a ground surface on the semiconductor substrate which is aligned the contact surface of the waveguide flange.

3. The waveguide feeder of claim 1 , wherein the open stub has a butterfly shape or a rectangular shape, and an upper blade of the open stub is aligned parallel to a lower metal surface of the aperture.

4. The waveguide feeder of claim 1 , wherein the probe is electrically insulated from the open stub.

5. The waveguide feeder of claim 1 , wherein the open stub and the probe are configured by forming a semiconductor wiring layer in a single layer or a multi-layer to be connected to each other through a via, and
the open stub is connected to the semiconductor substrate through a contact via.

6. The waveguide feeder of claim 1 , wherein the open stub has a length of L 2 , the length L 2 is adjusted to configure a short circuit with the waveguide flange surface under a chip when a termination of the open stub is viewed from a drive point of a center of the open stub.

7. The waveguide feeder of claim 1 , wherein the probe comprises two poles having a U shape at a termination of the probe.

8. The waveguide feeder of claim 7 , wherein the probe having the U shape is provided parallel to the open probe facing a top surface of the probe by a predetermined length so that a slot line mode is formed.

9. The waveguide feeder of claim 1 , wherein the semiconductor substrate is located at a center of the waveguide aperture rightward and leftward and is aligned at an upper blade surface of the open stub and a bottom surface of the aperture of the waveguide upward and downward.

10. The waveguide feeder of claim 1 , wherein a metal reflector is installed at a point spaced apart from the aperture of the waveguide by a predetermined distance D, and the distance D is adjusted according to an operation frequency.

11. The waveguide feeder of claim 1 , wherein an aperture having a rectangular shape formed on a metal surface on a dielectric substrate is driven using the probe and is used as an aperture antenna.

12. The waveguide feeder of claim 1 , wherein a single pole probe is integrally formed with the open stub.

13. The waveguide feeder of claim 1 , wherein the waveguide feeder has a structure to couple a signal with a transmission line located at a rear surface of an aperture by driving an aperture having a rectangular shape formed on a metal surface on a dielectric substrate using a single pole probe.

14. A transmitter module embedding an on-chip waveguide feeder, the transmitter module comprising:
an on-chip waveguide feeder configured to transfer a millimeter wave signal to a waveguide;
a power amplifier connected to the waveguide feeder to amplify a signal; and
a frequency divider configured to receive a reference signal to provide the millimeter wave signal,
wherein waveguide feeder comprises:
a semiconductor substrate;
a probe located at an aperture of a waveguide to input and output an electric signal; and
an open stub located at a contact surface of a waveguide flange in order to form a ground path of the probe on a waveguide flange surface,
wherein the probe and the open stub are configured on the semiconductor substrate.

15. The transmitter module of claim 14 , wherein the open stub is configured at a ground surface on the semiconductor substrate which is aligned at the contact surface of the waveguide flange.

16. A receiver module embedding an on-chip waveguide feeder, the receiver module comprising:
an on-chip waveguide feeder configured to receive a millimeter wave signal;
a low noise amplifier connected to the waveguide feeder to low-noise amplify the received millimeter wave signal;
a frequency mixer configured to convert the low-noise amplified signal into a predetermined band; and
a frequency divider configured to transfer a location oscillation signal of the frequency mixer,
wherein waveguide feeder comprises:
a semiconductor substrate;
a probe located at an aperture of a waveguide to receive an electric signal; and
an open stub located at a contact surface of a waveguide flange in order to form a ground path of the probe on a waveguide flange surface,
wherein the probe and the open stub are configured on the semiconductor substrate.

17. The receiver module of claim 16 , wherein the open stub is configured at a ground surface on the semiconductor substrate which is aligned at the contact surface of the waveguide flange.

18. A multi-dimensional array transceiver comprising:
a plurality of waveguides configured to serve as an aperture antenna by forming an aperture at a metal surface; and
a plurality of transceiving chips having a waveguide feeder structure, the waveguide feeder structure comprises:
a semiconductor substrate;
a probe located at an aperture of a waveguide to receive an electric signal; and
an open stub located at a contact surface of a waveguide flange in order to form a ground path of the probe on a waveguide flange surface,
wherein the probe and the open stub are configured on the semiconductor substrate.

Assignees

• Univ Sungkyunkwan Res & Bus

Inventors

• Kim Byung Sung
• CUI Cheng Lin

Classifications

• H10W44/248

  for antennas · CPC title

• H10W44/226

  for HF amplifiers · CPC title

• H10W44/216

  Waveguides, e.g. strip lines · CPC title

• H10W44/20 Primary

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H01Q13/065

  provided with a flange or a choke · CPC title