Semiconductor substrate-based system for an RFID device, RFID device, and method for manufacturing such a semiconductor substrate-based system

Patent metadata

Field	Value
Publication number	US-9608307-B2
Application number	US-201113105632-A
Country	US
Kind code	B2
Filing date	May 11, 2011
Priority date	May 11, 2010
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A semiconductor substrate-based system for an RFID device, in particular an RFID transponder, having a semiconductor substrate and an electronic circuit system which is structured on the semiconductor substrate is provided. The semiconductor substrate-based system also has a thin-layer battery, likewise structured on the semiconductor substrate, for supplying power to the RFID device. Moreover, an RFID device having a corresponding semiconductor substrate-based system, and a method for manufacturing a corresponding semiconductor substrate-based system are provided.

First claim

What is claimed is:

1. A semiconductor substrate-based system for an RFID device, the system comprising:
a semiconductor substrate;
an electronic circuit system integrated directly with the semiconductor substrate and without an additional printed circuit board; and
a thin-layer battery integrated directly with the semiconductor substrate and configured to supply power to the RFID device and without an additional printed circuit board,
wherein the thin-layer battery is a three-dimensional thin-layer battery in which a high surface storage density is achieved by providing a structured substrate surface which is enlarged compared to a planar substrate surface.

2. The system as recited in claim 1 , wherein:
the circuit system is situated on a first side of the semiconductor substrate; and
the thin-layer battery is situated on an opposite, second side of the semiconductor substrate.

3. The system as recited in claim 1 , wherein the thin-layer battery configured to supply power to the RFID device is electrically connected to the circuit system via connecting structures integrated with the semiconductor substrate.

4. The system as recited in claim 3 , wherein the connecting structures are feedthroughs.

5. The system as recited in claim 3 , wherein the connecting structures include feedthroughs.

6. The system as recited in claim 1 , wherein the thin-layer battery configured to supply power to the RFID device is electrically connected to the circuit system via wiring external to the substrate.

7. The system as recited in claim 2 , wherein the thin-layer battery configured to supply power to the RFID device is electrically connected to the circuit system via wiring external to the substrate.

8. The system as recited in claim 1 , further comprising at least one antenna terminal contact for an antenna situated on the semiconductor substrate.

9. The system as recited in claim 1 , wherein the RFID device is an RFID transponder.

10. An RFID device comprising:
a semiconductor substrate-based system as recited in claim 1 ; and
an antenna.

11. The RFID device as recited in claim 10 , wherein:
the antenna is connected to the semiconductor substrate-based system via a support which supports the antenna; and
an antenna contact of the antenna electrically contacts the antenna terminal contact.

12. The RFID device as recited in claim 11 , wherein the support is adhesion-capable or self-adhesive.

13. The RFID device as recited in claim 10 , wherein the RFID device is an RFID transponder.

14. The system as recited in claim 1 , wherein the thin-layer battery is entirely within the semiconductor substrate.

15. The system as recited in claim 1 , further comprising an encapsulating layer completely covering and protecting at least one side of the semiconductor substrate against environmental influences.

16. A method for manufacturing a semiconductor substrate-based system for an RFID device, comprising:
directly integrating an electronic circuit system for the RFID device with a semiconductor substrate and without an additional printed circuit board;
directly integrating a thin-layer battery configured to supply power to the RFID device with the same semiconductor substrate and without an additional printed circuit board,
wherein the thin-layer battery is a three-dimensional thin-layer battery in which a high surface storage density is achieved by providing a structured substrate surface which is enlarged compared to a planar substrate surface; and
connecting the thin-layer battery to the circuit system.

17. The method as recited in claim 16 , wherein the RFID device is an RFID transponder.

Assignees

• Pirk Tjalf
• Krauss Andreas
• Bohne Laura
• Wolff Janpeter
• Bosch Gmbh Robert

Inventors

• Pirk Tjalf
• Krauss Andreas
• Bohne Laura
• Wolff Janpeter

Classifications

• G06K19/0702

  the arrangement including a battery · CPC title

• H01Q1/2283 Primary

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• G06K19/07749

  the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title

• H01Q1/2225

  used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal · CPC title

• H01M6/40

  Printed batteries {, e.g. thin film batteries} · CPC title