Group III-V Device with a Selectively Modified Impurity Concentration
US-2015380497-A1 · Dec 31, 2015 · US
US9608101B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9608101-B2 |
| Application number | US-201213976757-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 4, 2012 |
| Priority date | Jan 4, 2011 |
| Publication date | Mar 28, 2017 |
| Grant date | Mar 28, 2017 |
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The present invention concerns semiconductor devices comprising a source electrode, a drain electrode and a semiconducting layer consisting of a single or double 2-dimensional layer(s) made from one of the following materials: MoS 2 , MoSe 2 , WS 2 , WSe 2 , MoTe 2 or WTe 2 . Replacing a stack by only one or two 2-dimensional layer(s) of MoS 2 , MoSe 2 , WS 2 , or WSe 2 , MoTe 2 or WTe 2 provides an enhanced electrostatic control, low power dissipation, direct band gap and tunability.
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The invention claimed is: 1. A semiconductor device comprising: a source electrode; a drain electrode; a semiconducting layer consisting of a single 2-dimensional layer made from one of the following materials: MoS 2 , MoSe 2 , WS 2 , WSe 2 , MoTe 2 or WTe 2 ; a gate electrode, wherein said gate electrode extends over said source electrode and said drain electrode; and a dielectric layer placed between said semiconducting layer and said gate electrode, wherein said dielectric layer is configured to form a protective layer on said semiconducting layer. 2. Semiconductor device according to claim 1 devoid of a top gate electrode and a top dielectric layer. 3. Sensor based on a semiconductor device according to claim 2 . 4. Semiconductor device according to claim 1 comprising a second gate electrode. 5. Semiconductor device according to claim 4 wherein said second gate electrode is embedded within an oxide layer. 6. Semiconductor device according to claim 1 , wherein said semiconducting layer is a nanosized layer. 7. Semiconductor device according to claim 6 wherein said semiconducting layer is between 0.5 and 1.5 nm thick. 8. Semiconductor device according to claim 1 , wherein at least one of said electrodes is made of graphene. 9. Semiconductor device according to claim 1 , wherein said dielectric layer is made of HfO 2 . 10. Transistor comprising a semiconductor device according to claim 1 . 11. Digital inverter comprising a semiconductor device according to claim 1 . 12. A semiconductor device comprising: a source electrode; a drain electrode; a first gate electrode; a second gate electrode; a semiconducting layer consisting of a single 2-dimensional layer made from one of the following materials: MoS 2 , MoSe 2 , WS 2 , and WSe 2 ; and a dielectric layer placed between said semiconducting layer and said first gate electrode; and dielectric later being configured to protect said semiconducting layer. 13. A semiconductor device according to claim 12 wherein said first gate electrode is extending over said source electrode and said drain electrode. 14. A semiconductor device according to claim 12 wherein said first gate electrode is embedded within said dielectric layer. 15. A sensor based on the semiconductor device according to claim 12 . 16. A semiconductor device according to claim 12 wherein said second gate electrode is embedded within an oxide layer. 17. A semiconductor device according to claim 12 , wherein said semiconducting layer is a nanosized layer. 18. A semiconductor device according to claim 17 wherein said semiconducting layer is between 0.5 and 1.5 nm thick. 19. A semiconductor device according to claim 12 , wherein at least one of said electrodes is made of graphene. 20. A semiconductor device according to claim 12 , wherein said dielectric layer is made of HfO 2 . 21. A transistor comprising the semiconductor device according to claim 12 . 22. A digital inverter comprising the semiconductor device according to claim 12 . 23. A semiconductor device comprising: a source electrode; a drain electrode; a semiconducting layer comprising two or fewer 2-dimensional layers made from one of the following materials: MoS 2 , MoSe 2 , WS 2 , WSe 2 , MoTe 2 or WTe 2 ; a gate electrode, wherein said gate electrode extends over said source electrode and said drain electrode; a dielectric layer placed between said semiconducting layer and said gate electrode, wherein said dielectric layer is configured to form a protective layer on said semiconducting layer; and a second gate electrode, wherein said second gate electrode is embedded within an oxide layer. 24. Semiconductor device according to claim 23 , wherein at least one of said electrodes is made of graphene and wherein said dielectric layer is made of HfO 2 . 25. A semiconductor device comprising: a source electrode; a drain electrode; a semiconducting layer consisting of a single 2-dimensional layer made from one of the following materials: MoS 2 , MoSe 2 , WS 2 , WSe 2 , MoTe 2 or WTe 2 ; a gate electrode, wherein said gate electrode is embedded within a dielectric layer; and said dielectric layer placed between said semiconducting layer and said gate electrode, wherein said dielectric layer is configured to form a protective layer on said semiconducting layer. 26. The semiconductor device of claim 25 , wherein the device is devoid of a top gate electrode and a top dielectric layer. 27. A sensor based on a semiconductor device according to claim 25 . 28. The semiconductor device of claim 25 , further comprising a second gate electrode. 29. The semiconductor device of claim 25 , wherein said second gate electrode is embedded within an oxide layer. 30. A semiconductor device comprising: a source electrode; a drain electrode; a gate electrode; a semiconducting layer consisting of a single 2-dimensional layer made from one of the following materials: MoS 2 , MoSe 2 , WS 2 , and WSe 2 ; and a dielectric layer placed between said semiconducting layer and said gate electrode, wherein said dielectric layer is made of a high dielectric constant dielectric layer.
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