Display panel and display device including the same
US-2024397774-A1 · Nov 28, 2024 · US
US9608049B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9608049-B2 |
| Application number | US-201414504098-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 1, 2014 |
| Priority date | Oct 15, 2013 |
| Publication date | Mar 28, 2017 |
| Grant date | Mar 28, 2017 |
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An organic light emitting diode (OLED) display includes a flexible substrate, a barrier layer disposed on the flexible substrate, and an organic light emitting diode disposed on the barrier layer. The barrier layer includes a plurality of metal layers and a plurality of insulation layers in which the metal layers and the insulation layers are alternatively stacked with each other on the flexible substrate.
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What is claimed is: 1. An organic light emitting diode (OLED) display comprising: a flexible substrate; a barrier layer disposed on the flexible substrate; and an organic light emitting diode disposed on the barrier layer, wherein the barrier layer includes a plurality of metal layers, including at least a first and second metal layer, and a plurality of insulation layers, including at least a first and second insulation layer, wherein the first insulation layer is disposed directly on the flexible substrate, the first metal layer is disposed directly on the first insulation layer, a first metal oxide layer is disposed directly on the first metal layer, the second insulation layer is disposed directly on the first metal oxide layer, the second metal layer is disposed directly on the second insulation layer, and a second metal oxide layer is disposed directly on the second metal layer, and wherein the first metal oxide layer and the second metal oxide layer each have a thickness of about 2 μm to about 3 μm. 2. The OLED display of claim 1 , wherein the metal layers comprise at least one selected from a group consisting of aluminum, molybdenum, titanium, copper, nickel, chromium, tungsten, and tin. 3. The OLED display of claim 2 , wherein each of the metal layers have a thickness of about 0.01 μm to about 10 μm. 4. The OLED display of claim 1 , further comprising a buffer layer comprising an inorganic layer disposed between the barrier layer and the organic light emitting diode, and wherein one of the insulation layers is disposed at an outermost side of the barrier layer that contacts the buffer layer. 5. The OLED display of claim 1 , wherein the insulation layers comprise an organic layer. 6. The OLED display of claim 5 , wherein the organic layers comprise at least one selected from a group consisting of polyethylene terephthalate, a polyimide, a polycarbonate, an epoxy, a polyethylene, and a polyacrylate. 7. The OLED display of claim 1 , wherein the insulation layers comprise an inorganic layer. 8. The OLED display of claim 7 , wherein the inorganic layers comprise at least one selected from a group consisting of a silicon oxide (SiO x ), a silicon nitride (SiN x ), alumina (Al 2 O 3 ), indium tin oxide (ITO), titanium oxide (TiO 2 ), and gallium arsenide (GaAs). 9. An organic light emitting diode (OILED) display comprising: a flexible substrate; a barrier layer disposed on the flexible substrate; a buffer layer disposed on the barrier layer; a thin film transistor disposed on the buffer layer; a capacitor disposed on the buffer layer; a passivation layer disposed on the thin film transistor and the capacitor; an organic light emitting diode disposed on the passivation layer, wherein the organic light emitting diode is electrically connected with the thin film transistor; and a thin film encapsulation layer encapsulating the organic light emitting diode, wherein the thin film encapsulation layer includes a plurality of organic layers and a plurality of inorganic layers alternately stacked with each other on the organic light emitting diode, wherein the barrier layer includes a plurality of metal layers, including at least a first and second metal layer, and a plurality of insulation layers, including at least a first, second, and third insulation layer, wherein the first insulation layer is disposed directly on the flexible substrate, the first metal layer is disposed directly on the first insulation layer, a first metal oxide layer is disposed directly on the first metal layer, the second insulation layer is disposed directly on the first metal oxide layer, the second metal layer is disposed directly on the second insulation layer, a second metal oxide layer is disposed directly on the second metal layer, and the third insulation layer is disposed directly on the second metal oxide layer, and wherein an uppermost one of the insulation layers contacts the buffer layer and a lowermost one of the insulation layers contacts the flexible substrate, and wherein the first metal oxide layer and the second metal oxide layer each have a thickness of about 2 μm to about 3 μm. 10. The OLED display of claim 9 , wherein the organic layers of the thin film encapsulation layer comprise at least one selected from the group consisting of polyethylene terephthalate, a polyimide, a polycarbonate, an epoxy, a polyethylene, and a polyacrylate, and wherein the inorganic layers of the thin film encapsulation layer comprise at least one of a metal oxide and a metal nitride. 11. The OLED display of claim 9 , wherein the inorganic layers comprise at least one selected from the group consisting of silicon nitride (SiN x ), aluminum oxide (Al 2 O 3 ), silicon oxide (SiO x ), and titanium oxide (TiO 2 ). 12. The OLED display of claim 9 , further comprising a gate insulating layer and an interlayer insulating layer, wherein the thin film transistor includes a semiconductor layer, a gate electrode, a source electrode and a drain electrode, wherein the gate insulating layer is disposed between the semiconductor layer and the gate electrode and wherein the interlayer insulating layer is disposed between the gate electrode and the source electrode and the drain electrode, wherein the capacitor includes a first capacitor plate disposed on the gate insulating layer and a second capacitor plate disposed on the interlayer insulating layer, wherein the first capacitor plate is made of a same material as the gate electrode, wherein the second capacitor plate is made of a same material as the source and drain electrodes, and wherein the second capacitor plate is connected to the source electrode. 13. The OLED display of claim 12 , wherein the passivation layer includes a via hole therein that partially exposes the drain electrode, wherein the organic light emitting diode includes a pixel electrode disposed on the passivation layer, an organic emission layer disposed on the pixel electrode, and a common electrode disposed on the organic emission layer, and wherein the pixel electrode is electrically connected with the drain electrode through the via hole in the passivation layer. 14. The OLED display of claim 13 , further comprising a pixel defining layer disposed on the pixel electrode, and wherein the organic emission layer is disposed in an opening of the pixel defining layer and contacts the pixel electrode.
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