Semiconductor device

Patent metadata

Field	Value
Publication number	US-9607961-B2
Application number	US-201615059860-A
Country	US
Kind code	B2
Filing date	Mar 3, 2016
Priority date	Mar 4, 2015
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A semiconductor device includes a semiconductor substrate, a front surface electrode provided on a front surface of the semiconductor substrate, a solder layer, and a metal member fixed to a front surface of the front surface electrode via the solder layer. The solder layer includes an inner solder portion positioned inner than an end portion of the metal member and an outer solder portion positioned outer than the end portion of the metal member, relative to a direction along the front surface of the semiconductor substrate. The semiconductor substrate includes an inner substrate portion positioned below the inner solder portion and an outer substrate portion positioned below the outer solder portion. A density of carriers that flow from the outer substrate portion to the front surface electrode is lower than a density of carriers that flow from the inner substrate portion to the front surface electrode.

First claim

What is claimed is:

1. A semiconductor device comprising:
a semiconductor substrate;
a front surface electrode provided on a front surface of the semiconductor substrate;
a solder layer; and
a metal member fixed to a front surface of the front surface electrode via the solder layer,
wherein
the solder layer comprises an inner solder portion positioned inner than an end portion of the metal member and an outer solder portion positioned outer than the end portion of the metal member, relative to a direction along the front surface of the semiconductor substrate,
the semiconductor substrate comprises an inner substrate portion positioned below the inner solder portion and an outer substrate portion positioned below the outer solder portion, and
a density of carriers that flow from the outer substrate portion to the front surface electrode is lower than a density of carriers that flow from the inner substrate portion to the front surface electrode.

2. The semiconductor device according to claim 1 , wherein
a plurality of gate trenches is provided in the semiconductor substrate, wherein the gate trenches extend from the front surface of the semiconductor substrate along a depth direction of the semiconductor substrate, and
a density of the gate trenches in the outer substrate portion is lower than a density of the gate trenches in the inner substrate portion.

3. The semiconductor device according to claim 1 , wherein
a plurality of emitter regions is provided in an area exposed on the front surface of the semiconductor substrate, and
a density of the emitter regions in the outer substrate portion is lower than a density of the emitter regions in the inner substrate portion.

4. The semiconductor device according to claim 1 , wherein
at least one collector region is provided in an area exposed on a back surface of the semiconductor substrate, and
a density of the collector regions in the outer substrate portion is lower than a density of the collector regions in the inner substrate portion.

5. The semiconductor device according to claim 2 , wherein
a body region extending along the depth direction of the semiconductor substrate is provided in an area being in contact with the gate trenches, and
a bottom end portion of the body region in the outer substrate portion is located at a shallower position in the semiconductor substrate than a bottom end portion of the body region in the inner substrate portion.

Assignees

• Toyota Motor Co Ltd

Inventors

• Sato Tomohiko

Classifications

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title

• H10W72/941

  Dispositions of bond pads · CPC title

• H10W72/934

  Cross-sectional shape, i.e. in side view · CPC title