Semiconductor device and heat-dissipating mechanism

Patent metadata

Field	Value
Publication number	US-9607922-B2
Application number	US-201414778684-A
Country	US
Kind code	B2
Filing date	Mar 3, 2014
Priority date	Mar 26, 2013
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A semiconductor device includes a semiconductor chip which can be a heat-generating semiconductor chip or a semiconductor relay substrate in which an integrated circuit or wiring is built in. A sintered-silver-coated film is adhered on a surface layer part of the semiconductor substrate, interposed by a silicon oxide film. A heat-dissipating fin (heat sink), which may be copper or aluminum, is bonded on the sintered-silver-coated film, interposed by an adhesive layer.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a heat-generating semiconductor package made of ceramic material or resin housing a heat-generating semiconductor substrate incorporated with an integrated circuit or wirings;
a silver thin film manufactured from nano-silver particles and formed by a coating method in a closely adhering manner on one surface of the semiconductor package; and
a silicon oxidation film having a film thickness of 1 nm or more formed at an adhesion interface between the semiconductor package and the silver thin film.

2. The semiconductor device of claim 1 , comprising a heat sink thermally coupled to the silver thin film.

3. The semiconductor device of claim 1 , wherein the silicon oxidation film has a film thickness of 1 to 200 nm.

4. The semiconductor device of claim 1 , wherein the nano-silver particles have an average particle diameter of 10 to 200 nm and a particle diameter of 5 nm or more at 20% in cumulative distribution from the smallest particle diameter in particle size distribution.

Assignees

• Tanaka Precious Metal Ind

Inventors

• Matsuda Kenji
• Shinozaki Dai
• Makita Yuichi
• Kubo Hitoshi
• Ohshima Yusuke
• Matsuda Hidekazu
• Taniuchi Junichi

Classifications

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/25

  characterised by their materials · CPC title

• H10W40/10 Primary

  Arrangements for heating · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title