Substrate heat treatment apparatus

Patent metadata

Field	Value
Publication number	US-9607868-B2
Application number	US-201313915712-A
Country	US
Kind code	B2
Filing date	Jun 12, 2013
Priority date	Dec 21, 2010
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

The present invention provides a substrate heat treatment apparatus capable of uniformly heat a substrate at high speed with less breakage of constituent members due to thermal expansion even at high temperature. An embodiment of the present invention is a substrate heat treatment apparatus to perform heat treatment for a substrate and includes: a peripheral ring capable of supporting the substrate; a connection ring; a lifting device to raise and lower the peripheral ring; balls having a lower heat conductivity than that of the peripheral ring; and a lamp to heat the substrate supported by the peripheral ring. The balls are different members from both of the peripheral ring and the connection ring. The lifting device raises and lowers the peripheral ring between a first position close to the lamp and a second position distant from the lamp.

First claim

The invention claimed is:

1. A substrate heat treatment apparatus to perform heat treatment for a substrate comprising:
a substrate supporting plate that is a ring-shaped plate capable of supporting the substrate;
a lifting mechanism configured to hold the substrate supporting plate and raise and lower the substrate supporting plate;
a linking member linking the substrate supporting plate and the lifting mechanism, the linking member having lower thermal conductivity than that of the substrate supporting plate; and
a heating means for heating the substrate supported by the substrate supporting plate from above the substrate supporting plate in the gravity direction,
wherein the linking member is a member different from both the substrate supporting plate and the lifting mechanism,
the lifting mechanism includes a raising and lowering means for raising and lowering the substrate supporting plate between a first position close to the heating means and a second position distant from the heating means,
the linking member is a ball,
the substrate supporting plate includes a first groove provided in a lower surface that is a part of the substrate supporting plate in the gravity direction,
the lifting mechanism includes a substrate supporting plate holding portion that is a ring-shaped plate capable of holding the substrate supporting plate and a second groove provided in an upper surface that is part of the substrate supporting plate holding portion in the gravity direction,
a longitudinal direction of the first groove coincides with a radial direction of the substrate supporting plate,
a longitudinal direction of the second groove coincides with a radial direction of the substrate supporting plate holding portion, and
the lifting mechanism holds the substrate supporting plate with the ball sandwiched between the first and second grooves.

2. The substrate heat treatment apparatus according to claim 1 , wherein at least one of the first and second grooves is a V-groove having a V-shaped cross-section, and the first groove, the second groove, and the ball form a positioning mechanism by wedge action exerted when the ball is in contact with a slope surface of the V-groove.

3. The substrate heat treatment apparatus according to claim 2 , wherein the first groove is a V-groove, and the ball has a diameter longer than a height of the recess of the second groove.

Assignees

• Canon Anelva Corp

Inventors

• Okada Takuji
• Nakazawa Toshikazu
• Suzuki Naoyuki

Classifications

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/7606

  characterised by edge clamping, e.g. clamping ring · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H10P34/00

  Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices · CPC title