Apparatus of plural charged-particle beams

US9607805B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9607805-B2
Application numberUS-201615150858-A
CountryUS
Kind codeB2
Filing dateMay 10, 2016
Priority dateMay 12, 2015
Publication dateMar 28, 2017
Grant dateMar 28, 2017

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Abstract

Official abstract text for this publication.

One modified source-conversion unit and one method to reduce the Coulomb Effect in a multi-beam apparatus are proposed. In the modified source-conversion unit, the aberration-compensation function is carried out after the image-forming function has changed each beamlet to be on-axis locally, and therefore avoids undesired aberrations due to the beamlet tilting/shifting. A Coulomb-effect-reduction means with plural Coulomb-effect-reduction openings is placed close to the single electron source of the apparatus and therefore the electrons not in use can be cut off as early as possible.

First claim

Opening claim text (preview).

What is claimed is: 1. A source-conversion unit of an electron source, comprising: an image-forming means; and a beamlet-limit means with a plurality of beamlet-limit openings, wherein said image-forming means comprises a micro-deflector array with a plurality of micro-deflectors and a micro-compensator array with a plurality of micro-compensators, and each micro-deflector is aligned with one micro-compensator and one beamlet-limit opening, wherein said each micro-deflector deflects one beamlet of an electron beam generated by said electron source to forms one virtual image thereof and enter said one micro-compensator along an optical axis thereof, said one micro-compensator influences said one beamlet to add certain amounts of astigmatism aberration and/or field curvature aberration to said virtual image, and said one beamlet-limit opening cuts off peripheral electrons of said one beamlet and thereby limiting a current thereof. 2. The source-conversion unit according to claim 1 , wherein said one micro-compensator comprises a plurality of combined sub micro-compensators. 3. The source-conversion unit according to claim 2 , wherein said micro-compensator array comprises a first micro-compensator layer with a plurality of first sub micro-compensators and a second micro-compensator layer with a plurality of second sub micro-compensators, one first sub micro-compensator and one second sub micro-compensator aligned with each other are two of said plurality of combined sub micro-compensators. 4. The source-conversion unit according to claim 3 , wherein for said one micro-compensator, said first sub micro-compensator and said second sub micro-compensator are respectively a 4-pole lens and have a 45° difference in orientation. 5. The source-conversion unit according to claim 3 , wherein said micro-compensator array comprises a third micro-compensator layer with a plurality of third sub micro-compensators, and one third sub micro-compensator aligned with said second sub micro-compensator is one of said plurality of combined sub micro-compensators. 6. The source-conversion unit according to claim 5 , wherein for said one micro-compensator, said first sub micro-compensator and said second sub micro-compensator are respectively a 4-pole lens and have a 45° difference in orientation, and said third sub micro-compensator is a round-lens. 7. The source-conversion unit according to claim 1 , wherein said beamlet-limit means is below said micro-deflector array. 8. The source-conversion unit according to claim 1 , further comprising a first-upper electric-conduction plate with a plurality of first-upper through-holes and a first-lower electric-conduction plate with a plurality of first-lower through-holes, which are respectively above and below electrodes of said plurality of micro-deflectors to avoid radiation damage due to said electron beam and keep electric fields thereof therebetween. 9. The source-conversion unit according to claim 1 , further comprising a second-upper electric-conduction plate with a plurality of second-upper through-holes and a second-lower electric-conduction plate with a plurality of second-lower through-holes, which are respectively above and below electrodes of said plurality of micro-compensators to avoid radiation damage due to corresponding beamlets and keep electric fields thereof therebetween. 10. A multi-beam apparatus, comprising: an electron source; a condenser lens below said electron source; a source-conversion unit below said condenser lens; a primary projection imaging system below said source-conversion unit and comprising an objective lens; a deflection scanning unit inside said primary projection imaging system; a sample stage below said primary projection imaging system; a beam separator above said objective lens; a secondary projection imaging system above said beam separator; and an electron detection device with a plurality of detection elements, wherein said source-conversion unit comprises an image-forming means and a beamlet-limit means with a plurality of beam-limit openings, and said image-forming means comprises a micro-deflector array with a plurality of micro-deflectors and a micro-compensator array with a plurality of micro-compensators, said beamlet-limit means is below said micro-deflector array, and an optical axis of each micro-compensator is parallel to a primary optical axis of said apparatus and aligned with one of said plurality of micro-deflectors and one of said plurality of beamlet-limit openings, wherein said electron source, said condenser lens, said source-conversion unit, said primary projection imaging system, said deflection scanning unit and said beam separator are aligned with said primary optical axis, said secondary projection imaging system and said electron detection device are aligned with a secondary optical axis of said apparatus, and said secondary optical axis is not parallel to said primary optical axis, wherein said sample stage sustains a sample with a being-observed surface facing to said objective lens, wherein said electron source generates a primary electron beam along said primary optical axis, said plurality of micro-deflectors respectively deflects a plurality of beamlets of said primary electron beam to be incident onto said plurality of micro-compensators along optical axes thereof and therefore form a plurality of parallel virtual images of said electron source, and said plurality of micro-compensators respectively influences said plurality of beamlets with certain amounts of astigmatism aberrations and/or field curvature aberrations, wherein said plurality of beam-limit openings respectively cuts off peripheral electrons of said plurality of beamlets and therefore limits currents thereof, and said currents can be varied together by adjusting focusing power of said condenser lens, wherein said primary projection imaging system focuses said plurality of beamlets, images said plurality of parallel virtual images onto said surface and forms a plurality of probe spots thereon, said certain amounts of astigmatism aberrations and/or field curvature aberrations compensate astigmatism aberrations and/or field curvature aberrations generated by said condenser lens and/or said primary projection imaging system so as to reduce sizes of said plurality of probe spots, wherein said deflection scanning unit deflects said plurality of beamlets to scan said plurality of probe spots respectively over a plurality of scanned regions within an observed area on said surface, wherein a plurality of secondary electron beams is generated by said plurality of probe spots respectively from said plurality of scanned regions and in passing focused by said objective lens, said beam separator then deflects said plurality of secondary electron beams to said secondary projection imaging system, said secondary projection imaging system focuses and keeps said plurality of secondary electron beams to be detected by said plurality of detection elements respectively, and each detection element therefore provides an image signal of one corresponding scanned region. 11. The multi-beam apparatus according to claim 10 , wherein said each micro-compensator comprises a plurality of combined sub micro-compensators. 12. The multi-beam apparatus according to claim 11 , wherein said micro-compensator array comprises a first micro-compensator layer with a plurality of first sub micro-compensators and a second micro-compensator layer with a plurality of second sub micro-compensators, and one first sub micro-compensator and one second sub micro-compensator aligned with each other are two of said plurality of combined sub micro-compensat

Assignees

Inventors

Classifications

  • Astigmatism · CPC title

  • Beam forming · CPC title

  • H01J37/147Primary

    Arrangements for directing or deflecting the discharge along a desired path ({H01J37/045 take precedence;} lenses H01J37/10) · CPC title

  • Aberrations · CPC title

  • Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement {(H01J37/32009, H01J37/32623, H01J37/3266, H01J37/32697 take precedence; electron or ion-optical systems for localised treatment of objects H01J37/3007)} · CPC title

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What does patent US9607805B2 cover?
One modified source-conversion unit and one method to reduce the Coulomb Effect in a multi-beam apparatus are proposed. In the modified source-conversion unit, the aberration-compensation function is carried out after the image-forming function has changed each beamlet to be on-axis locally, and therefore avoids undesired aberrations due to the beamlet tilting/shifting. A Coulomb-effect-reducti…
Who is the assignee on this patent?
Hermes Microvision Inc
What technology area does this patent fall under?
Primary CPC classification H01J37/147. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 28 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).