Method and manufacturing system

Patent metadata

Field	Value
Publication number	US-9606532-B2
Application number	US-201414166892-A
Country	US
Kind code	B2
Filing date	Jan 29, 2014
Priority date	Jan 29, 2014
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A method for transporting a group of semiconductor wafers and a manufacturing system are provided. A semiconductor processing facility is provided. The semiconductor processing facility includes a first destination, a second destination, and a transport system configured to transport a group of semiconductor wafers from the first destination to the second destination. Real time information is collected, where the real time information includes information on a current process executing in the semiconductor processing facility and information on a transfer time. The information on the transfer time includes data that indicates an amount of time required to transport the group of semiconductor wafers from the first destination to the second destination. A request is issued to the transport system to effect the transportation of the group of semiconductor wafers from the first destination to the second destination. A timing of the request is based on the first and second data.

First claim

What is claimed is:

1. A method for transporting a group of semiconductor wafers in a semiconductor processing facility, the method comprising:
providing a semiconductor processing facility with i) a first destination and a second destination, and ii) a transport system that transports the group of semiconductor wafers from the first destination to the second destination;
collecting real time information, wherein the real time information includes:
information on a current process executing in the semiconductor processing facility, the information on the current process including first data that indicates an amount of time required to complete the current process, and
information on a transfer time, the information on the transfer time including second data that indicates an amount of time required to transport the group of semiconductor wafers from the first destination to the second destination;

determining a time for issuing a request to the transport system using the first data and the second data; and
issuing the request to the transport system at the determined time to effect the transportation of the group of semiconductor wafers from the first destination to the second destination, wherein the transport system transports i) the group of semiconductor wafers, and ii) a second group of semiconductor wafers from the first destination to the second destination, the method further comprising: determining a first critical step in the processing of the group of semiconductor wafers that limits a throughput more than all other steps in the processing of the group; determining a second critical step in the processing of the second group of semiconductor wafers that limits a throughput more than all other steps in the processing of the second group; and determining a temporal ordering using the first and second critical steps, wherein the temporal ordering dictates whether the group of semiconductor wafers is placed on the transport system before the second group is placed on the transport system.

2. The method of claim 1 , further comprising:
preparing the transport system to effect the transportation of the group of semiconductor wafers, wherein the preparing of the transport system includes moving an overhead transport (OHT) unit of the transport system using the real time information, and wherein the moving of the OHT unit causes the OHT unit to be available to transport the group of semiconductor wafers immediately upon the issuing of the request.

3. The method of claim 1 , wherein the issuing of the request at the determined time causes the group of semiconductor wafers to be available at the second destination upon completion of the current process, such that a chamber or processing equipment at the second destination does not enter an idle state.

4. The method of claim 1 , wherein the current process includes a plurality of steps, the method further comprising:
determining, using the real time information, a critical stage for the current process, the critical stage being a particular step of the plurality of steps, wherein the particular step limits a throughput of the current process more than all other steps of the plurality of steps.

5. The method of claim 4 , further comprising:
determining the critical stage of the current process via a dynamic process, wherein the dynamic process changes the critical stage one or more times using the real time information.

6. The method of claim 4 , wherein the time is determined using the critical stage.

7. The method of claim 1 , wherein the transport transports i) the group of semiconductor wafers, and ii) a second group of semiconductor wafers from the first destination to the second destination, the method further comprising:
determining, using the real time information, a critical stage for the group of semiconductor wafers, the critical stage being a step required in processing the group of semiconductor wafers, wherein the step limits a throughput of the processing of the group of semiconductor wafers more than all other steps required in the processing of the group of semiconductor wafers;
determining, using the real time information, a second critical stage for the second group of semiconductor wafers, the second critical stage being a particular step required in processing the second group of semiconductor wafers, wherein the particular step limits a throughput of the processing of the second group of semiconductor wafers more than all other steps required in the processing of the second group of semiconductor wafers; and
determining a temporal ordering using the critical stage and the second critical stage, wherein the temporal ordering causes the group of semiconductor wafers to be placed on the transport system prior to placing the second group of semiconductor wafers on the transport system.

8. The method of claim 1 , wherein the transport system transports i) the group of semiconductor wafers, and ii) a second group of semiconductor wafers from the first destination to the second destination, the method further comprising:
determining a temporal ordering using the real time information, wherein the temporal ordering causes the group of semiconductor wafers to be placed on the transport system prior to placing the second group of semiconductor wafers on the transport system;
wherein the temporal ordering minimizes an amount of idle time of a chamber or processing equipment at the second destination.

9. The method of claim 1 , wherein the time is not determined using historical data.

10. The method of claim 1 , wherein the first destination includes a stocker that stores the group of semiconductor wafers prior to the transportation, wherein the second destination includes a piece of processing equipment or a processing chamber for processing the group of semiconductor wafers, and wherein the transport system includes an overhead transport (OHT) unit.

11. The method of claim 1 , wherein the transportation of the group of semiconductor wafers from the first destination to the second destination via the transport system comprises placing a lot of semiconductor wafers on a processing line of the semiconductor processing facility.

12. The method of claim 1 , further comprising:
issuing the request to the transport system prior to a time at which the group of semiconductor wafers is required at the second destination, wherein the transportation of the group of semiconductor wafers from the first destination to the second destination begins immediately after the request is issued, and wherein issuing the request at the determined time causes the group of semiconductor wafers to be available at the second destination prior to the time at which the group of semiconductor wafers is required at the second destination.

13. The method of claim 1 , further comprising:
determining the amount of time required to transport the group of semiconductor wafers using the real time information, wherein the transporting includes processing the group of semiconductor wafers to prepare the group of semiconductor wafers to be used at the second destination.

14. The method of claim 1 , further comprising:
determining the amount of time required to transport the group of semiconductor wafers, wherein the transporting includes moving the group of semiconductor wafers via an overhead transport (OHT) unit.

15. The method of claim 1 , wherein the real time information includes:
an amount of time elapsed in the current process;
a percentage of the current process that has been completed;
an estimated time remaining in the process; or
a feedback signal indicating a compl

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Huang Wei-Pin
• Chien Wen-Chi
• Tsai Yuh-Dean
• Cheng bing-yuan
• Wang Wei-Cheng

Classifications

• G05B2219/31376

  MFL material flow · CPC title

• G05B2219/31388

  Just in time JIT, kanban is box to control flow of workpiece · CPC title

• G05B19/4189 Primary

  characterised by the transport system · CPC title

• Y02P90/28

  Cross-Sectional Technologies · mapped topic

• G05B2219/45031

  Manufacturing semiconductor wafers · CPC title