Camera module

Patent metadata

Field	Value
Publication number	US-9606352-B2
Application number	US-201514799580-A
Country	US
Kind code	B2
Filing date	Jul 15, 2015
Priority date	Aug 29, 2014
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A camera module is provided which has a simple structure, can be easily assembled, can avoid the adverse effects of dust on imaging, and can promote heat dissipation of an imaging device. In a camera module, which includes a lens unit that has a cylindrical thread portion, a flat plate-shaped imaging device that is mounted on a printed wiring board, and a holder that holds the lens unit and the printed wiring board with maintaining the predetermined positional relationship therebetween, an imaging field of the imaging device is disposed in a space tightly closed by a first spacer that is made into a ring shape made of an elastic material the surface of which is an adhesive surface, and the adhesive surface is exposed at least in an inner peripheral wall of the first spacer. The first spacer may be made of a material that further has favorable thermal conductivity.

First claim

The invention claimed is:

1. A camera module comprising:
a lens unit that has a cylindrical thread portion and an optical axis;
a flat plate-shaped imaging device that is mounted on a printed wiring board;
a holder that has a cylindrical opening that opens along the optical axis of the lens unit and engages with the thread portion, and holds the lens unit and the printed wiring board while maintaining a predetermined positional relationship between the lens unit and the printed wiring board; and
a first spacer that is formed into a ring shape made of an elastic material the surface of which is an adhesive surface, and has a first surface situated on a side of the opening and a second surface situated on a side of the imaging device, the first and second surfaces being parallel with a plane orthogonal to the optical axis of the lens unit and at least one of the first and second surfaces being made into a slidable surface by impairing adhesion properties of the adhesive surface, wherein
the imaging device has an imaging field thereof that is disposed in a space tightly closed by the first spacer between the holder and the printed wiring board, and the adhesive surface is exposed at least in an inner peripheral wall of the first spacer.

2. The camera module according to claim 1 , wherein the first spacer is formed of a material that further has favorable thermal conductivity.

3. The camera module according to claim 1 , wherein:
the holder has a rim flange continued from an open end of the opening on a side of the imaging device along a plane orthogonal to the optical axis of the lens unit;
the first surface is pasted onto the rim flange throughout the entire circumference with the adhesive surface; and
the entire surface of the second surface is made into a slidable surface by impairing adhesion properties of the adhesive surface.

4. The camera module according to claim 3 , wherein the slidable surface is in contact with a light receiving surface of the imaging device with an elastic force throughout the entire circumference.

5. The camera module according to claim 3 , further comprising a second spacer that is formed into a shape surrounding the imaging device, and wherein:
the second spacer is pasted onto a mount surface of the printed wiring board on which the imaging device is mounted;
the second spacer has a height from the mount surface of the printed wiring board to a surface opposed to the rim flange with the height being approximately the same as a height of the imaging device; and
the slidable surface is in contact with the second spacer with an elastic force throughout the entire circumference.

6. The camera module according to claim 3 , wherein the first spacer has an inside diameter smaller than a diameter of the opening.

7. The camera module according to claim 1 , wherein:
the first surface is made into a slidable surface in which adhesion properties of the adhesive surface are impaired throughout the entire surface;
the first surface is in contact with an end surface of the thread portion with an elastic force throughout the entire circumference; and
the second surface is pasted onto a light receiving surface of the imaging device with the adhesive surface throughout the entire circumference.

Assignees

• Smk Kk

Inventors

• Kashima Masayoshi
• Mano Nobuyuki
• Akaiwa Taku

Classifications

• H04N23/52

  Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• G02B13/001

  Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras (G02B23/243 takes precedence) · CPC title

• G02B7/021

  for more than one lens · CPC title