Sensor device and sensor arrangement

Patent metadata

Field	Value
Publication number	US-9605983-B2
Application number	US-201414299563-A
Country	US
Kind code	B2
Filing date	Jun 9, 2014
Priority date	Jun 9, 2014
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A sensor arrangement according to an embodiment includes a board with a plurality of conductive lines of a first type, and a plurality of conductive lines of a second type different from the conductive lines of the first type, and a recess. The sensor arrangement further includes a plurality of sensor devices mechanically accommodated on a main surface of the board and arranged around the recess, each sensor device being electrically coupled to the conductive lines of the first type and at least to one of the conductive lines of the second type, wherein each conductive line of the second type electrically couples a sensor device with at least one other item different from the sensor devices of the plurality of sensor devices. A projection of the conductive lines of the first and second types perpendicular to the main surface is crossing-free. Each conductive line of the first type electrically couples at least all of the plurality of sensor devices.

First claim

What is claimed is:

1. A sensor arrangement comprising:
a board comprising a plurality of conductive lines of a first type, a plurality of conductive lines of a second type different from the conductive lines of the first type, and a recess; and
a plurality of sensor devices mechanically accommodated on a main surface of the board and arranged around the recess, each sensor device being electrically coupled to the conductive lines of the first type and at least to one of the conductive lines of the second type, wherein each conductive line of the second type electrically couples a sensor device with at least one other item different from the sensor devices of the plurality of sensor devices,
wherein a projection of the conductive lines of the first and second types perpendicular to the main surface is crossing-free; and
wherein each conductive line of the first type electrically couples at least all of the plurality of sensor devices.

2. The sensor arrangement according to claim 1 , wherein the recess goes through the board in a direction perpendicular to the main surface.

3. The sensor arrangement according to claim 1 , wherein recess comprises a regular shaped hole comprising a center point.

4. The sensor arrangement according to claim 3 , wherein the regular shape is circular shape, an elliptical shape or a polygonal shape.

5. The sensor arrangement according to claim 3 , wherein the sensor devices each comprise a predefined, device-specific orientation direction, and wherein the plurality of sensor devices are oriented with respect to the center point such that the orientation direction points towards the center point.

6. The sensor arrangement according to claim 3 , wherein the sensor devices are oriented towards the center point such that by rotating the sensor arrangement around the center point by an angle equal to an angle between two sensor devices with respect to the center point, an orientation of at least one of the two sensor devices becomes identical to the other one of the at least two sensor devices.

7. The sensor arrangement according to claim 3 , wherein the recess further comprises an aperture connecting an outer perimeter of the board and the hole.

8. The sensor arrangement according to claim 1 , wherein the conductive lines of the first type are essentially arranged radially inside of the conductive lines of the second type with respect to the recess.

9. The sensor arrangement according to claim 8 , wherein the conductive lines of the first type are arranged radially inside of the conductive lines of the second type with respect to at least 75% of all angles, along which at least one conductive line of the first type and at least one conductive line of the second type are arranged.

10. The sensor arrangement according to claim 1 , wherein the conductive lines of the first and second types comprise traces arranged in a single conductive layer of the board.

11. The sensor arrangement according to claim 10 , wherein all traces of the conductive lines of the first and second types are arranged in a single conductive layer of the board.

12. The sensor arrangement according to claim 1 , wherein the board comprises exactly a single conductive layer.

13. The sensor arrangement according to claim 1 , wherein the sensor devices are identical.

14. The sensor arrangement according to claim 1 , wherein the plurality of sensor devices comprises at least three sensor devices.

15. The sensor arrangement according to claim 1 , wherein the conductive lines of the first type comprise conductive lines to supply the sensor devices with electrical energy, and wherein the conductive lines of the second type comprise conductive lines to carry output sensor signals of the sensor devices.

Assignees

• Infineon Technologies Ag

Inventors

• Ausserlechner Udo

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• G01D5/142 Primary

  using Hall-effect devices (measuring magnetic variables using Hall-effect or other galvanomagnetic devices G01R33/06) · CPC title

• G01D5/24442

  by mounting means · CPC title