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US-2024360115-A1 · Oct 31, 2024 · US
Epoxy resin curing agent
US9605110B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9605110-B2 |
| Application number | US-201314439757-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 21, 2013 |
| Priority date | Nov 1, 2012 |
| Publication date | Mar 28, 2017 |
| Grant date | Mar 28, 2017 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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Abstract
Official abstract text for this publication.
The epoxy resin curing agent of the present invention comprises a compound represented by the following formula (1): wherein R represents a methyl group, an ethyl group, or a hydroxyl group, and n is an integer of 1 to 3.
First claim
Opening claim text (preview).
The invention claimed is: 1. An epoxy resin curing agent comprising a compound represented by the following formula (4): 2. A compound represented by the following formula (4): 3. An epoxy resin composition comprising an epoxy resin, and an epoxy resin curing agent comprising a compound represented by the following formula (1): wherein R represents a methyl group, an ethyl group, or a hydroxyl group, and n is an integer of 1 to 3. 4. The epoxy resin composition according to claim 3 , wherein the epoxy resin is at least one selected from the group consisting of alicyclic epoxy resin, nuclear-hydrogenated Bis A diglycidyl ether, and Bis A diglycidyl ether. 5. The epoxy resin composition according to claim 4 , wherein an equivalent ratio of the curing agent to the epoxy resin (equivalent of the curing agent/equivalent of the epoxy resin) is 0.5 to 1.2. 6. The epoxy resin composition according to claim 4 , further comprising a curing accelerator. 7. The epoxy resin composition according to claim 4 , further comprising an antioxidant. 8. The epoxy resin composition according to claim 4 , further comprising a UV absorber. 9. The epoxy resin composition according to claim 4 , further comprising an inorganic filler. 10. The epoxy resin composition according to claim 3 , wherein an equivalent ratio of the curing agent to the epoxy resin, equivalent of the curing agent/equivalent of the epoxy resin, is 0.5 to 1.2. 11. The epoxy resin composition according to claim 3 , further comprising a curing accelerator. 12. The epoxy resin composition according to claim 3 , further comprising an antioxidant. 13. The epoxy resin composition according to claim 3 , further comprising a UV absorber. 14. The epoxy resin composition according to claim 3 , further comprising an inorganic filler. 15. A cured product prepared by curing the epoxy resin composition according to claim 3 . 16. A molded body comprising the cured product according to claim 15 . 17. An epoxy resin composition of claim 3 , wherein the compound represented by the above formula (1) is a compound represented by the following formula (2): wherein X, Y, and Z each independently represent a hydrogen atom, a methyl group, an ethyl group, or a hydroxyl group. 18. The epoxy resin composition according to claim 17 , wherein the compound represented by the above formula (2) is a compound represented by the following formula (3): 19. The epoxy resin composition according to claim 17 , wherein the compound represented by the above formula (2) is a compound represented by the following formula (4):
Assignees
Inventors
Classifications
Carboxylic esters of phenolcarboxylic acids · CPC title
aromatic · CPC title
- C07D307/60Primary
Two oxygen atoms, e.g. succinic anhydride · CPC title
cycloaliphatic · CPC title
- C08G59/4238Primary
heterocyclic · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9605110B2 cover?
- The epoxy resin curing agent of the present invention comprises a compound represented by the following formula (1): wherein R represents a methyl group, an ethyl group, or a hydroxyl group, and n is an integer of 1 to 3.
- Who is the assignee on this patent?
- Mitsubishi Gas Chemical Co
- What technology area does this patent fall under?
- Primary CPC classification C07D307/60. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Mar 28 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).