Sequential wafer bonding

Patent metadata

Field	Value
Publication number	US-9604844-B2
Application number	US-201514804110-A
Country	US
Kind code	B2
Filing date	Jul 20, 2015
Priority date	Aug 27, 2013
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

Embodiments of a sensor device include a sensor substrate and a first cap substrate attached to the sensor substrate with a first bond material. The first bond material is arranged to define a first device cavity. A second cap substrate is attached to the sensor substrate with a second bond material. The second bond material is arranged to define a second device cavity. The second bond material has a lower bonding temperature than the first bond material. The second cap substrate is further secured to the sensor substrate by an adhesive material disposed between the sensor substrate and the second cap substrate.

First claim

The invention claimed is:

1. A sensor device comprising:
a sensor substrate;
a first cap substrate attached to the sensor substrate with a first bond material, the first bond material being arranged to define a first device cavity; and
a second cap substrate attached to the sensor substrate with a second bond material, the second bond material being arranged to define a second device cavity, the second bond material having a lower bonding temperature than the first bond material;
wherein the second cap substrate is further secured to the sensor substrate by an adhesive material disposed between the sensor substrate and the second cap substrate;
wherein a first outermost sidewall of the second cap substrate is offset inwardly from a second outermost sidewall of the first cap substrate;
wherein the sensor substrate has an indent along a third outermost sidewall of the sensor substrate and adjacent the second cap substrate in which the adhesive material is disposed;
wherein a sidewall of the indent is coplanar with the first outermost sidewall of the second cap substrate.

2. The sensor device of claim 1 , wherein the first bond material comprises an aluminum-germanium (AlGe) alloy.

3. The sensor device of claim 1 , wherein the second bond material is selected from the group consisting of a tin-silver-copper (SnAgCu) alloy, a tin-antimony (SnSb) alloy, a lead-tin (PbSn) alloy, and a lead-tin-silver (PbSnAg) alloy.

4. The sensor device of claim 1 , wherein the second bond material is arranged as a sealing ring disposed along a perimeter of the sensor substrate.

5. The sensor device of claim 1 , further comprising solder balls attached to the first cap substrate or the second cap substrate, the solder balls having a bonding temperature no lower than the bonding temperature of the second bond material.

6. The sensor device of claim 1 , further comprising solder balls attached to the first cap substrate or the second cap substrate, the solder balls comprising the second bond material.

7. The sensor device of claim 1 , wherein the sensor substrate has a vent hole in communication with the second device cavity, the vent hole providing a vent path through the sensor substrate.

8. The sensor device of claim 7 , wherein the second bond material is arranged in a seal ring disposed between the adhesive material and the vent hole, the seal ring surrounding the vent hole.

9. The sensor device of claim 1 , wherein the adhesive material comprises an underfill epoxy material.

10. The sensor device of claim 1 , wherein the adhesive material is further disposed at the periphery along outer edges of the second cap substrate.

11. The sensor device of claim 1 , wherein the periphery of the second cap substrate is offset inwardly from a boundary of the sensor substrate.

12. The sensor device of claim 1 , wherein:
the first device cavity has a first pressure; and
the second device cavity has a second pressure higher than the first pressure.

13. The sensor device of claim 12 , wherein the sensor substrate comprises a vent hole such that space enclosed in the second device cavity is present on both sides of the sensor substrate.

14. The sensor device of claim 13 , wherein the second bond material is arranged in a seal ring disposed between the adhesive material and the vent hole.

15. A sensor device comprising:
a sensor substrate;
a first cap substrate attached to the sensor substrate with a first bond material, the first bond material being arranged to define a first device cavity; and
a second cap substrate attached to the sensor substrate with a second bond material, the second bond material being arranged to define a second device cavity, the second bond material having a lower bonding temperature than the first bond material;
wherein the second cap substrate is further secured to the sensor substrate by an adhesive material disposed between the sensor substrate and the second cap substrate, and
wherein the sensor substrate has a vent hole in communication with the second device cavity, the vent hole providing a vent path through the sensor substrate;
wherein the first device cavity has a first pressure; and the second device cavity has a second pressure higher than the first pressure.

16. The sensor device of claim 15 , wherein the second bond material is arranged in a seal ring disposed between the adhesive material and the vent hole, the seal ring surrounding the vent hole.

17. The sensor device of claim 15 , wherein the second bond material is arranged as a sealing ring disposed along a perimeter of the sensor substrate.

18. The sensor device of claim 15 , wherein the adhesive material comprises an underfill epoxy material.

19. The sensor device of claim 1 , wherein the adhesive material is disposed inwardly of the second bonding material.

Assignees

• Bowles Philip H
• Hooper Stephen R
• Nxp Usa Inc

Inventors

• Bowles Philip H
• Hooper Stephen R

Classifications

• B81C2203/0145

  Hermetically sealing an opening in the lid · CPC title

• B81C1/00293 Primary

  maintaining a controlled atmosphere with processes not provided for in B81C1/00285 · CPC title

• B81B2201/0242

  Gyroscopes · CPC title

• B81B2201/0235

  Accelerometers · CPC title

• B81B7/04 Primary

  Networks or arrays of similar microstructural devices · CPC title