MEMS device

Patent metadata

Field	Value
Publication number	US-9604840-B1
Application number	US-201615007744-A
Country	US
Kind code	B1
Filing date	Jan 27, 2016
Priority date	Jan 27, 2016
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A device includes a stationary structure, a spring and a proof mass. The stationary structure has a first portion and a second portion. The spring is over a substrate. The spring has a first protrusion protruded from an edge and extended toward the first portion of the stationary structure. The proof mass is over the substrate and supported by the sparing. The proof mass has a second protrusion protruded from an edge and extended toward the second portion of the stationary structure. A first gap between the first protrusion and the first portion is less than a second gap between the second protrusion and the second portion.

First claim

What is claimed is:

1. A device, comprising:
a substrate;
a first structure over the substrate, the first structure having a first portion and a second portion;
a second structure over the substrate, the second structure having a first protrusion protruded from an edge of the second structure and extended toward the first portion of the first structure; and
a third structure over the substrate and supported by the second structure, the third structure having a second protrusion protruded from an edge of the third structure and extended toward the second portion of the first structure,
wherein a first gap between the first protrusion and the first portion is less than a second gap between the second protrusion and the second portion.

2. The device of claim 1 , wherein a first distance between the first portion of the first structure and the edge of the second structure is substantially equal to a second distance between the second portion of the first structure and the edge of the third structure.

3. The device of claim 2 , wherein the first protrusion has a first thickness, the second protrusion has a second thickness, and the first thickness is greater than the second thickness.

4. The device of claim 3 , wherein a difference between the first thickness and the second thickness is substantially 0.5 micrometers.

5. The device of claim 2 , wherein the first distance is substantially ranged from 2 micrometers to 3 micrometers.

6. The device of claim 1 , wherein the first protrusion and the second structure are monolithically formed, and the second protrusion and the third structure are monolithically formed.

7. The device of claim 1 , where the first structure is stationary structure, the second structure is a resilient structure, the third structure is a proof mass coupled to the resilient structure, and the resilient structure is configured to allow the proof mass to move toward or away from the stationary structure.

8. The device of claim 7 , wherein the resilient structure has a winding pattern.

9. The device of claim 1 , wherein the first structure is conductive.

10. The device of claim 1 , wherein the second structure is conductive.

11. The device of claim 1 , wherein the third structure is conductive.

12. The device of claim 1 , wherein the second protrusion is less resilient than the first protrusion.

13. A MEMS device, comprising:
a substrate;
a stationary structure over the substrate, the stationary structure having a first edge;
a resilient structure over the substrate, the resilient structure having a second edge facing and spaced away from the first edge of the stationary structure;
a proof mass over the substrate and supported by the resilient structure, the proof mass having a third edge facing and spaced away from the first edge of the stationary structure, wherein the resilient structure is configured to allow the proof mass to move toward or away from the stationary structure in a direction; and
a first bumper and a second bumper respectively between the first edge and the second edge, and between the first edge and the third edge, wherein the first bumper and the second bumper are adjacently arranged in such a manner that when the MEMS device experiences a force in the direction, the first bumper contacts both the first edge and the second edge before the second bumper contacts both the first edge and the third edge.

14. The MEMS device of claim 13 , wherein the first bumper has a first thickness, the second bumper has a second thickness, and the first thickness is greater than the second thickness.

15. The MEMS device of claim 14 , wherein a first distance between the first edge and the second edge is equal to a second distance between the first edge and the third edge.

16. The MEMS device of claim 14 , wherein a difference between the first thickness and the second thickness is substantially 0.5 micrometers.

17. The MEMS device of claim 13 , wherein the first bumper is disposed on the second edge of the resilient structure.

18. The MEMS device of claim 13 , wherein the second bumper is disposed on the third edge of the proof mass.

19. The MEMS device of claim 13 , wherein the resilient structure has a winding pattern.

20. The MEMS device of claim 13 , wherein the second bumper is less resilient than the first bumper.

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semiconductor Mfg Comapny Ltd

Inventors

• Cheng Chun-Wen
• Lee Jiou-Kang

Classifications

• B81B2203/0163

  Spring holders · CPC title

• B81B3/0072 Primary

  For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers · CPC title

• B81C2203/036

  Fusion bonding · CPC title

• B81C1/00238 Primary

  Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure · CPC title

• B81B2207/096

  through the substrate · CPC title