Laser machining systems and methods with vision correction and/or tracking

Patent metadata

Field	Value
Publication number	US-9604313-B2
Application number	US-201414251926-A
Country	US
Kind code	B2
Filing date	Apr 14, 2014
Priority date	Oct 10, 2008
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece.

First claim

What is claimed is:

1. A laser machining system comprising:
a part handling system including a workpiece support surface for supporting a workpiece to be machined;
at least one stationary laser source for generating at least one laser beam;
at least one laser scanning stage positioned relative to the part handling system for linear movement along a scanning axis, wherein the stationary laser source is not located on the laser scanning stage and the laser scanning stage moves relative to the stationary laser source;
a movable optical head located on the laser scanning stage and movable with the laser scanning stage relative to the stationary laser source, the movable optical head including a beam delivery system for receiving the at least one laser beam, for modifying the at least one laser beam, and for directing the modified beam at the workpiece while moving to machine the workpiece; and
a workpiece tracking system for tracking changes in the workpiece relative to the movable optical head and for adjusting at least one parameter of the modified beam in response to the changes in the workpiece, wherein the workpiece tracking system comprises first and second sensors for sensing a process plane or a surface of the workpiece to track changes in a relative height of the workpiece relative to the movable optical head, wherein the first and second sensors are located on each side of a location where the modified beam is directed from the movable optical head.

2. The laser machining system of claim 1 wherein the beam delivery system comprises at least one lens for focusing the modified beam and a lens translation stage for moving the lens and adjusting the focus of the modified beam in response to changes in the height of the process plane of the workpiece supported on the workpiece support surface.

3. The laser machining system of claim 1 wherein the at least one parameter of the modified beam is selected from the group consisting of focus and fluence.

4. The laser machining system of claim 1 wherein the beam delivery system is configured to modify the laser beam by forming multiple beamlets and delivering the multiple beamlets to the workpiece.

5. A laser machining system comprising:
a part handling system including a workpiece support surface for supporting a workpiece to be machined;
at least one stationary laser source for generating at least one laser beam;
at least one laser scanning stage positioned relative to the part handling system for linear movement along a scanning axis, wherein the stationary laser source is not located on the laser scanning stage and the laser scanning stage moves relative to the stationary laser source;
a movable optical head located on the laser scanning stage and movable with the laser scanning stage relative to the stationary laser source, the moveable optical head including a beam delivery system for receiving the at least one laser beam, modifying the laser beam, and directing the modified beam at the workpiece while moving to form a scribe line on the workpiece; and
a vision correction system for viewing at least one scribe line on the workpiece and for positioning the workpiece in response to at least one parameter of the scribe line on the workpiece.

6. The laser machining system of claim 5 wherein the vision correction system comprises:
at least one camera configured to view respective first and second ends of the at least one scribe line to determine a position of the scribe line; and
a workpiece positioning system configured to position the workpiece in response to the position of the scribe line.

7. The laser machining system of claim 6 wherein the at least one camera includes at least first and second alignment cameras positioned at first and second sides of the laser machining system for viewing respective first and second ends of the at least one scribe line.

8. The laser machining system of claim 5 wherein the vision correction system comprises at least one camera mounted for movement with the laser scanning stage and configured to view the scribe line as the laser scanning stage moves along the scanning axis.

9. The laser machining system of claim 5 wherein the part handling system includes chucks configured to support the workpiece and to move the workpiece along an indexing axis orthogonal to the scanning axis and to rotate the workpiece about a rotation axes orthogonal to the scanning axis and the indexing axis.

Assignees

• Ipg Microsystems Llc
• Ipg Photonics Corp

Inventors

• Sercel Jeffrey P
• Lemmo Donald J
• Murphy Jr Terrence A
• Roberts Lawrence
• Loomis Tom
• Sokol Miroslaw

Classifications

• B23K9/1006

  Power supply · CPC title

• B23K9/1087

  Arc welding using remote control · CPC title

• B23K26/066

  by using masks · CPC title

• B23K26/0892

  Controlling the laser beam travel length · CPC title

• B23K26/032

  using optical means · CPC title