Modular enclosure and construction method

US9603269B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9603269-B2
Application numberUS-201514602329-A
CountryUS
Kind codeB2
Filing dateJan 22, 2015
Priority dateJan 22, 2015
Publication dateMar 21, 2017
Grant dateMar 21, 2017

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A modular enclosure configurable to achieve one of a plurality of environmental ratings is disclosed. The modular enclosure includes a base having a substantially open upper portion and a substantially open lower portion. The base further includes at least one top interlocking feature. The modular enclosure further includes a bottom cap including a bottom interlocking feature and a top cap including at least one top cap interlocking feature. The bottom cap is configured to couple to the lower portion of the base using the bottom interlocking feature and the top cap is configured to couple to the upper portion of the base using at least one top interlocking feature. The at least one top interlocking feature configured to engage a corresponding at least one top cap interlocking feature.

First claim

Opening claim text (preview).

We claim: 1. A modular enclosure configurable to achieve one of a plurality of environmental ratings, comprising: a base, the base having a substantially open upper portion and a substantially open lower portion, the base further including at least one top interlocking feature; a bottom cap, the bottom cap including a bottom interlocking feature, the bottom interlocking feature including a base snap-in feature configured to couple the bottom cap to the lower portion of the base, the bottom interlocking feature further including a base incline surface defining a base slot sized to receive the base; a top cap, the top cap including at least one top cap interlocking feature; and the bottom cap configured to couple to the lower portion of the base using the bottom interlocking feature and the top cap configured to couple to the upper portion of the base using the at least one top interlocking feature, the at least one top interlocking feature configured to engage a corresponding at least one top cap interlocking feature. 2. The modular enclosure of claim 1 , wherein the top cap includes a top cap gasket. 3. The modular enclosure of claim 2 , wherein the modular enclosure conforms to at least one of National Electrical Manufacturers Association 1 and National Electrical Manufacturers Association 3R enclosure type standards. 4. The modular enclosure of claim 2 , wherein the bottom cap includes a base gasket. 5. The modular enclosure of claim 4 , wherein the modular enclosure conforms to at least one of National Electrical Manufacturers Association 4 and National Electrical Manufacturers Association 12 enclosure type standards. 6. The modular enclosure of claim 1 , wherein the bottom cap includes a bottom plate and the bottom interlocking feature further includes a bottom plate snap-in feature configured to couple the bottom plate to the bottom cap, a bottom plate incline surface, and a bottom plate slot. 7. A modular enclosure configurable to achieve one of a plurality of environmental ratings, comprising: a base, the base defining a substantially open upper portion and a substantially open lower portion and including at least one top interlocking feature adjacent to the upper portion; a bottom cap, the bottom cap including a bottom plate and a bottom interlocking element configured to retain the bottom plate; the bottom interlocking element including a base snap-in feature configured to couple the bottom interlocking element to the lower portion of the base, the base snap-in feature including a base incline surface defining a base slot sized to receive the base; a top cap, the top cap including at least one top cap interlocking feature, the at least one top cap interlocking feature corresponding with the at least one top interlocking feature; the top cap configured to couple to the upper portion of the base using the at least one top interlocking feature, the at least one top interlocking feature engaging the corresponding at least one top cap interlocking feature; and wherein at least one of the top cap and the bottom cap are configured to receive a selected gasket material. 8. The modular enclosure of claim 7 , wherein the top cap includes a top cap gasket and the bottom cap includes a base gasket. 9. The modular enclosure of claim 7 , wherein the bottom interlocking element further includes a bottom plate snap-in feature configured to couple the bottom interlocking element to the bottom plate, the bottom plate snap-in feature including a bottom plate incline surface defining a bottom plate slot sized to receive the bottom plate. 10. A method of producing a modular electrical enclosure, the method comprising: determining a desired environmental rating for the modular electrical enclosure, the modular electrical enclosure comprising a base defining an upper aperture and a lower aperture and including one or more top interlocking features; selecting a bottom cap and a top cap corresponding to the desired environmental rating; installing a selected gasket material on at least one of the top cap and the bottom cap based on the desired environmental rating; installing the bottom cap on the lower aperture of the base using a bottom interlocking feature, the bottom interlocking feature including a base snap-in feature configured to couple the bottom cap to the lower aperture of the base, the bottom interlocking feature further including a base incline surface defining a base slot sized to receive the lower aperture of the base; and installing the top cap on the upper aperture of the base using one or more top cap interlocking features engaging the corresponding one or more top interlocking features. 11. The method of claim 10 , wherein installation of the selected gasket material on the top cap only enables the modular enclosure to conform to National Electrical Manufacturers Association 3R enclosure type standard. 12. The method of claim 10 , wherein installation of the selected gasket material on the top cap and the bottom cap enables the modular enclosure to conform at least one of National Electrical Manufacturers Association 4 and National Electrical Manufacturers Association 12 enclosure type standards. 13. The method of claim 10 , wherein the selected gasket material is a silicone base foam. 14. The method of claim 10 , wherein the one or more top interlocking features define one or more indents in the base adjacent to the upper aperture. 15. The method of claim 14 , wherein the one or more indents define a substantially inclined shape. 16. The method of claim 10 , wherein the one or more top cap interlocking features define one or more protrusions in the top cap. 17. The method of claim 16 , wherein the one or more protrusions define a substantially inclined shape. 18. The method of claim 10 , wherein the bottom cap includes a bottom plate and the bottom interlocking feature further includes a bottom plate snap-in feature configured to couple the bottom plate to the bottom cap, a bottom plate incline surface, and a bottom plate slot.

Assignees

Inventors

Classifications

  • Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof · CPC title

  • H05K5/0217Primary

    Mechanical details of casings (covers, lids, hoods or members for covering apertures H05K5/03) · CPC title

  • H02B1/30Primary

    Cabinet-type casings; Parts thereof or accessories therefor · CPC title

  • Casings; Parts thereof or accessories therefor · CPC title

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Frequently asked questions

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What does patent US9603269B2 cover?
A modular enclosure configurable to achieve one of a plurality of environmental ratings is disclosed. The modular enclosure includes a base having a substantially open upper portion and a substantially open lower portion. The base further includes at least one top interlocking feature. The modular enclosure further includes a bottom cap including a bottom interlocking feature and a top cap incl…
Who is the assignee on this patent?
Omari Ahmad, Kilburn Jeffrey A, Rogers Jordan, and 1 more
What technology area does this patent fall under?
Primary CPC classification H05K5/0217. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).