Electronic component mounting apparatus and method

Patent metadata

Field	Value
Publication number	US-9603262-B2
Application number	US-201514871622-A
Country	US
Kind code	B2
Filing date	Sep 30, 2015
Priority date	Jun 4, 2010
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven in a direction getting close to and from the substrate, a linear scale and a linear scale head detecting the position of the bonding tool in the direction getting close to and from the substrate, and a control unit configured to hold the position of the bonding tool in the direction getting close to and from the substrate when a solder film between an electrode of the electronic component and an electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a predetermined distance from a reference position while heating the electronic component. The electronic component mounting apparatus for bonding the electronic component and the substrate with thermally fusible bond metal offers an improvement in the bonding quality.

First claim

The invention claimed is:

1. A method of mounting an electronic component on a substrate using a mounting apparatus, the method comprising:
preparing an apparatus comprising:
a rise-and-fall block;
a first drive unit driving the rise-and-fall block along a path toward and away from the substrate in a gross movement;
a bonding tool for thermally bonding a bump on an electrode of the electronic component and the substrate with a thermally fused bond metal;
a second drive unit driving the bonding tool along the path toward and away from the substrate in a fine movement, the second drive unit incorporated in the rise-and-fall block and comprising a voice coil motor;
a position detection unit for detecting a position of the bonding tool on the path, the position detection unit issuing a detection signal when the bump and a film of the bond metal are in contact with each other; and
a control unit for controlling the bonding tool on the path with the first drive unit and the second drive unit;

moving the bonding tool toward the substrate with the first drive unit and then moving the bonding tool further toward the substrate with the second drive unit while determining with the position detection unit whether or not the bump and the film are in contact with each other based on the detection signal;
setting the position of the bonding tool with respect to the substrate as a first reference position when it is determined in the step of determining that the bump and the film are in contact with each other; and
bringing the bonding tool close to the substrate from the first reference position while heating the electronic component by controlling the second drive unit so as to provide a constant pressing force with which the bonding tool presses down the substrate and holding the position of the bonding tool along said path with the second drive unit based on the determination that bond metal between an electrode of the electronic component and an electrode of the substrate is thermally fused when the electronic component gets close to the substrate from the first reference position by a predetermined distance smaller than the thickness of a film of the bond metal.

2. The electronic component mounting method according to claim 1 , further comprising:
setting the position of the bonding tool with respect to the substrate as a second reference position after the first reference position is set in the step of setting and when the distance of the bonding tool from the substrate along said path changes from increasing to decreasing; and
bringing the bonding tool close to the substrate from the second reference position while heating the electronic component by controlling the second drive unit so as to provide a constant pressing force with which the bonding tool presses down the substrate and holding the position of the bonding tool along said path with the second drive unit based on the determination that the bond metal between the electrode of the electronic component and the electrode of the substrate is thermally fused when the electronic component gets close to the substrate from the second reference position by a second predetermined distance that adds the predetermined distance to the difference between the second reference position and the first reference position.

Assignees

• Shinkawa Kk

Inventors

• Hojo Koji
• Takahashi Makoto

Classifications

• H10P72/04

  Apparatus for manufacture or treatment · CPC title

• H10W72/07252

  changes in structures or sizes · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/07232

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/07183

  Means for monitoring · CPC title