Magnet package and method for producing a magnet package

Patent metadata

Field	Value
Publication number	US-9601858-B2
Application number	US-201514590017-A
Country	US
Kind code	B2
Filing date	Jan 6, 2015
Priority date	Jan 7, 2014
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

A magnet package is created, which includes a package body, wherein the package body is formed of a permanent magnetic material, and at least one electric contact, which is covered by the package body.

First claim

The invention claimed is:

1. Magnet package, comprising:
a package body, wherein the package body is formed from a permanent magnetic material, and
at least one electric contact, which is covered by the package body

wherein the electric contact is formed by a leadframe,
wherein the electric contact is part of bent leadframe, and
wherein the magnetic material comprises a carrier component and a magnetic component.

2. Magnet package according to claim 1 , wherein the package is formed as a connector.

3. Magnet package according to claim 1 , wherein the package body comprises at least one surface structure, which is suitable for use as an alignment feature.

4. Magnet package according to claim 1 , wherein a magnetic field-shaping region is formed in the package body.

5. Magnet package according to claim 4 , wherein the magnetic field-shaping region is formed by a cavity and/or another material.

6. Magnet package according to claim 1 , wherein the magnet package further comprises a chip.

7. Magnet package according to claim 1 , wherein the magnetic component comprises at least one substance, which is selected from the group of substances consisting of:
samarium,
cobalt,
iron,
neodymium,
SmCo,
NdFeB,
ferrite,
hard ferrite, and
compounds thereof.

8. Magnet package according to claim 1 , wherein the carrier component is a substance which is selected from the group consisting of:
thermoplastics,
thermosets,
elastomers.

9. Magnet package according to claim 1 , wherein the magnetic material is configured such that a magnetic field strength within the package body has a gradient.

10. Magnet package according to claim 1 , wherein at least one electric contact is mechanically stable.

11. Connector, comprising
a housing element comprising a permanent magnetic material; and
at least one electrically conductive terminal, which is at least partially encapsulated by the housing element,

wherein the electrically conductive terminal is part of a bent leadframe, and
wherein the magnetic material comprises a carrier component and a magnetic component.

12. Connector according to claim 11 , wherein the housing element is selected by a process selected from the group consisting of the following processes:
casting,
injection molding, and
3-D printing.

13. Connector according to claim 11 , wherein on the leadframe a sensor chip is bonded.

14. Connector according to claim 11 , wherein the connector is electrically connected to a cable.

15. Method of manufacturing a magnet package, wherein the method comprises:
providing at least one electrically conductive structure in form of a leadframe;
bending of the leadframe, such that ends of the leadframe form an electrical contact;
subsequently partially encapsulating the electrically conductive structure by a permanent magnetic material, wherein the magnetic material comprises a carrier component and a magnetic component.

16. Method according to claim 15 , wherein the encapsulating is performed by an injection molding process.

17. Method according to claim 15 , further comprising:
placing a chip on the conductive structure before it is partially encapsulated.

Assignees

• Infineon Technologies Ag

Inventors

• Elian Klaus

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H01R43/18

  for manufacturing bases or cases for contact members · CPC title

• H01R13/6683

  with built-in sensor · CPC title

• H01R13/6205

  Two-part coupling devices held in engagement by a magnet · CPC title

• H01F41/0266

  Moulding; Pressing (H01F41/0273 takes precedence; hard magnetic particles H01F1/06, H01F1/11) · CPC title