Resin composition for forming protective film, protective film, pattern forming method, method for manufacturing electronic device, and electronic device

Patent metadata

Field	Value
Publication number	US-9601706-B2
Application number	US-201514689216-A
Country	US
Kind code	B2
Filing date	Apr 17, 2015
Priority date	Oct 19, 2012
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

There is provided a resin composition for use in formation of a protective film to protect a substrate or a film formed on the substrate, from a developer containing an organic solvent to be used for development in pattern formation, and which contains two or more kinds of resins in which their main chain structures having a hydroxyl group are different, and contains water, a pattern forming method using the resin composition, and layered products comprising a substrate, an organic semiconductor film on the substrate, and a protective film comprising two or more kinds of resins in which their main chain structures having a hydroxyl group are different, on the organic semiconductor film.

First claim

What is claimed is:

1. A pattern forming method comprising the following steps:
(1) forming an organic semiconductor film on a substrate,
(2) forming a protective film using a resin composition on the organic semiconductor film, wherein the resin composition contains two or more kinds of resins in which their main chain structures having a hydroxyl group are different, and contains water,
(3) forming a resist film on the protective film by
an actinic ray-sensitive radiation-sensitive resin composition (I) containing a resin capable of increasing a polarity by an action of an acid to decrease the solubility in a developer containing an organic solvent,
or an actinic ray-sensitive or radiation-sensitive resin composition (II) containing a conjugated diene polymer or copolymer or a cyclized product of the polymer or the copolymer, and a crosslinking agent,
(4)exposing the resist film,
(5) developing the resist film with a developer containing an organic solvent to form a negative type resist pattern on the resist film,
(6) forming a pattern on the protective layer by using water as a developer and using the resist pattern as a mask pattern,
(7) forming a pattern on the organic semiconductor film by using dry or wet etching and using the resist and protective film pattern as a mask, and
(8) removing the resist pattern using a peeling solution containing an organic solvent and further removing the protective film pattern using water.

2. The pattern forming method according to claim 1 ,
wherein the developer containing an organic solvent is a developer containing at least one organic solvent selected from the group consisting of an ester solvent, a ketone solvent, an alcohol solvent, an amide solvent, an ether solvent, and a hydrocarbon solvent.

3. The pattern forming method according claim 1 ,
wherein the peeling solution containing an organic solvent is a peeling solution containing at least one organic solvent selected from the group consisting of an alcohol solvent, an ether solvents and a hydrocarbon solvent.

4. A method for manufacturing an electric device, comprising the pattern forming method according to claim 1 .

5. A layered product comprising:
a substrate,
an organic semiconductor film on the substrate, and
a protective film comprising two or more kinds of resins in which their main chain structures having a hydroxyl group are different, on the organic semiconductor film.

6. A layered product comprising:
a substrate,
an organic semiconductor film on the substrate,
a protective film comprising two or more kinds of resins in which their main chain structures having a hydroxyl group are different, on the organic semiconductor film, and
a resist film comprising an actinic ray-sensitive or radiation-sensitive resin composition (I) containing a resin capable of increasing a polarity by an action of an acid to decrease the solubility in a developer containing an organic solvent, on the protective film.

Assignees

• Fujifilm Corp

Inventors

• Iwai Yu
• Nakamura Atsushi
• Kamochi Yoshitaka
• Yoshida Masafumi

Classifications

• H10P50/242

  of Group IV materials · CPC title

• H10P14/683

  carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title

• H10K59/873

  Encapsulations · CPC title

• H10K85/761

  Biomolecules or bio-macromolecules, e.g. proteins, chlorophyl, lipids or enzymes · CPC title

• G03F7/11 Primary

  having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} · CPC title