Thermoelectric module and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9601679-B2
Application number	US-201414248831-A
Country	US
Kind code	B2
Filing date	Apr 9, 2014
Priority date	Apr 10, 2013
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

In a configuration to join thermoelectric elements with an electrode in a thermoelectric module, reduction in junction reliability between the thermoelectric elements and the electrode is suppressed in a high-temperature environment and in an environment in which vibration and shock are imposed as load, to efficiently transmit the outer-circumferential temperature to the thermoelectric elements. In a thermoelectric module in which a plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric element are alternately arranged by aligning the surfaces thereof on the high-temperature side and the surfaces thereof on the low-temperature side, to electrically connect the thermoelectric elements in series to each other; the p-type thermoelectric elements and the n-type thermoelectric element are joined via an intermediate layer with a deformable stress relaxation electrode, to thereby absorb stress taking place during the module assembling process and the module operation by the electrode.

First claim

The invention claimed is:

1. A thermoelectric module comprising:
a plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements, all of or a part of the p-type thermoelectric elements and all of or a part of the n-type thermoelectric elements being electrically connected in series to each other, and
a stress relaxation electrode produced in the form of woven fabric or nonwoven fabric made of a braided fine nickel wire or a braided fine copper wire on which a metallic film of nickel is formed,
the p-type thermoelectric elements and the n-type thermoelectric elements being joined together via the stress relaxation electrode, wherein a density of the woven or nonwoven fabric using the metallic fiber at a part of the stress relaxation electrode with the thermoelectric elements is greater than a density of the woven or nonwoven fabric at another part of the stress relaxation electrode without the thermoelectric elements, and wherein
an intermediate layer is disposed only on upper and lower surfaces of the thermoelectric elements to which the stress relaxation electrode is joined, the intermediate layer being a nickel-tin-based alloy or compound, or an aluminum-nickel-based alloy or compound, and portions of the metallic fiber connected to the intermediate layer are closer to each other than portions of the metallic fiber not connected to the intermediate layer, the intermediate layer including a single metallic film and being bonded directly on the stress relaxation electrode.

2. The thermoelectric module according to claim 1 , wherein
the p-type thermoelectric elements and the n-type thermoelectric elements are thermoelectric elements comprising either one of the combinations of elements selected from a group consisting of silicon-germanium-based elements, iron-silicon-based elements, bismuth-tellurium-based elements, magnesium-silicon-based elements, manganese-silicon-based elements, lead-tellurium-based elements, cobalt-antimony-based elements, bismuth-antimony-based elements, Heusler-alloy-based elements, and half-Heusler-alloy-based elements.

3. The thermoelectric module according to claim 1 , wherein
the stress relaxation electrode has porous metal with continuous pores or independent pores formed at a porosity ranging from 10% to 99%.

4. The thermoelectric module according to claim 1 , wherein
the stress relaxation electrode has porous metal with continuous pores or independent pores formed at a porosity ranging from 10% to 99%.

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Tohei Tomotake
• Fujiwara Shinichi
• Ishijima Zenzo
• Jinushi Takahiro

Classifications

• H01L35/08

  Electricity · mapped topic

• H01L35/32 Primary

  Electricity · mapped topic

• H10N10/817 Primary

  the junction being non-separable, e.g. being cemented, sintered or soldered · CPC title

• H10N10/17 Primary

  characterised by the structure or configuration of the cell or thermocouple forming the device · CPC title