LED support assembly and LED module

Patent metadata

Field	Value
Publication number	US-9601676-B2
Application number	US-201414891146-A
Country	US
Kind code	B2
Filing date	Jun 24, 2014
Priority date	Jun 27, 2013
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

An LED support assembly and an LED module are provided. The LED support assembly includes: a metal heat sink, a first ceramic substrate and a second ceramic substrate, the metal heat sink defines an upper surface; the first ceramic substrate is adapted to support a LED chip and disposed on the upper surface of the metal heat sink; the second ceramic substrate is adapted to support electrodes of the LED chip and surrounds the first ceramic substrate.

First claim

What is claimed is:

1. An LED support assembly, comprising:
a metal heat sink defining an upper surface and a lower surface;
a first ceramic substrate configured to support an LED chip and disposed on the upper surface of the metal heat sink; and
a second ceramic substrate configured to support electrodes of the LED chip and surrounding the first ceramic substrate.

2. The LED support assembly of claim 1 , wherein the second ceramic substrate defines a hole penetrating through the second ceramic substrate in a thickness direction thereof, the first ceramic substrate is disposed in the hole and a mounting cavity is defined by the first and second ceramic substrates.

3. The LED support assembly of claim 1 , wherein a thickness of the first ceramic substrate is smaller than a thickness of the second ceramic substrate.

4. The LED support assembly of claim 3 , wherein the thickness of the first ceramic substrate ranges from 0.1 mm to 0.6 mm, and the thickness of the second ceramic substrate ranges from 0.6 mm to 5 mm.

5. The LED support assembly of claim 1 , wherein the first ceramic substrate comprises a lower surface, wherein an area of the lower surface of the first ceramic substrate is smaller than an area of the upper surface of the metal heat sink.

6. The LED support assembly of claim 1 , wherein the second ceramic substrate is disposed on the upper surface of the metal heat sink.

7. The LED support assembly of claim 6 , wherein a sum of an area of a lower surface of the first ceramic substrate and a lower surface of the second ceramic substrate is smaller than an area of the upper surface of the metal heat sink.

8. The LED support assembly of claim 1 , wherein a thermal conductivity of the first ceramic substrate is higher than a thermal conductivity of the second ceramic substrate.

9. The LED support assembly of claim 1 , wherein a coefficient of thermal expansion of the first ceramic substrate is lower than a coefficient of thermal expansion of the second ceramic substrate.

10. The LED support assembly of claim 1 , wherein a strength coefficient of the first ceramic substrate is lower than a strength coefficient of the second ceramic substrate.

11. The LED support assembly of claim 1 , wherein the first ceramic substrate comprises at least one of aluminum oxide ceramics, aluminum nitride ceramics, zirconium oxide ceramics, and beryllium oxide ceramics.

12. The LED support assembly of claim 1 , wherein the second ceramic substrate comprises at least one of aluminum nitride ceramics and zirconium oxide ceramics.

13. The LED support assembly of claim 1 , wherein the metal heat sink comprises a copper heat sink.

14. An LED module, comprising:
the LED support assembly of claim 1 ;
an LED chip supported on the first ceramic substrate of the LED support assembly;
a positive electrode and a negative electrode, each supported on the second ceramic substrate and electrically connected to the LED chip; and
a sealing material encapsulating the LED chip.

Assignees

• Byd Co Ltd

Inventors

• Lin Xinping
• Xu Qiang

Classifications

• H10W72/01515

  Forming coatings · CPC title

• H10W72/075

  of bond wires · CPC title

• H01L33/52

  Electricity · mapped topic

• H01L33/58

  Electricity · mapped topic

• H01L33/54

  Electricity · mapped topic