Method to form primary optic with variable shapes and/or geometries without a substrate

Patent metadata

Field	Value
Publication number	US-9601670-B2
Application number	US-201414329807-A
Country	US
Kind code	B2
Filing date	Jul 11, 2014
Priority date	Jul 11, 2014
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

A submount-free light emitter package with primary optic and method of fabricating the same are disclosed, these packages and methods comprising a light emitter with an optic. The optic may have a shape, which includes a portion that is wider at a point further from the light emitter than a point which is closer. The method includes a light emitter disposed on a carrier surface with at least one structure at least partially surrounding the light emitter. The encapsulant is over the light emitter forming a primary optic. The intermediate element at least partially defines the shape of the primary optic.

First claim

We claim:

1. A light emitter package, comprising:
a light emitter;
at least a package contact on said light emitter with no intervening submount between said at least a package contact and said light emitter; and
an encapsulant over said light emitter forming a shaped primary optic, wherein said at least a package contact is on said light emitter without directly contacting said encapsulant.

2. The light emitter package of claim 1 , wherein said primary optic is capable of beam shaping.

3. The light emitter package of claim 2 , further comprising a reflective material on the same side of the package as said at least a package contact.

4. The light emitter package of claim 2 , wherein said at least a package contact directly connects to a circuit board.

5. The light emitter package of claim 1 , further comprising a structure at least partially surrounding said light emitter, said structure at least partially defining the shape of said primary optic.

6. The light emitter package of claim 5 , wherein at least a portion of said structure is capable of being removed.

7. The light emitter package of claim 5 , wherein said structure cooperates with a dispense process.

8. The light emitter package of claim 5 , wherein said structure is a permanent portion of said package.

9. The light emitter package of claim 5 , wherein at least a portion of said structure is reflective.

10. The light emitter package of claim 1 , wherein said primary optic is shaped to have an overhang portion.

11. The light emitter package of claim 1 , wherein said primary optic includes wavelength conversion material.

12. The light emitter package of claim 1 , further comprising a wavelength conversion material over said primary optic.

13. The light emitter package of claim 1 , wherein said encapsulant is dispensed over said light emitter.

14. The light emitter package of claim 1 , wherein said encapsulant is comprised of silicone.

15. The light emitter package of claim 1 further comprising a secondary optic over said primary optic.

16. The light emitter package of claim 1 , wherein said primary optic has a tapered shape such that at least a portion closer to a base of said primary optic is narrower than at least a portion closer to an exit face.

17. The light emitter package of claim 1 , wherein said primary optic has a parabolic shape.

18. The light emitter package of claim 1 , wherein said package is a cavity optic with a tapered primary optic and reflective cavity walls.

19. The light emitter package of claim 18 , further comprising a glass lens over said encapsulant.

20. The light emitter package of claim 1 , further comprising a conversion material over said light emitter.

21. The light emitter package of claim 1 , wherein said light emitter is on a removable carrier surface.

22. The light emitter package of claim 21 , wherein said removable carrier surface is a thermal release tape.

23. The light emitter package of claim 21 , wherein said removable carrier surface further comprises a metal frame.

24. A light emitter package, comprising:
a light emitter;
at least one structure at least partially surrounding said light emitter;
an encapsulant over said light emitter forming a primary optic, said at least one structure at least partially defining the shape of said primary optic, wherein said primary optic is shaped such that at least a portion closer to a base of said primary optic is narrower than at least a portion closer to an exit face; and
at least one package contact, said at least one package contact on said light emitter without directly contacting said encapsulant;
wherein said package is submount free.

25. The light emitter package of claim 24 , wherein said primary optic is capable of beam shaping.

26. The light emitter package of claim 24 , wherein at least a portion of said at least one structure is capable of being removed.

27. The light emitter package of claim 24 , wherein said primary optic is shaped to have an overhang portion.

28. The light emitter package of claim 24 , wherein said at least one structure is a permanent portion of said package.

29. The light emitter package of claim 24 , wherein at least a portion of said at least one structure is reflective.

30. The light emitter package of claim 24 , wherein said primary optic has a parabolic shape.

31. The light emitter package of claim 24 , wherein said package is a cavity optic with a tapered primary optic and reflective cavity walls.

32. The light emitter package of claim 24 , further comprising a glass lens over said encapsulant.

33. The light emitter package of claim 24 , wherein said at least one package contact is completely underneath said light emitter.

34. The light emitter package of claim 24 , further comprising a reflective material on the same side of the package as said at least one package contact.

Assignees

• Bhat Chandan
• Lowes Theodore
• Tarsa Eric
• Cree Inc

Inventors

• Bhat Chandan
• Lowes Theodore
• Tarsa Eric

Classifications

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W70/09

  extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs · CPC title