Electronic device

Patent metadata

Field	Value
Publication number	US-9600039-B2
Application number	US-201414456155-A
Country	US
Kind code	B2
Filing date	Aug 11, 2014
Priority date	Aug 15, 2013
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

An electronic device is described, which includes: a first cooling member having a first overlapping portion in which a first insertion hole is formed, and provided to be abutted on a first component to be cooled provided on a substrate; a second cooling member having a second overlapping portion in which a second insertion hole is formed, and provided to be abutted on a second component to be cooled provided on the substrate, the second overlapping portion overlapping the first overlapping portion; and a coupling member inserted through the first insertion hole and the second insertion hole to couple the first overlapping portion to the second overlapping portion through an elastic member.

First claim

What is claimed is:

1. An electronic device comprising:
a first cooling member including two of first-type overlapping portions in each of which a first insertion hole is formed, and provided to be abutted on a first component to be cooled provided on a substrate;
a second cooling member including two of second-type overlapping portions in each of which a second insertion hole is formed, and provided to be abutted on a second component to be cooled provided on the substrate, one of the second-type overlapping portions overlapping one of the first-type overlapping portions of the first cooling member; and
a coupling member inserted through the first insertion hole of the one of the first-type overlapping portions and the second insertion hole of the one of the second-type overlapping portions to couple the one of the first-type overlapping portion to the one of the second-type overlapping portion through an elastic member,
wherein the first cooling member and the second cooling member are formed in a same polygonal plate shape of a same size having a plurality of sides, each of the first cooling member and the second cooling member being provided with two of the first-type overlapping portions at two first sides of the polygonal plate shape not adjacent to each other, and two of the second-type overlapping portions at two second sides of the polygonal plate shape between the first sides.

2. The electronic device according to claim 1 , wherein the coupling member is fixed to the substrate through a third insertion hole provided in the substrate.

3. The electronic device according to claim 1 , wherein the first-type overlapping portion and the second-type overlapping portion include stepped portions, respectively, which are engaged with each other.

4. The electronic device according to claim 1 , wherein the first-type overlapping portion is a protruding portion which protrudes laterally from the first cooling member when the first cooling member is seen from a top side, and the second-type overlapping portion is a recessed portion in which the protruding portion is fitted.

5. The electronic device according to claim 1 , wherein the elastic member is disposed between the first-type overlapping portion and the second-type overlapping portion.

6. The electronic device according to claim 1 , further comprising a fixing member configured to fix the first cooling member or the second cooling member to the substrate through an elastic member.

Assignees

• Fujitsu Ltd

Inventors

• Taguchi Jun

Classifications

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/20772 Primary

  within server blades for removing heat from heat source · CPC title

• G06F1/20 Primary

  Cooling means · CPC title