Curable silicone composition, cured product thereof, and optical semiconductor device

Patent metadata

Field	Value
Publication number	US-9598576-B2
Application number	US-201414915824-A
Country	US
Kind code	B2
Filing date	Sep 3, 2014
Priority date	Sep 3, 2013
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups and at least one aryl group in a molecule, (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, (C) an organopolysiloxane having at least one aryl group in a molecule and containing a metal atom selected from the group consisting of V, Ta, Nb and Ce, and (D) a hydrosilylation-reaction catalyst. The present invention can provide the curable silicone composition, which does not develop a crack by thermal aging and further can form a cured material that exhibits less yellowing.

First claim

The invention claimed is:

1. A curable silicone composition comprising:
(A) an organopolysiloxane having at least two alkenyl groups and at least one aryl group in a molecule;
(B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, in an amount such that the silicon-bonded hydrogen atoms in component (B) is from 0.1 to 10 moles per 1 mole of the alkenyl groups in component (A);
(C) an organopolysiloxane having at least one aryl group in a molecule and a metal atom selected from the group consisting of V, Ta, Nb, and Ce, in an amount such that the metal atom in component (C) is from 20 to 2,000 ppm in terms of mass units based on the content of the composition; and
(D) a catalytic amount of hydrosilylation reaction catalyst.

2. The curable silicone composition according to claim 1 , wherein component (A) is a mixture comprising (A-1) a straight-chain organopolysiloxane having at least two alkenyl groups and at least one aryl group in a molecule; and (A-2) an organopolysiloxane represented by the following average unit formula:
(R 1 SiO 3/2 ) a (R 1 2 SiO 2/2 ) b (R 1 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e
wherein R 1 is each independently an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, an aralkyl group having from 7 to 20 carbons, or a group with halogen atoms substituting a portion of or all of hydrogen atoms thereof; at least two R 1 in a molecule are the alkenyl groups; X is a hydrogen atom or an alkyl group; and “a” is a number of 0 to 0.3, “b” is 0 or a positive number, “c” is a positive number, “d” is a positive number, and “e” is a number of 0 to 0.4, a+b+c+d=1, c/d is a number of 0 to 10, and b/d is a number of 0 to 0.5; in an amount such that a mass ratio of component (A-1) to component (A-2) is from 1/99 to 99/1.

3. The curable silicone composition according to claim 2 , wherein component (A-2) includes: an alkenyl group having from 2 to 12 carbons in an amount from 0.1 to 40 mol % of the total amount of R 1 ; and an alkyl group having from 2 to 12 carbons in an amount not less than 10 mol % of the total amount of R 1 .

4. The curable silicone composition according to claim 2 , wherein component (A-2) is an organopolysiloxane including: R l (CH 3 ) 2 SiO 1/2 units and SiO 4/2 units, wherein R 1 is an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, an aralkyl group having from 7 to 20 carbons, or a group with halogen atoms substituting a portion of or all of hydrogen atoms thereof, and at least two of R 1 in a molecule are the alkenyl groups.

5. The curable silicone composition according to claim 1 , further comprising (E) a hydrosilylation reaction inhibitor, in an amount from 0.01 to 3 parts by mass per 100 parts by mass of the total of components (A) to (C).

6. The curable silicone composition according to claim 1 , further comprising (F) an adhesion promoter, in an amount from 0.1 to 3 parts by mass per 100 parts by mass of the total of components (A) to (C).

7. The curable silicone composition according to claim 1 , further comprising (G) a fluorescent substance, in an amount from 0.1 to 70 mass % of the composition.

8. The curable silicone composition according to claim 1 , wherein light transmittance of the composition is not less than 90% at 450 nm.

9. The curable silicone composition according to claim 1 , wherein the composition forms a cured product having a value of b* in the CIE L* a* b* color space defined in JIS Z 8730 of not more than 2.0, before and after being heated at 240° C. for 500 hours.

10. A cured product, formed by curing the curable silicone composition according to claim 1 .

11. An optical semiconductor device comprising an optical semiconductor element sealed, covered or adhered by the curable silicone composition according to claim 1 .

12. The optical semiconductor device according to claim 11 , wherein the optical semiconductor element is a light emitting diode.

13. The curable silicone composition according to claim 1 , wherein the content of component (A-2) is an amount such that a mass ratio of component (A-2) to component (A-1) is from 1/9 to 9/1.

14. The curable silicone composition according to claim 1 , wherein the alkenyl group in component (A) is a vinyl group and the aryl group in component (A) is a phenyl group.

15. The curable silicone composition according to claim 14 , wherein component (B) is present in an amount such that the silicon-bonded hydrogen atoms in component (B) is from 0.5 to 5 moles per 1 mole of the alkenyl groups in component (A).

16. The curable silicone composition according to claim 15 , wherein a content of aryl groups in component (C) is at least 10 mol % based on a total of silicon-bonded organic groups.

Assignees

• Dow Corning Toray Co Ltd
• Dow Corning

Inventors

• Okawa Tadashi
• Iimura Tomohiro
• INAGAKI Sawako
• Mizukami Mayumi
• Suto Michitaka
• Furukawa Haruhiko
• Schmidt Randall G
• Tomasik Adam C

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• C07F7/0838

  Compounds with one or more Si-O-Si sequences (compounds with a ring containing only alternating Si and O atoms, i.e. cyclosilanes C07F7/21) · CPC title

• C09K11/0883

  Arsenides; Nitrides; Phosphides · CPC title

• C08L83/00

  Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers · CPC title