Resin for blister package and preparation method thereof

Patent metadata

Field	Value
Publication number	US-9598519-B2
Application number	US-201314758021-A
Country	US
Kind code	B2
Filing date	Dec 17, 2013
Priority date	Jan 8, 2013
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

The present invention relates to a resin for a blister package and a preparation method thereof. The resin for a blister package according to the present invention is a water-soluble resin which can minimize a hazard to a human body due to residual of a solvent, and particularly, a resin layer formed by using the resin can show an excellent heat seal property and is hardly deformed at the heat seal temperature condition.

First claim

The invention claimed is:

1. A resin for blister package, prepared from a composition including:
monomer compounds including 53 to 60 weight % of methyl methacrylate, 30 to 35 weight % of ethyl acrylate, 3.5 to 6 weight % of acrylic acid, and 1.5 to 6 weight % of methacrylic acid;
a polymerization initiator; and
a solvent.

2. The resin for a blister package according to claim 1 , wherein the composition includes 0.01 to 1 parts by weight of the polymerization initiator and 5 to 20 parts by weight of the solvent per 100 parts by weight of the monomer compounds.

3. The resin for blister package according to claim 1 , wherein the polymerization initiator is one or more compounds selected from the group consisting of tert-butyl peroxybenzoate, tert-butyl hydroperoxide, and di-tert-butyl peroxide.

4. The resin for blister package according to claim 1 , wherein the solvent is diethylene glycol monoethylether, dipropylene glycol methylether, water, or a mixture thereof.

5. The resin for blister package according to claim 1 , wherein the resin has a weight average molecular weight of 4000 to 30,000, an acid value of 35 to 105 KOH mg/g, and a glass transition temperature of 45 to 65° C.

6. A preparation method of a resin for a blister package, including:
a step of carrying out continuous bulk polymerization of a composition including monomer compounds, a polymerization initiator, and a solvent at a temperature of 150 to 250° C.
wherein the monomer compounds includes 53 to 60 weight % of methyl methacrylate, 30 to 35 weight % of ethyl acrylate, 3.5 to 6 weight % of acrylic acid, and 1.5 to 6 weight % of methacrylic acid.

7. A heat adhesive resin layer for a blister package, prepared from the composition including the resin for a blister package according to claim 1 .

Assignees

• Hanwha Chemical Corp

Inventors

• Choi Jeong Hyun
• Kang Sin-Won
• Kong Jung Ho
• Cho Sang Hyun

Classifications

• A22C7/00 Primary

  Apparatus for pounding, forming, or pressing meat, sausage-meat, or meat products {(meat patty moulding devices for domestic use A47J43/20; ham boilers A47J27/20)} · CPC title

• A47J43/20

  Shapes for preparing foodstuffs, e.g. meat-patty moulding devices {, pudding moulds} · CPC title

• C09J133/08

  Homopolymers or copolymers of acrylic acid esters · CPC title

• C09J133/12

  Homopolymers or copolymers of methyl methacrylate · CPC title

• C08F220/14 Primary

  Methyl esters {, e.g. methyl (meth)acrylate} · CPC title