Electronic device with printed circuit board noise reduction using elastomeric damming and damping structures

Patent metadata

Field	Value
Publication number	US-9596756-B2
Application number	US-201314020059-A
Country	US
Kind code	B2
Filing date	Sep 6, 2013
Priority date	Sep 6, 2013
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.

First claim

What is claimed is:

1. Apparatus, comprising:
an electronic device housing;
a printed circuit board in the electronic device housing, wherein the printed circuit board has first and second opposing surfaces;
an integrated circuit mounted on the first surface of the printed circuit board;
an electrical component adjacent to the integrated circuit on the first surface of the printed circuit board;
underfill between the integrated circuit and the first surface of the printed circuit board;
elastomeric material between the underfill and the electrical component that prevents the underfill from reaching the electrical component; and
additional elastomeric material between the electronic device housing and the second surface of the printed circuit board, wherein the additional elastomeric material is in direct contact with the electronic device housing and the second surface of the printed circuit board.

2. Apparatus, comprising:
a printed circuit board;
a capacitor soldered to the printed circuit board;
an integrated circuit soldered to the printed circuit board;
underfill having a portion that is between the integrated circuit and the printed circuit board that secures the integrated circuit to the printed circuit board; and
a material that is less stiff than the underfill that blocks the underfill from reaching the capacitor.

3. The apparatus defined in claim 2 wherein the material comprises an elastomeric material.

4. The apparatus defined in claim 3 wherein the elastomeric material comprises encapsulant that covers the capacitor.

5. The apparatus defined in claim 4 wherein the elastomeric material has a portion that is located under the capacitor and between the capacitor and the printed circuit board.

6. The apparatus defined in claim 5 wherein the underfill contacts the elastomeric material.

7. The apparatus defined in claim 1 , wherein the additional elastomeric material between the electronic device housing and the second surface of the printed circuit board is formed in a gap between the electronic device housing and the printed circuit board and at least one additional electronic component is mounted in the gap.

8. The apparatus defined in claim 7 , further comprising:
a display mounted in the electronic device housing, wherein the electronic device housing has first and second opposing surfaces, the additional elastomeric material directly contacts the first surface of the electronic device housing, and the second surface of the electronic device housing forms an external surface of the apparatus.

Assignees

• Apple Inc

Inventors

• Rainer Amanda R
• Duke Connor R
• Bilanski James W
• Thoma Jeffrey M
• Eng Michael
• Li Mingzhe
• Yoo Sung Woo
• Lara-Pena Miguel Alejandro
• Foo Weng Choy
• Poulain Kieran

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012 Primary

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title

• H05K2201/10977

  Encapsulated connections · CPC title

• H05K2201/2045

  Protection against vibrations · CPC title