Method for forming multilayer film including oxide semiconductor film and method for manufacturing semiconductor device

Patent metadata

Field	Value
Publication number	US-9595435-B2
Application number	US-201314055970-A
Country	US
Kind code	B2
Filing date	Oct 17, 2013
Priority date	Oct 19, 2012
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

To form an oxide semiconductor film with a low density of localized levels. To improve electric characteristics of a semiconductor device including the oxide semiconductor. After oxygen is added to an oxide film containing In or Ga in contact with an oxide semiconductor film functioning as a channel, heat treatment is performed to make oxygen in the oxide film containing In or Ga transfer to the oxide semiconductor film functioning as a channel, so that the amount of oxygen vacancies in the oxide semiconductor film is reduced. Further, an oxide film containing In or Ga is formed, oxygen is added to the oxide film, an oxide semiconductor film is formed over the oxide film, and then heat treatment is performed.

First claim

What is claimed is:

1. A method for manufacturing a semiconductor device, comprising the steps of:
forming a first oxide semiconductor layer;
adding oxygen to the first oxide semiconductor layer by using an ion implantation method, an ion doping method, or plasma treatment;
forming a second oxide semiconductor layer over the first oxide semiconductor layer after adding the oxygen; and
performing heat treatment after forming the second oxide semiconductor layer so that a part of oxygen in the first oxide semiconductor layer is transferred to the second oxide semiconductor layer.

2. The method for manufacturing the semiconductor device according to claim 1 , wherein the second oxide semiconductor layer comprises one of indium, gallium, and zinc.

3. The method for manufacturing the semiconductor device according to claim 1 , further comprising the step of:
forming an insulating layer under the first oxide semiconductor layer before forming the first oxide semiconductor layer,
wherein oxygen is added to the insulating layer in the step of adding the oxygen.

4. The method for manufacturing the semiconductor device according to claim 1 , further comprising the steps of:
forming a first gate electrode;
forming a first insulating layer over the first gate electrode before forming the first oxide semiconductor layer; and
forming a source electrode and a drain electrode electrically connected to the second oxide semiconductor layer,
wherein the first gate electrode overlaps with the second oxide semiconductor layer.

5. The method for manufacturing the semiconductor device according to claim 4 , further comprising the steps of:
forming a second insulating layer over the second oxide semiconductor layer, the source electrode, and the drain electrode; and
forming a second gate electrode over the second insulating layer,
wherein the second gate electrode overlaps with the second oxide semiconductor layer.

6. The method for manufacturing the semiconductor device according to claim 1 , further comprising the steps of:
forming a source electrode and a drain electrode electrically connected to the second oxide semiconductor layer,
forming an insulating layer over the second oxide semiconductor layer, the source electrode, and the drain electrode; and
forming a gate electrode over the insulating layer;
wherein the gate electrode overlaps with the second oxide semiconductor layer.

7. The method for manufacturing the semiconductor device according to claim 1 , wherein the first oxide semiconductor layer comprises one of indium, gallium, and zinc.

8. The method for manufacturing the semiconductor device according to claim 1 , wherein an amount of the oxygen added to the first oxide semiconductor layer is greater than or equal to 5×10 14 /cm 2 and less than or equal to 5×10 16 /cm 2 .

9. A method for manufacturing a semiconductor device, comprising the steps of:
forming a first oxide semiconductor layer;
forming a second oxide semiconductor layer over the first oxide semiconductor layer;
adding oxygen to the second oxide semiconductor layer by using an ion implantation method, an ion doping method, or plasma treatment; and
performing heat treatment after adding the oxygen so that a part of oxygen in the second oxide semiconductor layer is transferred to the first oxide semiconductor layer.

10. The method for manufacturing the semiconductor device according to claim 9 , wherein the first oxide semiconductor layer comprises one of indium, gallium, and zinc.

11. The method for manufacturing the semiconductor device according to claim 9 , further comprising the steps of:
forming a first gate electrode;
forming a first insulating layer over the first gate electrode before forming the first oxide semiconductor layer; and
forming a source electrode and a drain electrode electrically connected to the first oxide semiconductor layer,
wherein the first gate electrode overlaps with the first oxide semiconductor layer.

12. The method for manufacturing the semiconductor device according to claim 11 , further comprising the steps of:
forming a second insulating layer over the second oxide semiconductor layer, the source electrode, and the drain electrode; and
forming a second gate electrode over the second insulating layer,
wherein the second gate electrode overlaps with the first oxide semiconductor layer.

13. The method for manufacturing the semiconductor device according to claim 9 , further comprising the steps of:
forming a source electrode and a drain electrode electrically connected to the first oxide semiconductor layer,
forming an insulating layer over the second oxide semiconductor layer, the source electrode, and the drain electrode; and
forming a gate electrode over the insulating layer;
wherein the gate electrode overlaps with the first oxide semiconductor layer.

14. The method for manufacturing the semiconductor device according to claim 9 , wherein the second oxide semiconductor layer comprises one of indium, gallium, and zinc.

15. The method for manufacturing the semiconductor device according to claim 9 , wherein an amount of the oxygen added to the first oxide semiconductor layer is greater than or equal to 5×10 14 /cm 2 and less than or equal to 5×10 16 /cm 2 .

16. A method for manufacturing a semiconductor device, comprising the steps of:
forming a first oxide semiconductor layer;
adding oxygen to the first oxide semiconductor layer by using an ion implantation method, an ion doping method, or plasma treatment;
forming a second oxide semiconductor layer over the first oxide semiconductor layer after adding the oxygen;
forming a third oxide semiconductor layer over the second oxide semiconductor layer; and
performing heat treatment after forming the second oxide semiconductor layer so that a part of oxygen in the first oxide semiconductor layer is transferred to the second oxide semiconductor layer.

17. The method for manufacturing the semiconductor device according to claim 16 , wherein the second oxide semiconductor layer comprises one of indium, gallium, and zinc.

18. The method for manufacturing the semiconductor device according to claim 16 , further comprising the step of:
forming an insulating layer under the first oxide semiconductor layer before forming the first oxide semiconductor layer,
wherein oxygen is added to the insulating layer in the step of adding the oxygen.

19. The method for manufacturing the semiconductor device according to claim 16 , further comprising the steps of:
forming a first gate electrode;
forming a first insulating layer over the first gate electrode before forming the first oxide semiconductor layer; and
forming a source electrode and a drain electrode electrically connected to the second oxide semiconductor layer,
wherein the first gate electrode overlaps with the second oxide semiconductor layer.

20. The method for manufacturing the semiconductor device according to claim 19 , further comprising the steps of:
forming a second insulating layer over the third oxide semiconductor layer, the source electrode, and the drain electrode; and
forming a second gate electrode over the second insulating layer,
wherein the second gate electrode overlaps with the second oxide semiconductor layer.

21. The method for manufacturing the semiconductor device according to claim 16 , further comprising the steps of:
forming a source electrode and a drain electrode electrically connected to the second oxide semiconductor

Assignees

• Semiconductor Energy Lab

Inventors

• Tsubuku Masashi
• Watanabe Ryosuke
• Ishihara Noritaka
• Oota Masashi

Classifications

• H10P14/3434

  being oxide semiconductor materials (Group IIB-VIA semiconductor materials H10P14/3424) · CPC title

• H10P14/3426

  Oxides · CPC title

• H10P14/3248

  consisting of two layers · CPC title

• H10P14/3238

  being insulating materials · CPC title

• H10P14/3234

  being oxide semiconducting materials (Group IIB-VIA semiconductors H10P14/3224) · CPC title